公开(公告)号：US20240312944A1

公开(公告)日：2024-09-19

申请号：US18604807

申请日：2024-03-14

Applicant: TE Connectivity Solutions GmbH

Inventor： Kaspar Jenni ,  Ismael Brunner ,  Thomas Arnold

IPC: H01L23/00 ,  B81B3/00

CPC classification number: H01L24/29 ,  B81B3/0021 ,  H01L24/32 ,  H01L24/83 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81B2203/0127 ,  H01L2224/26145 ,  H01L2224/32225 ,  H01L2224/8385

Abstract: A semiconductor die includes a top side, a bottom side opposite to the top side, and a side surface connecting the top side and the bottom side. The bottom side and a part of the side surface are attachable to a solid structure by a die attach material. The side surface has an attachment control element defining an attachment zone contacted by the die attach material and/or an exclusion zone that is not contacted by the die attach material.

公开(公告)号：US20240286891A1

公开(公告)日：2024-08-29

申请号：US18508323

申请日：2023-11-14

Applicant: HS Vision Ltd.

Inventor： Alexander MacDonald

IPC: B81B7/00 ,  B81C1/00 ,  G01L9/00

CPC classification number: B81B7/0048 ,  B81C1/00325 ,  G01L9/0072 ,  B81B2201/0264 ,  B81B2201/0271 ,  B81B2203/0127 ,  B81B2203/04 ,  B81C2201/0132

Abstract: Disclosed are lenses and eyewear that provide the user with both forward vision and rearward vision by means of an angled, reflective portion of the lens.

公开(公告)号：US12055452B2

公开(公告)日：2024-08-06

申请号：US18475515

申请日：2023-09-27

Applicant: MKS Instruments, Inc.

Inventor： Gerardo A. Brucker

IPC: G01L27/00 ,  B81B3/00 ,  G01L9/00 ,  G01L9/12 ,  G01L13/02 ,  G01L21/12

CPC classification number: G01L21/12 ,  B81B3/0018 ,  G01L9/0055 ,  G01L13/025 ,  G01L27/005 ,  B81B2201/0264

Abstract: A load lock pressure gauge comprises a housing configured to be coupled to a load lock vacuum chamber. The housing supports an absolute vacuum pressure sensor that provides instantaneous high vacuum pressure signal over a range of high vacuum pressures and a differential diaphragm pressure sensor that provides an instantaneous differential pressure signal between load lock pressure and ambient pressure. The housing further supports an absolute ambient pressure sensor. A low vacuum absolute pressure is computed from the instantaneous differential pressure signal and the instantaneous ambient pressure signal. A controller in the housing is able to recalibrate the differential diaphragm pressure sensor based on measured voltages of the sensor and a measured ambient pressure during normal operation of the pressure gauge with routine cycling of pressure in the load lock.

公开(公告)号：US20240116750A1

公开(公告)日：2024-04-11

申请号：US18480936

申请日：2023-10-04

Applicant: ROHM CO., LTD.

Inventor： Takashi NAIKI

IPC: B81B7/00

CPC classification number: B81B7/0048 ,  B81B2201/0264 ,  B81B2207/07

Abstract: A MEMS module includes: a substrate; a semiconductor chip in which a MEMS including a mechanical movable portion is formed; and a soft member that is interposed between the substrate and the semiconductor chip and has a lower hardness than the substrate, wherein the soft member is disposed in a partial region of a first main surface of the semiconductor chip facing the substrate.

公开(公告)号：US11912565B2

公开(公告)日：2024-02-27

申请号：US17282331

申请日：2019-12-17

Applicant: Robert Bosch GmbH

Inventor： Christoph Hermes ,  Kerrin Doessel ,  Thomas Friedrich

IPC: B81B7/04 ,  G01L9/00

CPC classification number: B81B7/04 ,  G01L9/0073 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/053

Abstract: A micromechanical sensor unit, including: a substrate and an edge layer, which is situated on the substrate and laterally frames an inner area above the substrate; at least one diaphragm, which spans the inner area and forms a covered cavity above the substrate; at least one support point, which is situated between the substrate and the diaphragm inside the cavity and attaches the diaphragm to the edge layer and/or to the at least one support point. The support point separates the diaphragm into at least one measuring area that is movable through force action and at least one reference area that is not movable through force action. The substrate and the diaphragm, inside the cavity, include electrodes, which face one another in the measuring area and the reference area.

