公开(公告)号：US20150162568A1

公开(公告)日：2015-06-11

申请号：US14411585

申请日：2013-05-27

Applicant: TESA SE

Inventor： Minyoung Bai ,  Jan Ellinger ,  Judith Grünauer ,  Klaus Keite-Telgenbüscher ,  Anika Petersen

IPC: H01L51/56 ,  C09J7/00 ,  H01L51/52

CPC classification number: H01L51/56 ,  C09J7/00 ,  C09J7/10 ,  C09J7/20 ,  C09J7/35 ,  C09J7/38 ,  C09J11/04 ,  C09J153/005 ,  C09J153/02 ,  C09J157/02 ,  C09J163/00 ,  C09J177/06 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2400/22 ,  C09J2453/00 ,  C09J2463/00 ,  C09J2477/00 ,  H01L51/0096 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/5259 ,  H01L2924/16195 ,  Y02E10/549

Abstract: The invention relates to a method for protecting an electronic arrangement which is disposed on a substrate and comprises organic constituents, where a cover is applied to the electronic arrangement in such a way that the electronic arrangement is at least partly covered by the cover, the cover being bonded at least over a partial area to the substrate and/or to the electronic arrangement, the adhesive bond being produced by means of at least one layer of an adhesive in an adhesive tape, characterized in that the adhesive comprises a getter material which is capable of at least one permeable substance, the getter material being present in the adhesive in a proportion of not more than 2 wt %, based on the adhesive with the getter material.

Abstract translation: 本发明涉及一种用于保护电子装置的方法，该电子装置设置在基板上并且包括有机成分，其中盖子以这样的方式施加到电子装置，使得电子装置至少部分被盖盖住，盖子 至少在部分区域上粘合到基底和/或电子装置上，粘合剂粘合通过粘合带中的至少一层粘合剂产生，其特征在于，所述粘合剂包括吸气剂材料，其为 能够至少一种可渗透物质，基于与吸气剂材料的粘合剂，吸气剂材料以不超过2重量％的比例存在于粘合剂中。

公开(公告)号：US10435594B2

公开(公告)日：2019-10-08

申请号：US15561808

申请日：2016-03-29

Applicant: TESA SE

Inventor： Anna Blazejewski ,  Axel Burmeister ,  Franciska Lohmann ,  Anika Petersen

IPC: C09J7/38 ,  C09J7/10 ,  C09J7/20 ,  C09J5/00 ,  C09J11/08 ,  C09J153/02 ,  C09J5/08 ,  C08K5/01 ,  C08K7/20 ,  B29B7/48

Abstract: The invention relates to a pressure-sensitive adhesive strip, for the residue-free and nondestructive removal by which by substantially expanding it in the plane of adhesion, comprising an adhesive compound layer, said adhesive compound layer consisting of a pressure-sensitive adhesive compound, constituted by vinyl aromatic block copolymers and adhesive resins, at least 75 wt.-% (relative to the total amount of resin) of a resin being selected that has a DACP (diacetone alcohol cloud point) of greater than −20° C., preferably greater than 0° C., and a softening point (ring & ball) of greater than or equal to 70° C., preferably greater than or equal to 100° C., and the pressure-sensitive adhesive compound being foamed.

公开(公告)号：US11566152B2

公开(公告)日：2023-01-31

申请号：US16070114

申请日：2017-02-16

Applicant: TESA SE

Inventor： Franciska Lohmann-Rademacher ,  Anika Petersen ,  Axel Burmeister ,  Mathias Hoser

IPC: C09J7/38 ,  C09J7/22 ,  C09J133/08 ,  C09J123/00 ,  C08K5/01 ,  C08K7/22 ,  C09J133/10 ,  C08K5/00

Abstract: The invention relates to adhesive strips consisting of at least four, particularly precisely four layers, comprising: a layer A having an upper side and a lower side consisting of a foamed adhesive substance containing a self-adhesive acrylate substance; a layer B consisting of a film carrier, layer B being arranged on the lower side of layer A, at least the main surface which faces layer A, preferably both main surfaces of the film carrier, being etched, the surface of layer A and the surface of layer B being in direct contact with each other; a layer C consisting of a self-adhesive substance, arranged on the upper side of layer A and containing a self-adhesive acrylate substance; and a layer D consisting of a self-adhesive substance, arranged on the side of layer B opposite layer A and containing a self-adhesive acrylate substance.

