Silver nanoparticle ink
    13.
    发明授权

    公开(公告)号:US10563079B2

    公开(公告)日:2020-02-18

    申请号:US15061618

    申请日:2016-03-04

    Abstract: An ink composition including a metal nanoparticle; at least one aromatic hydrocarbon solvent, wherein the at least one aromatic hydrocarbon solvent is compatible with the metal nanoparticles; at least one aliphatic hydrocarbon solvent, wherein the at least one aliphatic hydrocarbon solvent is compatible with the metal nanoparticles; wherein the ink composition has a metal content of greater than about 45 percent by weight, based upon the total weight of the ink composition; wherein the ink composition has a viscosity of from about 5 to about 30 centipoise at a temperature of about 20 to about 30° C. A process for preparing the ink composition. A process for printing the ink composition comprising pneumatic aerosol printing.

    PRINTING PROCESS AND SYSTEM
    14.
    发明申请

    公开(公告)号:US20200031040A1

    公开(公告)日:2020-01-30

    申请号:US16043256

    申请日:2018-07-24

    Abstract: Disclosed herein is a printing method and system for forming a three dimensional article. The method includes depositing a UV curable composition and applying UV radiation to cure the UV curable composition to form a 3D structure. The method includes depositing a conductive metal ink composition on a surface of the 3D structure and annealing the conductive metal ink composition at a temperature of less than the glass transition temperature of the UV curable composition to form a conductive trace on the 3D structure. The method includes depositing a second curable composition over the conductive trace; and curing second curable composition to form the 3D printed article having the conductive trace embedded therein.

    HYBRID NANOSILVER/LIQUID METAL INK COMPOSITION AND USES THEREOF

    公开(公告)号:US20200015354A1

    公开(公告)日:2020-01-09

    申请号:US16573590

    申请日:2019-09-17

    Abstract: The present disclosure is directed to a hybrid conductive ink including: silver nanoparticles and eutectic low melting point alloy particles, wherein a weight ratio of the eutectic low melting point alloy particles and the silver nanoparticles ranges from 1:20 to 1:5. Also provided herein are methods of forming an interconnect including a) depositing a hybrid conductive ink on a conductive element positioned on a substrate, wherein the hybrid conductive ink comprises silver nanoparticles and eutectic low melting point alloy particles, the eutectic low melting point alloy particles and the silver nanoparticles being in a weight ratio from about 1:20 to about 1:5; b) placing an electronic component onto the hybrid conductive ink; c) heating the substrate, conductive element, hybrid conductive ink and electronic component to a temperature sufficient i) to anneal the silver nanoparticles in the hybrid conductive ink and ii) to melt the low melting point eutectic alloy particles, wherein the melted low melting point eutectic alloy flows to occupy spaces between the annealed silver nanoparticles, d) allowing the melted low melting point eutectic alloy of the hybrid conductive ink to harden and fuse to the electronic component and the conductive element, thereby forming an interconnect. Electrical circuits including conductive traces and, optionally, interconnects formed with the hybrid conductive ink are also provided.

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