Abstract:
The invention relates to a method for protecting an electronic arrangement which is disposed on a substrate and comprises organic constituents, where a cover is applied to the electronic arrangement in such a way that the electronic arrangement is at least partly covered by the cover, the cover being bonded at least over a partial area to the substrate and/or to the electronic arrangement, the adhesive bond being produced by means of at least one layer of an adhesive in an adhesive tape, characterized in that the adhesive comprises a getter material which is capable of at least one permeable substance, the getter material being present in the adhesive in a proportion of not more than 2 wt %, based on the adhesive with the getter material.
Abstract:
An adhesive tape, with a carrier material, has an acrylate-based foam layer bearing at least one layer of pressure-sensitive adhesive. The pressure-sensitive adhesive (a) being composed of a mixture of at least two different synthetic rubbers, more particularly based on vinylaromatic block copolymers, (b) comprising a resin which is not soluble in the acrylates forming the foam layer, and (c) being chemically uncrosslinked.