公开(公告)号：US10232586B2

公开(公告)日：2019-03-19

申请号：US14906106

申请日：2014-07-08

Applicant: TESA SE

Inventor： Thilo Dollase ,  Anika Petersen ,  Elisabetta Ardente ,  Franziska Eberhardt ,  Stephan Zöllner ,  Kai Ellringmann ,  Bernd Lühmann

IPC: G02B1/04 ,  C08L25/10 ,  C08L55/02 ,  B32B7/12 ,  C09J133/08 ,  C09J5/00 ,  H04M1/02

Abstract: Composite made of two substrates for use for optical, electronic and/or precision-engineered equipment, comprising a first substrate and a second substrate and, arranged so as to connect the first substrate to the second substrate, an adhesive layer, wherein the adhesive layer comprises an adhesive which has, relative to the mixture, (a) from 60% by weight to 90% by weight of a first polymer component based on polyacrylate and (b) from 10% by weight to 40% by weight of a second polymer component based on elastomers, where the second polymer component is essentially not miscible with the first polymer component, so that the adhesive is present in at least two separate phases in the adhesive layer.

公开(公告)号：US20150337174A1

公开(公告)日：2015-11-26

申请号：US14653143

申请日：2013-12-05

Applicant: TESA SE

Inventor： Klaus Keite-Telgenbüscher ,  Jan Ellinger ,  Judith Grünauer ,  Anika Petersen

IPC: C09J7/02

CPC classification number: C09J7/22 ,  B32B27/14 ,  B32B27/32 ,  B32B2264/10 ,  B32B2405/00 ,  C08K3/08 ,  C08K3/22 ,  C08K3/34 ,  C09J7/29 ,  C09J153/005 ,  C09J153/025 ,  C09J171/00 ,  C09J177/02 ,  C09J177/06 ,  C09J2201/128 ,  C09J2201/20 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/106 ,  C09J2400/123 ,  C09J2400/243 ,  C09J2400/263 ,  C09J2423/006 ,  C09J2423/046 ,  C09J2433/00 ,  C09J2453/00 ,  C09J2463/00 ,  C09J2471/00 ,  H01L23/26 ,  H01L23/3164 ,  H01L51/524 ,  H01L2924/0002 ,  Y10T428/24331 ,  Y10T428/249983 ,  Y10T428/2848 ,  H01L2924/00

Abstract: The aim of the invention is to effectively protect a flat adhesive compound from permeates originating from the surroundings as well as from permeates trapped during lamination, winding, stacking or other processing steps. For this purpose, the adhesive tape comprises at least the following layers in the indicated order: a first outer adhesive compound layer A, a layer B, which contains at least one inorganic getter material, and a second outer adhesive compound layer C. The invention also relates to the use of said adhesive tape as an encapsulation material.

Abstract translation: 本发明的目的是有效地保护扁平的粘合剂化合物免受来自周围环境的渗透物以及在层压，缠绕，堆叠或其它加工步骤期间被捕获的渗透物。 为此目的，粘合带至少包括以下顺序的层：第一外部粘合剂化合物层A，含有至少一种无机吸气剂材料的层B和第二外部粘合剂化合物层C.本发明 还涉及使用所述胶带作为包封材料。

公开(公告)号：US11084958B2

公开(公告)日：2021-08-10

申请号：US14653498

申请日：2013-12-05

Applicant: TESA SE

Inventor： Thorsten Krawinkel ,  Lesmona Scherf ,  Anika Petersen ,  Thilo Dollase

IPC: C09J153/02 ,  C09J7/22 ,  C09J7/38 ,  C09J7/25 ,  C08K5/01

Abstract: The invention relates to an adhesive film strip comprising at least two, particularly three, layers, which adhesive film strip can be detached without residues and nondestructively by expansive stretching substantially in the adhesion plane, with a carrier on which a first external adhesive compound layer is present on at least one side, wherein • the adhesive compound layer consists of adhesive compound formed on the basis of vinyl aromatic block copolymers and adhesive resins, wherein at least 75% of the resin (relative to the overall resin content) is selected with a DACP (diacetone alcohol cloud point) of greater than −20° C., preferably greater than 0° C., and • the carrier has at least one layer consisting of a polyurethane with an elongation at break of at least 100% and a restoring power of more than 50%. A nonpolar hydrocarbon resin or a polyterpene resin is particularly used as the tackifier for the adhesive compound(s).

公开(公告)号：US10323163B2

公开(公告)日：2019-06-18

申请号：US14653143

申请日：2013-12-05

Applicant: TESA SE

Inventor： Klaus Keite-Telgenbüscher ,  Jan Ellinger ,  Judith Grünauer ,  Anika Petersen

IPC: H01L23/26 ,  C09J7/22 ,  C09J7/29 ,  C09J153/02 ,  C09J171/00 ,  C09J177/02 ,  C09J177/06 ,  C09J7/38 ,  C09J7/40 ,  C08K3/08 ,  C08K3/22 ,  C08K3/34 ,  B32B27/14 ,  B32B27/32 ,  C09J153/00 ,  H01L51/52 ,  H01L23/31

Abstract: The aim of the invention is to effectively protect a flat adhesive compound from permeates originating from the surroundings as well as from permeates trapped during lamination, winding, stacking or other processing steps. For this purpose, the adhesive tape comprises at least the following layers in the indicated order: a first outer adhesive compound layer A, a layer B, which contains at least one inorganic getter material, and a second outer adhesive compound layer C. The invention also relates to the use of said adhesive tape as an encapsulation material.

