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公开(公告)号：US10250962B2
公开(公告)日：2019-04-02
申请号：US15554980
申请日：2015-12-10
Applicant: GOERTEK.INC
Inventor： Guoguang Zheng
Abstract: The present invention discloses a package structure of a MEMS microphone. The package structure comprises a closed inner cavity formed by a package shell in a surrounding manner, as well as a MEMS chip and an ASIC chip which are located in the closed inner cavity, wherein a sound hole allowing sound to flow into the closed inner cavity is formed in the package shell; the MEMS chip comprises a substrate as well as a vibrating diaphragm and a back plate which are provided on the substrate; the vibrating diaphragm divides the closed inner cavity into a front cavity and a back cavity; and a sound-absorbing structure is provided in the back cavity.
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公开(公告)号：US10170665B2
公开(公告)日：2019-01-01
申请号：US15559778
申请日：2015-09-09
Applicant: Goertek.Inc
Inventor： Quanbo Zou , Zhe Wang
Abstract: The present invention discloses a repairing method, manufacturing method, device and electronics apparatus of micro-LED. The method for repairing a micro-LED comprises: bringing a known-good micro-LED on a conductive pick-up head into contact with a first pad on an defective position of a receiving substrate, wherein the conductive pick-up head and the known-good micro-LED are bonded via a conductive adhesive; locally joule heating a first bonding layer through the conductive pick-up head, to melt the first bonding layer, wherein the first bonding layer is provided between the known-good micro-LED and the first pad; and lifting up the conductive pick-up head after the first bonding layer is cooled, leaving the known-good micro-LED on the receiving substrate.
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公开(公告)号：US10554109B2
公开(公告)日：2020-02-04
申请号：US15553026
申请日：2016-12-26
Applicant: GOERTEK.INC
Inventor： Dezhang Shi , Yueguang Zhu
Abstract: Disclosed is a linear vibration motor, comprising a housing, a vibration assembly and a stator assembly, wherein the vibration assembly includes a mass block, a permanent magnet and an elastic sheet and the stator assembly includes a coil and a damping element; the damping element includes a main body and an elastic arm extending upwards from the main body, and the main body is fixed on an end of the mass block in the length direction; and the elastic sheet has a middle arm and a first connection arm and a second connection arm respectively provided at two ends of the middle arm, the surface of the middle arm adjacent to the mass block is abutted against the elastic arm, the first connection arm is fixedly connected to the housing, and the second connection arm is fixedly connected to the mass block.
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公开(公告)号：US10295422B2
公开(公告)日：2019-05-21
申请号：US15559311
申请日：2015-12-10
Applicant: GOERTEK.INC
Inventor： Guoguang Zheng
Abstract: The present invention discloses a quasi-differential capacitive MEMS pressure sensor and manufacturing methods thereof. The quasi-differential capacitive MEMS pressure sensor includes a first lower electrode, a second lower electrode, a first upper electrode supported above the first lower electrode, and a second upper electrode supported above the second lower electrode, wherein the first upper electrode is a pressure-sensitive film, and a cavity between the first upper electrode and the first lower electrode is a closed cavity, so that the first upper electrode and the first lower electrode constitute an air pressure-sensitive type capacitor; and the second upper electrode and the second lower electrode constitute a reference capacitor whose capacitance does not vary with external air pressure. The pressure sensor provided by the present invention can at least partially filter out a common-mode interference signal in an output signal of the air pressure-sensitive type capacitor by use of the reference capacitor, thereby improving the stability and resolution of the output signal of the air pressure-sensitive type capacitor.
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公开(公告)号：US10225659B2
公开(公告)日：2019-03-05
申请号：US15551254
申请日：2015-11-26
Applicant: Goertek.Inc
Inventor： Minghui Shao , Jianbin Yang
Abstract: The present invention discloses a speaker device capable of restraining polarization, a method for adjusting a diaphragm balance position of the speaker device and a method for adjusting diaphragm compliance performance of the speaker device. The speaker device comprises a vibration system, a magnetic circuit system, a shell accommodating the vibration system and the magnetic circuit system, a first electret layer, a second electret layer and a third electret layer, wherein the first electret layer, the second electret layer and the third electret layer have the same electric charge polarity; the first electret layer is attached to the vibration system; the second electret layer is attached to a first fixing component above the vibration system and opposite to the first electret layer; the third electret layer is attached to a second fixing component below the vibration system and opposite to the first electret layer; and the first electret layer, the second electret layer and the third electret layer are parallel to one another. In the present invention, an electrostatic field force is adopted to restrain the polarization of a diaphragm in a vibration direction.
