公开(公告)号：US20070176626A1

公开(公告)日：2007-08-02

申请号：US11622727

申请日：2007-01-12

Applicant: Reinhold Bayerer ,  Markus Thoben

Inventor： Reinhold Bayerer ,  Markus Thoben

IPC: G01R31/36

CPC classification number: G01R19/0092 ,  G01K7/30 ,  H01L23/34 ,  H01L24/34 ,  H01L27/0248 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2224/37099

Abstract: A current/temperature measurement method using parasitic components in an electronic power circuit is disclosed. The measured values derived from these parasitic components with inadequate precision are first of all compensated for, in terms of their current/temperature or voltage dependence, during the production process. The evaluation which takes place during operation involves compensating for the temperature or current dependence of the sensor components using two measurements which are linearly independent of one another and appropriate arithmetic operations in an evaluation unit.

Abstract translation: 公开了一种使用电子电路中的寄生元件的电流/温度测量方法。 从这些具有不足精度的寄生分量得到的测量值首先在生产过程中根据其当前/温度或电压依赖性进行补偿。 在操作期间进行的评估包括使用彼此线性相关的两个测量值和评估单元中适当的算术运算来补偿传感器部件的温度或电流依赖性。

公开(公告)号：US06812559B2

公开(公告)日：2004-11-02

申请号：US10450202

申请日：2003-11-07

Applicant: Gerhard Palm ,  Yehia Tadros ,  Markus Thoben

Inventor： Gerhard Palm ,  Yehia Tadros ,  Markus Thoben

IPC: H01L2352

CPC classification number: H01L23/3735 ,  H01L2224/29339 ,  H01L2224/8384 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00014

Abstract: An electronic power module includes at least one electronic power device, a DCB ceramic substrate, a heat sink and at least one additional thermal capacitance. The electronic power devices are connected by a sintered layer on their underside to an upper copper layer of the DCB ceramic substrate. The upper copper layer of the DCB ceramic substrate is structured into copper conductor tracks for electrically contacting the power devices. The lower copper layer of the DCB ceramic substrate is connected by a sintered layer to a heat sink. The upper sides of the power devices are connected by a sintered layer to an addition thermal capacitance.

Abstract translation: 电子功率模块包括至少一个电子功率器件，DCB陶瓷衬底，散热器和至少一个额外的热电容。 电子功率器件通过其下侧的烧结层连接到DCB陶瓷衬底的上部铜层。 DCB陶瓷基板的上铜层被构造成用于电接触功率器件的铜导体轨迹。 DCB陶瓷基板的下铜层通过烧结层连接到散热器。 功率器件的上侧通过烧结层连接到加法热电容。