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公开(公告)号：US20230112373A1
公开(公告)日：2023-04-13
申请号：US17935323
申请日：2022-09-26
Applicant: PERASO TECHNOLOGIES INC.
IPC: H04W74/08 , H04B7/0426
Abstract: A method in a communication system including an access point and a plurality of stations, includes: selecting, at the access point, a quasi-omni-directional beam for use in transmitting and receiving control frames to and from the stations; selecting, at each station, one of a plurality of directional beams for use in transmitting and receiving control frames to and from the access point; at each of the stations, pausing transmission of Request To Send (RTS) control frames responsive to detecting (i) a RTS control frame from the access point to any one of the stations, or (ii) a Clear to Send (CTS) control frame from the access point to any one of the stations; wherein pausing transmission of RTS control frames is for a duration of time provided in the detected RTS control frame or CTS frame.
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公开(公告)号：US11121818B2
公开(公告)日：2021-09-14
申请号：US15651835
申请日：2017-07-17
Applicant: PERASO TECHNOLOGIES INC.
Inventor： Joseph Andonieh , Gary Cheng , Christopher James Hansen , Bradley Robert Lynch
Abstract: A method and apparatus for establishing unsolicited block acknowledgements is provided. During a process, at a first wireless device, to associate with a basic service set that includes a second wireless communication device, the first wireless device transmits, via a controller and using a radio: an indication that the first wireless communication device supports block acknowledgements; and at least one common block acknowledgement parameter defining unsolicited block acknowledgement. Thereafter, the first wireless communication device exchanges data with the second wireless communication device according to the at least one common block acknowledgement parameter defining the unsolicited block acknowledgement.
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公开(公告)号：US10784990B2
公开(公告)日：2020-09-22
申请号：US15947229
申请日：2018-04-06
Applicant: PERASO TECHNOLOGIES INC.
Inventor： Gary Cheng , Christopher James Hansen , Joseph Andonieh , Bradley Robert Lynch
Abstract: A wireless communications assembly and method for encoding and modulating data for transmission is provided. The method includes receiving primary data to be transmitted to a receiving station; selecting a data rate at which to transmit the primary data; selecting a mode associated with the data rate, the mode defining a modulation scheme and a target code rate; generating encoded data, including modifying an error correcting block format having a predefined code rate to generate the encoded data at the target code rate; and extracting at least a portion of the encoded data for modulation of a carrier signal and transmission to a receiving station.
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公开(公告)号：US10483621B2
公开(公告)日：2019-11-19
申请号：US15331072
申请日：2016-10-21
Applicant: PERASO TECHNOLOGIES INC.
Inventor： Atabak Rashidian
Abstract: An antenna assembly includes a support member having opposing first and second surfaces, and a set of electrical contacts; an antenna carried on the first surface of the support member and electrically connected to the set of electrical contacts; a conductive inner ring element carried on the first surface and surrounding the antenna; and a dielectric outer ring element mounted on the first surface and surrounding the conductive inner ring.
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15.发明授权Waveguide adapter plate to facilitate accurate alignment of sectioned waveguide channel in microwave antenna assembly 有权波导适配板，便于微波天线组件中分段波导通道的精确对准公开(公告)号：US09577340B2
公开(公告)日：2017-02-21
申请号：US14217683
申请日：2014-03-18
Applicant: Peraso Technologies, Inc.
Inventor： Mohammad Fakharzadeh , Andrew Charles Andrade , Saman Jafarlou , Bradley Robert Lynch , Mihai Tazlauanu
CPC classification number: H01Q13/02 , H01P5/107 , H01P11/00 , H01Q13/0283 , H01Q13/06 , Y10T29/49016
Abstract: An antenna apparatus includes a waveguide adapter plate for mounting an antenna flange and an RF system-in-package or other IC package. The waveguide adapter plate comprises a first surface and an opposing second surface and a waveguide flange interface. The waveguide flange interface comprises a waveguide channel section extending between the first surface and the second surface and a set of flange mounting holes extending from the first surface to the second surface. The waveguide adapter plate further includes a plurality of substrate alignment pins extending substantially perpendicular from the second surface.