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Patent Agency Ranking
公开(公告)号：US10181546B2
公开(公告)日：2019-01-15
申请号：US15559801
申请日：2015-11-04
Applicant: Goertek.Inc
Inventor： Quanbo Zou , Manen Lu , Zhe Wang
IPC: H01L33/00 , H01L21/68 , H01L21/786 , H01L25/075 , H01L27/15 , H01L33/20
Abstract: The present invention discloses a transferring method, a manufacturing method, a device and an electronics apparatus of micro-LED. The method for transferring micro-LEDs comprises: forming a mask layer on the backside of a laser-transparent original substrate, wherein micro-LEDs are formed on the front-side of the original substrate; bringing the micro-LEDs on the original substrate in contact with preset pads on a receiving substrate; and irradiating the original substrate from the original substrate side with laser through the mask layer, to lift-off micro-LEDs from the original substrate.
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公开(公告)号：US20180041840A1
公开(公告)日：2018-02-08
申请号：US15554633
申请日：2015-12-10
Applicant: GOERTEK.INC
Inventor： Guoguang ZHENG
CPC classification number: H04R19/04 , H04R1/04 , H04R3/005 , H04R7/04 , H04R19/005 , H04R2201/003 , H04R2307/025 , H04R2410/01
Abstract: The present invention discloses a differential-capacitance type MEMS microphone, comprising a circuit board, a first MEMS chip and a second MEMS chip; wherein the first MEMS chip comprises a first substrate disposed on the circuit board, and a first capacitor disposed on the first substrate, the first capacitor comprising a first back pole plate located above, a first vibrating diaphragm located below, and a first isolating layer disposed between the first back pole plate and the first vibrating diaphragm; the second MEMS chip comprises a second substrate disposed on the circuit board, and a second capacitor disposed on the second substrate, the second capacitor comprising a second back pole plate located below, a second vibrating diaphragm located above, and a second isolating layer disposed between the second back pole plate and the second vibrating diaphragm; and the first capacitor and the second capacitor form a pair of differential capacitors.
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公开(公告)号：US10805716B2
公开(公告)日：2020-10-13
申请号：US15554623
申请日：2015-12-10
Applicant: GOERTEK.INC
Inventor： Guoguang Zheng
Abstract: The present invention discloses a package structure of a MEMS microphone. The package structure comprises a package substrate and a package shell, wherein the package shell is provided on the package substrate and forms a closed cavity with the package substrate. In the package structure provided by the present invention, the sound-absorbing layer is arranged on the inner wall of the Helmholtz resonant cavity. The sound-absorbing layer has a certain absorption capacity to high-frequency sound waves, but has a very low absorption to low-frequency sound waves, so it may be equivalent to a “low-pass filter”. Through the absorption of the high-frequency sound waves, a high-frequency amplitude value of sound waves can be suppressed, reducing high-frequency response of the Helmholtz resonant cavity. That is, a high-frequency cut-off frequency of the sound waves is improved, widening operation bandwidth of the MEMS microphone.
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公开(公告)号：US10511903B2
公开(公告)日：2019-12-17
申请号：US15560877
申请日：2015-12-14
Applicant: Goertek.Inc
Inventor： Liguo Sun , Lianshan Ge
Abstract: The present invention discloses a sound wave filtering structure. The sound wave filtering structure comprises a cavity wall, a cavity cover and a slit. The cavity cover is mounted on the cavity wall. The cavity wall and the cavity cover are combined to form an inner cavity. The slit is formed on the cavity wall and/or the cavity cover. The cavity wall and the cavity cover seal the inner cavity. A space in the inner cavity is communicated with the outside only through the slit. On the other hand, the present invention further provides a side sound generating speaker module. The side sound generating speaker module at least comprises a side sound generating cavity and the above-described sound wave filtering structure. The side sound generating cavity is configured to guide sound waves to be transmitted from a side surface of a single speaker body. The sound wave filtering structure is arranged on the side sound generating cavity. The slit faces the interior of the side sound generating cavity. The sound wave filtering structure provided by the present invention can adjust and filter high-frequency sound waves. Especially, in the side sound generating speaker module, the sound wave filtering structure can significantly improve the sound quality of the high-frequency sound waves.
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公开(公告)号：US10264377B2
公开(公告)日：2019-04-16
申请号：US15553414
申请日：2015-12-17
Applicant: GOERTEK.INC
Inventor： Kang Ping , Xinfeng Yang , Jie Wei
Abstract: Disclosed are a method, system and controller for simultaneously verifying amplitude and temperature parameters of an electrical-acoustic conversion device, including: inputting a sweep signal to the electrical-acoustic conversion device; testing the amplitude of the electrical-acoustic conversion device while adjusting the gain of the whole frequency band of the sweep signal until the maximum value of the tested amplitude is a maximum amplitude parameter Xmax, and testing the temperature of a voice coil at this moment; and if the tested temperature of the voice coil at this moment is higher or lower than Tmax, gradually reducing/increasing the gain of the sweep signal in the frequency band above a gain improvement frequency point until the tested temperature of the voice coil is Tmax, and then maintaining the gain of the sweep signal for a predetermined period of time and then testing the performance of the electrical-acoustic conversion device.
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