公开(公告)号：US20150104906A1

公开(公告)日：2015-04-16

申请号：US14580147

申请日：2014-12-22

Applicant: TriQuint Semiconductor, Inc.

Inventor： Tarak A. Railkar ,  Deep C. Dumka

IPC: H01L23/34 ,  H01L23/00 ,  H01L21/78

CPC classification number: H01L23/34 ,  H01L21/4882 ,  H01L21/78 ,  H01L23/373 ,  H01L23/3731 ,  H01L23/3732 ,  H01L23/3735 ,  H01L23/3736 ,  H01L24/83 ,  H01L2924/0002 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/00

Abstract: Methods and apparatuses for forming a package for high-power semiconductor devices are disclosed herein. A package may include a plurality of distinct thermal spreader layers disposed between a die and a metal carrier. Other embodiments are described and claimed.

Abstract translation: 本文公开了用于形成用于大功率半导体器件的封装的方法和装置。 包装可以包括设置在管芯和金属载体之间的多个不同的散热器层。 描述和要求保护其他实施例。