公开(公告)号：US20200015354A1

公开(公告)日：2020-01-09

申请号：US16573590

申请日：2019-09-17

Applicant: XEROX CORPORATION

Inventor： Naveen CHOPRA ,  Barkev Keoshkerian ,  Chad Steven Smithson ,  Kurt I. Halfyard ,  Michelle N. Chretien

IPC: H05K1/09 ,  C09D11/52 ,  C09D11/30 ,  C09D11/03 ,  H01L23/00 ,  H01L23/498

Abstract: The present disclosure is directed to a hybrid conductive ink including: silver nanoparticles and eutectic low melting point alloy particles, wherein a weight ratio of the eutectic low melting point alloy particles and the silver nanoparticles ranges from 1:20 to 1:5. Also provided herein are methods of forming an interconnect including a) depositing a hybrid conductive ink on a conductive element positioned on a substrate, wherein the hybrid conductive ink comprises silver nanoparticles and eutectic low melting point alloy particles, the eutectic low melting point alloy particles and the silver nanoparticles being in a weight ratio from about 1:20 to about 1:5; b) placing an electronic component onto the hybrid conductive ink; c) heating the substrate, conductive element, hybrid conductive ink and electronic component to a temperature sufficient i) to anneal the silver nanoparticles in the hybrid conductive ink and ii) to melt the low melting point eutectic alloy particles, wherein the melted low melting point eutectic alloy flows to occupy spaces between the annealed silver nanoparticles, d) allowing the melted low melting point eutectic alloy of the hybrid conductive ink to harden and fuse to the electronic component and the conductive element, thereby forming an interconnect. Electrical circuits including conductive traces and, optionally, interconnects formed with the hybrid conductive ink are also provided.

公开(公告)号：US12096554B2

公开(公告)日：2024-09-17

申请号：US17900309

申请日：2022-08-31

Applicant: XEROX CORPORATION

Inventor： Naveen Chopra ,  Barkev Keoshkerian ,  Chad Steven Smithson ,  Kurt I. Halfyard ,  Michelle N. Chretien

IPC: H05K1/05 ,  B60R1/06 ,  B60R1/25 ,  C09D11/02 ,  C09D11/03 ,  C09D11/037 ,  C09D11/30 ,  C09D11/322 ,  C09D11/38 ,  C09D11/52 ,  G02F1/153 ,  G02F1/155 ,  G02F1/157 ,  G02F1/161 ,  H01B1/02 ,  H01B1/16 ,  H01B1/22 ,  H01L23/00 ,  H01L23/498 ,  H05K1/09 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K1/097 ,  C09D11/03 ,  C09D11/037 ,  C09D11/30 ,  C09D11/52 ,  H01B1/02 ,  H01B1/16 ,  H01B1/22 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49894 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H05K3/3457 ,  H01L2224/29239 ,  H01L2224/32227 ,  H01L2224/75155 ,  H01L2224/8384 ,  H01L2924/1203 ,  H01L2924/1304 ,  H01L2924/14 ,  H05K3/3431 ,  H05K3/3485 ,  H05K3/3494 ,  H05K2201/0257

Abstract: The present disclosure is directed to a hybrid conductive ink including: silver nanoparticles and eutectic low melting point alloy particles, wherein a weight ratio of the eutectic low melting point alloy particles and the silver nanoparticles ranges from 1:20 to 1:5. Also provided herein are methods of forming an interconnect including a) depositing a hybrid conductive ink on a conductive element positioned on a substrate, wherein the hybrid conductive ink comprises silver nanoparticles and eutectic low melting point alloy particles, the eutectic low melting point alloy particles and the silver nanoparticles being in a weight ratio from about 1:20 to about 1:5; b) placing an electronic component onto the hybrid conductive ink; c) heating the substrate, conductive element, hybrid conductive ink and electronic component to a temperature sufficient i) to anneal the silver nanoparticles in the hybrid conductive ink and ii) to melt the low melting point eutectic alloy particles, wherein the melted low melting point eutectic alloy flows to occupy spaces between the annealed silver nanoparticles, d) allowing the melted low melting point eutectic alloy of the hybrid conductive ink to harden and fuse to the electronic component and the conductive element, thereby forming an interconnect. Electrical circuits including conductive traces and, optionally, interconnects formed with the hybrid conductive ink are also provided.

公开(公告)号：US11142671B2

公开(公告)日：2021-10-12

申请号：US16277664

申请日：2019-02-15

Applicant: XEROX CORPORATION

Inventor： Sarah J. Vella ,  Guiqin Song ,  Chad Steven Smithson ,  Kurt Halfyard

IPC: C09J9/02 ,  C09J163/00 ,  C08L33/12

Abstract: Provided herein is conductive adhesive composition comprising at least one epoxy resin, at least one polymer chosen from polyvinyl phenols and polyvinyl butyrals, at least one melamine resin, a plurality of metal nanoparticle shaving an average particle size ranging from about 0.5 nanometers to about 100 nanometers, and at least one solvent. Also provided herein is an electronic device comprising a substrate, conductive features disposed on the substrate, a conductive electrical component disposed over the conductive features, and a conductive adhesive composition disposed between the conductive features and the conductive electrical component. Further disclosed herein are methods of making a conductive adhesive composition.