Abstract translation: 天线装置包括用于安装天线法兰的波导适配器板和RF系统级封装或其它IC封装。 波导适配器板包括第一表面和相对的第二表面和波导法兰接口。 波导法兰接口包括在第一表面和第二表面之间延伸的波导通道部分和从第一表面延伸到第二表面的一组法兰安装孔。 波导适配器板还包括从第二表面基本上垂直延伸的多个基板对准销。
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Patent Agency Ranking
16.发明授权公开(公告)号：US09419341B2
公开(公告)日：2016-08-16
申请号：US14217682
申请日：2014-03-18
Applicant: Peraso Technologies, Inc.
Inventor： Saman Jafarlou , Mohammad Fakharzadeh
CPC classification number: H01Q13/02 , H01P5/107 , H01Q13/0283 , Y10T29/49018 , Y10T29/49165
Abstract: An IC package includes an IC die disposed at a first surface of a substrate, which includes a signal via extending between first and second metal layers. The first metal layer is proximate to the first surface and includes a first coplanar waveguide. The first coplanar waveguide has a first signal line coupling a die bump to the signal via and has a first ground plane co-planar with the first signal line. The second metal layer is proximate to a second surface and includes a second coplanar waveguide that has a second signal line coupling the signal via to a launcher element and has a second ground plane co-planar with the second signal line. The IC package further includes a waveguide channel aperture comprising a region surrounding the launcher element and which is substantially devoid of conductive material and a via fence disposed at a perimeter of the first region.
Abstract translation: IC封装包括设置在基板的第一表面处的IC管芯，其包括在第一和第二金属层之间延伸的信号通路。 第一金属层靠近第一表面并且包括第一共面波导。 第一共面波导具有将管芯凸起与信号通孔相连的第一信号线，并具有与第一信号线共面的第一接地平面。 第二金属层靠近第二表面并且包括第二共面波导，其具有将信号通孔耦合到发射元件的第二信号线，并具有与第二信号线共面的第二接地平面。 IC封装还包括波导沟道孔，该波导通道孔包括围绕发射器元件的区域，并且其基本上不含导电材料，并且布置在第一区域周边的通孔栅栏。
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17.发明申请WAVEGUIDE ADAPTER PLATE TO FACILITATE ACCURATE ALIGNMENT OF SECTIONED WAVEGUIDE CHANNEL IN MICROWAVE ANTENNA ASSEMBLY 有权波导适配板，用于在微波天线装配中精确调整分段波导通道的精确对准公开(公告)号：US20150270617A1
公开(公告)日：2015-09-24
申请号：US14217683
申请日：2014-03-18
Applicant: Peraso Technologies, Inc.
Inventor： Mohammad Fakharzadeh , Andrew Charles Andrade , Saman Jafarlou , Bradley Robert Lynch , Mihai Tazlauanu
CPC classification number: H01Q13/02 , H01P5/107 , H01P11/00 , H01Q13/0283 , H01Q13/06 , Y10T29/49016
Abstract: An antenna apparatus includes a waveguide adapter plate for mounting an antenna flange and an RF system-in-package or other IC package. The waveguide adapter plate comprises a first surface and an opposing second surface and a waveguide flange interface. The waveguide flange interface comprises a waveguide channel section extending between the first surface and the second surface and a set of flange mounting holes extending from the first surface to the second surface. The waveguide adapter plate further includes a plurality of substrate alignment pins extending substantially perpendicular from the second surface.
