公开(公告)号：US20190088401A1

公开(公告)日：2019-03-21

申请号：US15818773

申请日：2017-11-21

Applicant: Unimicron Technology Corp.

Inventor： Chang-Fu Chen ,  Chun-Hao Chen ,  Kuan-Hsi Wu ,  Pi-Te Pan

IPC: H01F27/28 ,  H01F27/24 ,  H05K1/16 ,  H05K1/11

Abstract: A carrier structure includes a substrate, a first patterned circuit layer and at least one magnetic element. The substrate has a first surface and an opening passing through the substrate. The first patterned circuit layer is disposed on the first surface of the substrate and includes an annular circuit for generating an electromagnetic field. The magnetic element is disposed within the opening of the substrate, wherein the magnetic element couples the annular circuit and acts in response to the magnetic force of the electromagnetic field.

公开(公告)号：US20160343645A1

公开(公告)日：2016-11-24

申请号：US14799593

申请日：2015-07-15

Applicant: Unimicron Technology Corp.

Inventor： Pi-Te Pan ,  Chang-Fu Chen

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/49811 ,  H01L21/486 ,  H01L23/16 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/562 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/1533 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/37001

Abstract: Provided is a package structure including a circuit board, a plurality of first contact pads, a plurality of metal pillars and at least one chip. The first contact pads are disposed on the circuit board. The chip is disposed on one portion of the first contact pads. The metal pillars are disposed on the other portion of the first contact pads, where the chip is surrounded by the metal pillars. A method for manufacturing the package structure is also provided.

Abstract translation: 提供包括电路板，多个第一接触焊盘，多个金属柱和至少一个芯片的封装结构。 第一接触垫设置在电路板上。 芯片设置在第一接触垫的一部分上。 金属支柱设置在第一接触垫的另一部分上，其中芯片被金属支柱包围。 还提供了一种用于制造封装结构的方法。