Abstract:
A computer system includes a controller coupled to a plurality of memory modules each of which includes a memory hub and a plurality of memory devices divided into a plurality of ranks. The memory hub is operable to configure the memory module to simultaneously address any number of ranks to operate in a high bandwidth mode, a high memory depth mode, or any combination of such modes.
Abstract:
Optically-coupled memory systems are disclosed. In one embodiment, a system memory includes a carrier substrate, and a controller attached to the carrier substrate and operable to transmit and receive optical signals, and first and second memory modules. The module substrate of the first memory module has an aperture formed therein, the aperture being operable to provide an optical path for optical signals between the controller and an optical transmitter/receiver unit of the second memory module. Thus, the system memory provides the advantages of “free space” optical connection in a compact arrangement of memory modules. In an alternate embodiment, the first memory module includes a beam splitter attached to the module substrate proximate the aperture. In another embodiment, the first and second memory modules are staged on the carrier substrate to provide an unobstructed path for optical signals. In another embodiment, the optical transmitter/receiver unit projects outwardly from the module substrate to provide an unobstructed path for optical signals.
Abstract:
A semiconductor device (such as a DRAM) includes a memory array that has dynamic memory cells. In a self refresh test mode, a self refresh test mode controller monitors and/or controls various blocks and internal signals in the semiconductor device. The self refresh test mode controller may communicate with a remote testing device through various conductors including one or more DQ lines and/or one or more address lines.
Abstract:
An improved technique and associated apparatus for timing calibration of a logic device is provided. A calibration test pattern is transferred to a logic device first at a data rate slower than normal operating speed to ensure correct capture of the pattern at the device to be calibrated. Once the pattern is correctly captured and stored, the test pattern is transmitted to the logic device at the normal operating data rate to perform timing calibration. The improved technique and apparatus permits the use of any pattern of bits as a calibration test pattern, programmable by the user or using easily-interchangeable hardware.
Abstract:
A semiconductor die assembly employing a voltage reference plane structure electrically isolated from, but in immediate proximity to, leads of a lead frame to which the die is electrically connected. A non-conductive adhesive or an adhesively-coated dielectric film is used to position the voltage reference plane on the leads. The voltage reference plane is electrically connected to a ground or other reference potential pin of the die through a connection to one of the leads. The assembly is encapsulated, preferably by transfer-molding of a filled polymer. More than one discrete voltage reference plane structure may be employed, for example, when the package is of an LOC configuration with two rows of leads, each having a voltage reference plane secured thereto, or a single voltage reference plane including major portions adhered to leads and interposed connection portions may be applied to all of the leads of an assembly.
Abstract:
An improved technique and associated apparatus for timing calibration of a logic device is provided. A calibration test pattern is transferred to a logic device first at a data rate slower than normal operating speed to ensure correct capture of the pattern at the device to be calibrated. Once the pattern is correctly captured and stored, the test pattern is transmitted to the logic device at the normal operating data rate to perform timing calibration. The improved technique and apparatus permits the use of any pattern of bits as a calibration test pattern, programmable by the user or using easily-interchangeable hardware.
Abstract:
A semiconductor package for vertically surface mounting to a printed circuit board having retention apparatus for holding the package thereto.
Abstract:
A synchronous dynamic random access memory (“SDRAM”) operates with matching read and write latencies. To prevent data collision at the memory array, the SDRAM includes interim address and interim data registers that temporarily store write addresses and input data until an available interval is located where no read data or read addresses occupy the memory array. During the available interval, data is transferred from the interim data register to a location in the memory array identified by the address in the interim array register. In one embodiment, the SDRAM also includes address and compare logic to prevent reading incorrect data from an address to which the proper data has not yet been written. In another embodiment, a system controller monitors commands and addresses and inserts no operation commands to prevent such collision of data and addresses.
Abstract:
An output buffer driver calibration circuit and method are disclosed. Pull-up and pull-down devices of the output buffer driver circuit are simultaneously driven and the resulting output voltage is compared to a predetermined reference voltage, and a control signal is generated which is used to adjust the strength of one of the pull-up and pull-down devices so that the drive strength of the two devices approaches equality.
Abstract:
A semiconductor device (such as a DRAM) includes a memory array that has dynamic memory cells. In a self refresh test mode, a self refresh test mode controller monitors and/or controls various blocks and internal signals in semiconductor device. The self refresh test mode controller may communicate with a remote testing device through various conductors including one or more DQ lines and/or one or more address lines. The self refresh test mode controller provides at least one or more of the following four functions: (1) the ability to control internal signals while in self refresh test mode; (2) the ability to monitor internal signals while in self refresh test mode; (3) the ability to put in a programmable delay, change the delay, or change internal timing while in self refresh test mode (add delay or make delay programmable, adjustable); (4) the ability to have the device do a device read in a self refresh test mode (the DQ pins may be used to read particular data on the row, while the column address is frozen). As examples, the following signals may be analyzed and acted upon by the self refresh test mode controller, or transmitted through the self refresh test mode controller to a remote testing device: (1) internal {overscore (RAS)} signals; (2) bits from refresh counter; (3) {overscore (RAS)} chain; and (4) equilibrate signals. As examples, the following are signals that may be received or produced by the self refresh test mode controller, and then analyzed and acted upon or transmitted through the self refresh test mode controller to one or more of the various blocks of the semiconductor device: (1) a signal overriding internal {overscore (RAS)} signals generated by self refresh circuitry (including initiating a row change or the rate at which row change occurs); (2) a signal that causes control of incrementing a refresh counter; (3) signals that alter internal time or programmable delay elements.