公开(公告)号：US10947424B2

公开(公告)日：2021-03-16

申请号：US16277589

申请日：2019-02-15

Applicant: XEROX CORPORATION

Inventor： Sarah J. Vella ,  Guiqin Song ,  Chad Steven Smithson ,  Naveen Chopra ,  Kurt Halfyard ,  Biby Esther Abraham

IPC: C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C09J11/08 ,  C09J125/18 ,  C09J129/14 ,  C09J161/28 ,  C09J163/00 ,  C08K5/17 ,  H01B1/22 ,  C08K3/08

Abstract: Provided herein is conductive adhesive composition comprising at least one epoxy resin, at least one polymer chosen from polyvinyl phenols and polyvinyl butyrals, at least one melamine resin, a plurality of eutectic metal alloy nanoparticles, and at least one solvent. Also provided herein is an electronic device comprising a substrate, conductive features disposed on the substrate, a conductive electrical component disposed over the conductive features, and a conductive adhesive composition disposed between the conductive features and the conductive electrical component. Further disclosed herein are methods of making a conductive adhesive composition.

公开(公告)号：US11510314B2

公开(公告)日：2022-11-22

申请号：US16573590

申请日：2019-09-17

Applicant: XEROX CORPORATION

Inventor： Naveen Chopra ,  Barkev Keoshkerian ,  Chad Steven Smithson ,  Kurt I. Halfyard ,  Michelle N. Chretien

IPC: H05K1/05 ,  H05K3/34 ,  C09D11/02 ,  C09D11/03 ,  C09D11/037 ,  C09D11/30 ,  C09D11/38 ,  C09D11/52 ,  C09D11/322 ,  H01B1/02 ,  H01B1/16 ,  H01B1/22 ,  H05K1/09 ,  H01L23/00 ,  H01L23/498

Abstract: The present disclosure is directed to a hybrid conductive ink including: silver nanoparticles and eutectic low melting point alloy particles, wherein a weight ratio of the eutectic low melting point alloy particles and the silver nanoparticles ranges from 1:20 to 1:5. Also provided herein are methods of forming an interconnect including a) depositing a hybrid conductive ink on a conductive element positioned on a substrate, wherein the hybrid conductive ink comprises silver nanoparticles and eutectic low melting point alloy particles, the eutectic low melting point alloy particles and the silver nanoparticles being in a weight ratio from about 1:20 to about 1:5; b) placing an electronic component onto the hybrid conductive ink; c) heating the substrate, conductive element, hybrid conductive ink and electronic component to a temperature sufficient i) to anneal the silver nanoparticles in the hybrid conductive ink and ii) to melt the low melting point eutectic alloy particles, wherein the melted low melting point eutectic alloy flows to occupy spaces between the annealed silver nanoparticles, d) allowing the melted low melting point eutectic alloy of the hybrid conductive ink to harden and fuse to the electronic component and the conductive element, thereby forming an interconnect. Electrical circuits including conductive traces and, optionally, interconnects formed with the hybrid conductive ink are also provided.

公开(公告)号：US20200040229A1

公开(公告)日：2020-02-06

申请号：US16277664

申请日：2019-02-15

Applicant: Xerox Corporation

Inventor： Sarah J. Vella ,  Guiqin Song ,  Chad Steven Smithson ,  Kurt Halfyard

IPC: C09J9/02 ,  C09J163/00

Abstract: Provided herein is conductive adhesive composition comprising at least one epoxy resin, at least one polymer chosen from polyvinyl phenols and polyvinyl butyrals, at least one melamine resin, a plurality of metal nanoparticle shaving an average particle size ranging from about 0.5 nanometers to about 100 nanometers, and at least one solvent. Also provided herein is an electronic device comprising a substrate, conductive features disposed on the substrate, a conductive electrical component disposed over the conductive features, and a conductive adhesive composition disposed between the conductive features and the conductive electrical component. Further disclosed herein are methods of making a conductive adhesive composition.

公开(公告)号：US20200040228A1

公开(公告)日：2020-02-06

申请号：US16277589

申请日：2019-02-15

Applicant: XEROX CORPORATION

Inventor： Sarah J. Vella ,  Guiqin Song ,  Chad Steven Smithson ,  Naveen Chopra ,  Kurt Halfyard ,  Biby Esther Abraham

IPC: C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C09J11/08 ,  C09J125/18 ,  C09J129/14 ,  C09J163/00 ,  C09J161/28

Abstract: Provided herein is conductive adhesive composition comprising at least one epoxy resin, at least one polymer chosen from polyvinyl phenols and polyvinyl butyrals, at least one melamine resin, a plurality of eutectic metal alloy nanoparticles, and at least one solvent. Also provided herein is an electronic device comprising a substrate, conductive features disposed on the substrate, a conductive electrical component disposed over the conductive features, and a conductive adhesive composition disposed between the conductive features and the conductive electrical component. Further disclosed herein are methods of making a conductive adhesive composition.