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公开(公告)号：US09968927B2
公开(公告)日：2018-05-15
申请号：US14719991
申请日：2015-05-22
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Yi-Shao Liu , Emerson Cheng , Yi-Hsien Chang , Chun-Ren Cheng , Ching-Ray Chen , Alex Kalnitsky , Allen Timothy Chang
IPC: H01L27/12 , G01N27/414 , G01N21/64 , B01L3/00
CPC classification number: B01L3/50 , B01L3/502715 , B01L2300/0636 , B01L2300/0645 , B01L2300/0654 , B01L2300/0816 , B01L2300/0887 , B01L2300/168 , B01L2300/1827 , B01L2400/0424 , G01N21/6428 , G01N21/6454 , G01N21/648 , G01N27/414 , G01N2021/6482 , H01L27/1203 , H01L27/1211
Abstract: The present disclosure relates to an integrated chip having an integrated optical bio-sensor, and an associated method of fabrication. In some embodiments, the integrated optical bio-sensor has a sensing device arranged within a semiconductor substrate. An optical waveguide structure is located over a first side of the semiconductor substrate at a position over the sensing device. A dielectric structure is disposed onto the optical waveguide structure at a position that separates the optical waveguide structure from a sample retention area configured to receive a sample solution.
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公开(公告)号：US20170233249A1
公开(公告)日：2017-08-17
申请号：US15585805
申请日：2017-05-03
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Hsin-Ting Huang , Hsiang-Fu Chen , Wen-Chuan Tai , Shao-Chi Yu , Chia-Ming Hung , Allen Timothy Chang , Bruce C.S. Chou , Chin-Min Lin
CPC classification number: B81C1/00285 , B81B7/02 , B81B2201/0235 , B81B2201/0242 , B81B2207/095 , B81B2207/096 , B81C2203/0145
Abstract: The present disclosure relates to a method of forming a micro-electro mechanical system (MEMs) structure. In some embodiments, the method may be performed by providing a device substrate having a first MEMS device and a second MEMS device, and by providing a capping structure having a first cavity and a second cavity. The capping structure is bonded to the device substrate, such that the first cavity is arranged over the first MEMS device and the second cavity is arranged over the second MEMS device. A first pressure is established within the first cavity and the second cavity. A vent is selectively etched within the capping structure to change the first pressure within the second cavity to a second pressure, which is different from the first pressure.
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Patent Agency Ranking
公开(公告)号：US11934239B2
公开(公告)日：2024-03-19
申请号：US17543542
申请日：2021-12-06
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Jui-Cheng Huang , Yi-Hsing Hsiao , Yu-Jie Huang , Tsung-Tsun Chen , Allen Timothy Chang
Abstract: In an embodiment, a circuit includes: an error amplifier; a temperature sensor, wherein the temperature sensor is coupled to the error amplifier; a discrete time controller coupled to the error amplifier, wherein the discrete time controller comprises digital circuitry; a multiple bits quantizer coupled to the discrete time controller, wherein the multiple bits quantizer produces a digital code output; and a heating array coupled to the multiple bits quantizer, wherein the heating array is configured to generate heat based on the digital code output.
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公开(公告)号：US20230384258A1
公开(公告)日：2023-11-30
申请号：US18232318
申请日：2023-08-09
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Tsung-Tsun CHEN , Allen Timothy Chang , Jui-Cheng Huang
IPC: G01N27/414 , B01L3/00
CPC classification number: G01N27/4145 , B01L3/502715 , B01L2300/0645 , B01L2200/06 , B01L2400/0415
Abstract: In an embodiment, a device includes: an electrode configured to change a contact angle of a liquid droplet above the electrode when a first voltage is applied to the electrode; a sensing film overlaying the electrode, wherein the electrode is configured for assessment of a state of the liquid droplet based on a second voltage sensed at the electrode; a reference electrode above the electrode, the reference electrode configured to provide a reference voltage; and a microfluidic channel between the electrode and the reference electrode, wherein the microfluidic channel is configured to manipulate the liquid droplet using the electrode.