公开(公告)号：US11905164B2

公开(公告)日：2024-02-20

申请号：US17468423

申请日：2021-09-07

Applicant: UPBEAT TECHNOLOGY Co., Ltd

Inventor： Hsien-Lung Ho ,  Da-Ming Chiang ,  Chung-Chieh Chen

IPC: B81B3/00

CPC classification number: B81B3/0021 ,  B81B2201/0264 ,  B81B2203/0118 ,  B81B2203/0127

Abstract: A micro-electro-mechanical system acoustic sensor, a micro-electro-mechanical system package structure and a method for manufacturing the same are provided. The micro-electro-mechanical system acoustic sensor comprises a substrate, a cantilever structure and a diaphragm sensor. The cantilever structure is formed on the substrate, and comprises a fixed end and a free cantilever portion extended from the fixed end. The free cantilever portion comprises a free end. The free end and the fixed end are respectively at opposing sides of the free cantilever portion. The free cantilever portion is capable of generating a vibration wave in an empty space. The diaphragm sensor is formed on the substrate, and comprises a diaphragm film, a back plate, and at least one electrical contact point. The back plate and the diaphragm film have a first empty gap there between. The empty space and the first empty gap communicate to each other.

公开(公告)号：US11892465B2

公开(公告)日：2024-02-06

申请号：US17667180

申请日：2022-02-08

Applicant: Movella Inc.

Inventor： Sanjay Bhandari ,  Giovanni Bellusci

IPC: G01P15/08 ,  G01P21/00 ,  B81B7/00 ,  G01P15/18 ,  B81B7/02

CPC classification number: G01P15/08 ,  B81B7/008 ,  B81B7/02 ,  G01P15/18 ,  G01P21/00 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  G01P2015/0868

Abstract: A MEMS device includes a first MEMS sensor associated with a first spatial plane and a second MEMS sensor is associated with a spatial second plane not co-planar with the first spatial plane, wherein the first MEMS sensor is configured to provide a first interrupt and a first data in response to a physical perturbation, wherein the second MEMS sensor is configured to provide a second interrupt and second data in response to the physical perturbation, and a controller configured to receive the first interrupt at a first time and the second interrupt at a second time different from the first time, wherein the controller is configured to determine a latency between the first time and the second time, and wherein the controller is configured to determine motion data in response to the first data, to the second data, and to the latency.

公开(公告)号：US20240015447A1

公开(公告)日：2024-01-11

申请号：US18371488

申请日：2023-09-22

Applicant: InvenSense, Inc.

Inventor： Roberto Brioschi ,  Kazunori Hayata ,  Jr-Cheng Yeh ,  Dinesh Kumar Solanki

IPC: H04R19/04 ,  B81B7/00 ,  B81C1/00 ,  H04R1/04 ,  H04R3/00

CPC classification number: H04R19/04 ,  B81B7/0064 ,  B81C1/00333 ,  H04R1/04 ,  H04R3/00 ,  B81B2201/0257 ,  H04R2201/003 ,  B81B2201/0292 ,  B81B2201/0271 ,  B81B2203/0127 ,  B81B2207/015 ,  B81C2203/0109 ,  B81B2201/0264

Abstract: A MEMS sensor includes a through hole to allow communication with an external environment, such as to send or receive acoustic signals or to be exposed to the ambient environment. In addition to the information that is being measured, light energy may also enter the environment of the sensor via the through hole, causing short-term or long-term effects on measurements or system components. A light mitigating structure is formed on or attached to a lid of the MEMS die to absorb or selectively reflect the received light in a manner that limits effects on the measurements or interest and system components.

公开(公告)号：US11867584B2

公开(公告)日：2024-01-09

申请号：US17467251

申请日：2021-09-05

Applicant: pSemi Corporation

Inventor： Vishnu Srinivasan ,  Ion Opris ,  Keith Bargroff

IPC: G01L9/12 ,  G01L9/02 ,  H03M3/00 ,  B81B7/00

CPC classification number: G01L9/02 ,  B81B7/007 ,  B81B7/0058 ,  H03M3/414 ,  H03M3/458 ,  B81B2201/0264 ,  H03M3/438

Abstract: Methods and devices to mitigate time varying impairments in sensors are described. The application of such methods and devices to pressure sensors facing time varying parasitic capacitances due to water droplets is detailed. Benefits of auto-zeroing technique as adopted in disclosed devices is also described.

公开(公告)号：US11851324B2

公开(公告)日：2023-12-26

申请号：US17291251

申请日：2019-12-13

Applicant: Robert Bosch GmbH

Inventor： Christoph Hermes ,  Hans Artmann ,  Heribert Weber ,  Peter Schmollngruber ,  Thomas Friedrich ,  Tobias Joachim Menold ,  Mawuli Ametowobla

IPC: B81C1/00

CPC classification number: B81C1/00047 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0315 ,  B81C2203/0145

Abstract: A method for sealing entries in a MEMS element. The method includes: providing a functional layer having a functional region; producing a cavity underneath the functional region of the functional layer with the aid of a first entry outside of the functional region of the functional layer; sealing the first entry; producing a second entry to the cavity outside of the functional region of the functional layer; melting sealing material in the region of the second entry; and cooling off the melted sealing material to seal the second entry.