Abstract translation: 天线装置包括用于安装天线法兰的波导适配器板和RF系统级封装或其它IC封装。 波导适配器板包括第一表面和相对的第二表面和波导法兰接口。 波导法兰接口包括在第一表面和第二表面之间延伸的波导通道部分和从第一表面延伸到第二表面的一组法兰安装孔。 波导适配器板还包括从第二表面基本上垂直延伸的多个基板对准销。
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公开(公告)号：US20140285389A1
公开(公告)日：2014-09-25
申请号：US13870457
申请日：2013-04-25
Applicant: Mohammad Fakharzadeh , Mihai Tazlauanu
Inventor： Mohammad Fakharzadeh , Mihai Tazlauanu
CPC classification number: H01P5/08 , H01P5/107 , H01P11/00 , H01P11/001 , H01Q13/02 , H01Q21/0075 , Y10T29/49016
Abstract: An apparatus includes an IC package comprising a substrate having a first metal layer, a second metal layer, and a dielectric layer disposed between the first and second metal layers. The IC package further comprises an IC die disposed at a surface of the substrate and comprising RF circuitry. The first metal layer comprises a microstrip feedline extending from a pin of the IC die. The microstrip feedline includes a conductive trace having a probe element at a tip distal from the pin. The first metal layer further comprises a waveguide opening comprising a region surrounding the probe element, the region being substantially devoid of conductive material. The substrate further comprises a plurality of metal vias disposed at the perimeter of the region, the metal vias extending from the first metal layer to the second metal layer.
Abstract translation: 一种装置包括IC封装，其包括具有第一金属层，第二金属层和设置在第一和第二金属层之间的介电层的基板。 IC封装还包括设置在衬底的表面上并包括RF电路的IC管芯。 第一金属层包括从IC芯片的引脚延伸的微带馈线。 微带馈线包括导电迹线，该导电迹线在远离销的尖端处具有探针元件。 第一金属层还包括波导开口，其包括围绕探针元件的区域，该区域基本上不含导电材料。 衬底还包括设置在该区域的周边的多个金属通孔，金属通孔从第一金属层延伸到第二金属层。
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19.发明授权Varactor voltage controlled oscillator (VCO) providing independent coarse and fine frequency tuning 有权Varactor压控振荡器（VCO）提供独立的粗调和精细频率调谐公开(公告)号：US08786376B2
公开(公告)日：2014-07-22
申请号：US13324556
申请日：2011-12-13
Applicant: Sorin Voinigescu , Ekaterina Laksin
Inventor： Sorin Voinigescu , Ekaterina Laksin
IPC: H03B5/12
CPC classification number: H03B5/1218 , H03B5/1203 , H03B5/1231 , H03B5/1253 , H03B5/1265 , H03B2200/0008 , H03B2200/0034
Abstract: A voltage controlled oscillator, includes a tank circuit including an inductor having a value L, interconnected with first and second variable capacitors, having values CVAR1 and CVAR2, and a fixed capacitor CFIXED, to cause oscillation of the oscillator at a controlled frequency f osc = ( 2 π ) - 1 ( L { C VAR 2 + C FIXED C VAR 1 C FIXED + C VAR 1 } ) - 1 / 2 CVAR1 controls coarse frequency tuning of the oscillator, and CVAR2 may control fine tuning of the oscillator. The variable capacitors may be formed using accumulation-mode MOS varactors.
Abstract translation: 压控振荡器包括一个包括具有值L的电感器的电路，该电感器与第一和第二可变电容器互连，具有值CVAR1和CVAR2，以及固定电容器CFIXED，以使振荡器以受控频率f osc = （2＆pgr;） - 1（L {C VAR笨2 + C FIXED C VAR1 C FIXED + C VAR1}） - 1/2 CVAR1控制振荡器的粗频率调谐， 并且CVAR2可以控制振荡器的微调。 可以使用累积模式MOS可变电抗器形成可变电容器。
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公开(公告)号：US20250118903A1
公开(公告)日：2025-04-10
申请号：US18907016
申请日：2024-10-04
Applicant: PERASO TECHNOLOGIES INC.
Inventor： Nima BAYAT-MAKOU , Atabak RASHIDIAN , Mihai TAZLAUANU
Abstract: A radio frequency module, comprising: a primary board; a controller supported by the primary board; and an antenna assembly supported by the primary board and connected with the controller, the antenna assembly including: an array of antenna elements, each antenna element having: an active patch; and a passive patch separated from the active patch by a slot; wherein one of the active patch and the passive patch has a greater surface area than the other of the active patch and the passive patch.
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