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公开(公告)号：US09856139B2
公开(公告)日：2018-01-02
申请号：US15585805
申请日：2017-05-03
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Hsin-Ting Huang , Hsiang-Fu Chen , Wen-Chuan Tai , Shao-Chi Yu , Chia-Ming Hung , Allen Timothy Chang , Bruce C. S. Chou , Chin-Min Lin
CPC classification number: B81C1/00285 , B81B7/02 , B81B2201/0235 , B81B2201/0242 , B81B2207/095 , B81B2207/096 , B81C2203/0145
Abstract: The present disclosure relates to a method of forming a micro-electro mechanical system (MEMs) structure. In some embodiments, the method may be performed by providing a device substrate having a first MEMS device and a second MEMS device, and by providing a capping structure having a first cavity and a second cavity. The capping structure is bonded to the device substrate, such that the first cavity is arranged over the first MEMS device and the second cavity is arranged over the second MEMS device. A first pressure is established within the first cavity and the second cavity. A vent is selectively etched within the capping structure to change the first pressure within the second cavity to a second pressure, which is different from the first pressure.
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公开(公告)号：US09845236B2
公开(公告)日：2017-12-19
申请号：US14645826
申请日：2015-03-12
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Shao-Chi Yu , Chia-Ming Hung , Hsin-Ting Huang , Hsiang-Fu Chen , Allen Timothy Chang , Wen-Chuan Tai
CPC classification number: B81C1/00269 , B81B7/02 , B81B2201/0214 , B81B2201/0264 , B81B2201/0278 , B81B2207/096 , B81C2203/0109 , G01K13/00 , G01L9/0073 , G01L19/0092 , G01N27/221 , G01N2027/222
Abstract: The present disclosure is directed to a monolithic MEMS (micro-electromechanical system) platform having a temperature sensor, a pressure sensor and a gas sensor, and an associated method of formation. In some embodiments, the MEMS platform includes a semiconductor substrate having one or more transistor devices and a temperature sensor. A dielectric layer is disposed over the semiconductor substrate. A cavity is disposed within an upper surface of the dielectric layer. A MEMS substrate is arranged onto the upper surface of the dielectric layer and has a first section and a second section. A pressure sensor has a first pressure sensor electrode that is vertically separated by the cavity from a second pressure sensor electrode within the first section of a MEMS substrate. A gas sensor has a polymer disposed between a first gas sensor electrode within the second section of a MEMS substrate and a second gas sensor electrode.
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公开(公告)号：US09656857B2
公开(公告)日：2017-05-23
申请号：US14557513
申请日：2014-12-02
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Hsin-Ting Huang , Hsiang-Fu Chen , Wen-Chuan Tai , Shao-Chi Yu , Chia-Ming Hung , Allen Timothy Chang , Bruce C. S. Chou , Chin-Min Lin
IPC: B81B7/02
CPC classification number: B81C1/00285 , B81B7/02 , B81B2201/0235 , B81B2201/0242 , B81B2207/095 , B81B2207/096 , B81C2203/0145
Abstract: Some embodiments relate to multiple MEMS devices that are integrated together on a single substrate. A device substrate comprising first and second micro-electro mechanical system (MEMS) devices is bonded to a capping structure. The capping structure comprises a first cavity arranged over the first MEMS device and a second cavity arranged over the second MEMS device. The first cavity is filled with a first gas at a first gas pressure. The second cavity is filled with a second gas at a second gas pressure, which is different from the first gas pressure. A recess is arranged within a lower surface of the capping structure. The recess abuts the second cavity. A vent is arranged within the capping structure. The vent extends from a top of the recess to the upper surface of the capping structure. A lid is arranged within the vent and configured to seal the second cavity.
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