公开(公告)号：US09543549B2

公开(公告)日：2017-01-10

申请号：US14411585

申请日：2013-05-27

Applicant: TESA SE

Inventor： Minyoung Bai ,  Jan Ellinger ,  Judith Grünauer ,  Klaus Keite-Telgenbüscher ,  Anika Petersen

IPC: H01L21/00 ,  H01L51/56 ,  C09J7/00 ,  C09J7/02 ,  C09J11/04 ,  H01L51/00 ,  H01L51/52 ,  C09J153/00 ,  C09J153/02 ,  C09J157/02 ,  C09J163/00 ,  C09J177/06

CPC classification number: H01L51/56 ,  C09J7/00 ,  C09J7/10 ,  C09J7/20 ,  C09J7/35 ,  C09J7/38 ,  C09J11/04 ,  C09J153/005 ,  C09J153/02 ,  C09J157/02 ,  C09J163/00 ,  C09J177/06 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2400/22 ,  C09J2453/00 ,  C09J2463/00 ,  C09J2477/00 ,  H01L51/0096 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/5259 ,  H01L2924/16195 ,  Y02E10/549

Abstract: The invention relates to a method for protecting an electronic arrangement which is disposed on a substrate and comprises organic constituents, where a cover is applied to the electronic arrangement in such a way that the electronic arrangement is at least partly covered by the cover, the cover being bonded at least over a partial area to the substrate and/or to the electronic arrangement, the adhesive bond being produced by means of at least one layer of an adhesive in an adhesive tape, characterized in that the adhesive comprises a getter material which is capable of at least one permeable substance, the getter material being present in the adhesive in a proportion of not more than 2 wt %, based on the adhesive with the getter material.

Abstract translation: 本发明涉及一种用于保护电子装置的方法，该电子装置设置在基板上并且包括有机成分，其中盖子以这样的方式施加到电子装置，使得电子装置至少部分被盖盖住，盖子 至少在部分区域上粘合到基底和/或电子装置上，粘合剂粘合通过粘合带中的至少一层粘合剂产生，其特征在于，所述粘合剂包括吸气剂材料，其为 能够至少一种可渗透物质，基于与吸气剂材料的粘合剂，吸气剂材料以不超过2重量％的比例存在于粘合剂中。

公开(公告)号：US10759974B2

公开(公告)日：2020-09-01

申请号：US16551109

申请日：2019-08-26

Applicant: tesa SE

Inventor： Anna Blazejewski ,  Axel Burmeister ,  Franciska Lohmann ,  Anika Petersen

IPC: C09J7/38 ,  C09J7/10 ,  C09J7/20 ,  C09J5/08 ,  C09J153/02 ,  C09J11/08 ,  C08K5/01 ,  C08K7/22 ,  B29B7/48

Abstract: Pressure-sensitive adhesive (PSA) strips, configured or adapted for the residue-free and non-destructive removal by which by substantially expanding it in the plane of adhesion, are provided. The PSA strips comprise at least one adhesive compound layer consisting of a PSA compound, constituted by vinyl aromatic block copolymers and one or more adhesive resins, at least 75 wt.-% (relative to the total amount of resin) of a resin being selected that has a DACP (diacetone alcohol cloud point) of greater than −20° C., and a softening point (ring & ball) of greater than or equal to 70° C., and the PSA compound has being foamed.

公开(公告)号：US10717906B2

公开(公告)日：2020-07-21

申请号：US16172061

申请日：2018-10-26

Applicant: TESA SE

Inventor： Daniel Schmitz-Stapela ,  Thorsten Krawinkel ,  Thilo Dollase ,  Anika Petersen ,  Tanja Altenwegner ,  Andreas Westphal

IPC: C09J153/02 ,  C09J11/06 ,  B32B7/12 ,  C09J7/38 ,  C08L53/02 ,  C08L57/02 ,  C08K5/105 ,  C08K5/3435 ,  C08K5/3475

Abstract: A single- or double-sidedly bonding adhesive-sheet strip having a self-adhesive composition comprising a) at least one elastomer, at least one type of polybutadiene block copolymer being used as an elastomer, b) at least one partially hydrogenated hydrocarbon resin having a softening temperature of at least 90° C., c) at least one additional hydrocarbon resin, a terpene phenol resin and/or a colophonium resin having a softening temperature of at least 90° C., d) an optional soft resin, and e) additional additives as applicable.