公开(公告)号：US20210013582A1

公开(公告)日：2021-01-14

申请号：US16925831

申请日：2020-07-10

Applicant: PERASO TECHNOLOGIES INC.

Inventor： Atabak RASHIDIAN ,  Mihai TAZLAUANU ,  Marc SUPINSKI

IPC: H01Q1/16 ,  H01Q23/00 ,  H01Q1/22

Abstract: A radio frequency module includes: a primary board including: an upper surface carrying a radio controller; and a lower surface carrying antenna control elements; a spacer affixed to the lower surface and having a predefined height extending away from the lower surface; and a secondary board affixed to the spacer, separated from the lower surface by an air gap having the predetermined height; the secondary board supporting a phased array of antenna elements.

公开(公告)号：US20230125676A1

公开(公告)日：2023-04-27

申请号：US18048536

申请日：2022-10-21

Applicant: PERASO TECHNOLOGIES INC.

Inventor： Atabak RASHIDIAN ,  Mihai TAZLAUANU ,  Bradley Robert LYNCH

IPC: H01Q3/36

Abstract: A radio frequency module includes: a primary board including: an upper surface carrying a radio controller; and a lower surface carrying antenna control elements; a plurality of spacing elements affixed to the lower surface and having a predetermined height extending away from the lower surface; and a secondary board affixed to the primary board by the plurality of spacing elements, separated from the lower surface of the primary board by an air gap with the predetermined height; the secondary board supporting a phased array of antenna elements electromagnetically coupled with the antenna control elements.

公开(公告)号：US20240204419A1

公开(公告)日：2024-06-20

申请号：US18541519

申请日：2023-12-15

Applicant: PERASO TECHNOLOGIES INC.

Inventor： Atabak RASHIDIAN

IPC: H01Q21/06 ,  H01Q9/04

CPC classification number: H01Q21/065 ,  H01Q9/0414

Abstract: An antenna assembly includes: a substrate material supporting a plurality of substantially parallel conductive layers; a ground plane defined by a first conductive layer; an grid of antenna elements, each antenna element including: an excitation patch defined by a second conductive layer, and configured for connection to a controller port; a first annular radiative element defined by a third conductive layer; a second annular radiative element defined by a fourth conductive layer; wherein the excitation patch, the first annular radiative element, and the second annular radiative element are disposed in a stack with an axis perpendicular to the first conductive layer.

公开(公告)号：US20230092161A1

公开(公告)日：2023-03-23

申请号：US17933584

申请日：2022-09-20

Applicant: PERASO TECHNOLOGIES INC.

Inventor： Atabak RASHIDIAN ,  Nima BAYAT-MAKOU ,  Marc SUPINSKI ,  Mihai TAZLAUANU

IPC: H01Q1/22 ,  H01Q1/24 ,  H01Q21/24 ,  H01Q21/28

Abstract: An antenna assembly configured to operate in a millimeter wave frequency of 30 GHz to 300 GHz, the antenna assembly being formed from a multi-layer printed circuit board having a plurality of eight square radiating rings positioned at generally equidistant locations within and surrounded by a rectangular grounded external ring which is positioned at the perimeter of the assembly. The antenna assembly also includes a plurality of feed network layers with a radio frequency chip and a baseband chip mounted onto the top of the plurality of feed network layers for controlling the operation of the eight square radiating rings.

公开(公告)号：US20190089049A1

公开(公告)日：2019-03-21

申请号：US16181519

申请日：2018-11-06

Applicant: PERASO TECHNOLOGIES INC.

Inventor： Atabak RASHIDIAN

IPC: H01Q3/26

Abstract: A wireless communication assembly includes: a primary support member defining a primary mounting surface with first and second electrical contacts; an antenna, adjacent to primary mounting surface perimeter, and a baseband controller, on the primary support member; primary signal paths between the baseband controller and the first contacts; primary feed lines between the second contacts and the antenna; a secondary support member carrying a radio controller and defining a secondary mounting surface with third electrical contacts and ports adjacent to a perimeter of the secondary mounting surface; secondary signal paths between the third contacts and the radio controller; secondary feed lines between the radio controller and the ports; the secondary mounting surface configured to engage with the primary mounting surface to connect the first contacts with the third contacts, and the second contacts with the ports.

公开(公告)号：US20180115056A1

公开(公告)日：2018-04-26

申请号：US15331072

申请日：2016-10-21

Applicant: PERASO TECHNOLOGIES INC.

Inventor： Atabak RASHIDIAN

IPC: H01Q1/36 ,  H01Q1/24 ,  H01Q1/48

Abstract: An antenna assembly includes a support member having opposing first and second surfaces, and a set of electrical contacts; an antenna carried on the first surface of the support member and electrically connected to the set of electrical contacts; a conductive inner ring element carried on the first surface and surrounding the antenna; and a dielectric outer ring element mounted on the first surface and surrounding the conductive inner ring.

公开(公告)号：US20250118903A1

公开(公告)日：2025-04-10

申请号：US18907016

申请日：2024-10-04

Applicant: PERASO TECHNOLOGIES INC.

Inventor： Nima BAYAT-MAKOU ,  Atabak RASHIDIAN ,  Mihai TAZLAUANU

IPC: H01Q21/06 ,  H01Q1/22

Abstract: A radio frequency module, comprising: a primary board; a controller supported by the primary board; and an antenna assembly supported by the primary board and connected with the controller, the antenna assembly including: an array of antenna elements, each antenna element having: an active patch; and a passive patch separated from the active patch by a slot; wherein one of the active patch and the passive patch has a greater surface area than the other of the active patch and the passive patch.

公开(公告)号：US20190288402A1

公开(公告)日：2019-09-19

申请号：US15923680

申请日：2018-03-16

Applicant: PERASO TECHNOLOGIES INC.

Inventor： Atabak RASHIDIAN

IPC: H01Q21/22 ,  H01Q1/48 ,  H01Q1/38 ,  H01Q21/06

Abstract: A wireless communications assembly includes: a primary board including: (i) an upper surface bearing a radio controller, and defining a set of control contacts for connection to respective ports of the radio controller; (ii) a lower surface opposite the upper surface, the lower surface defining a plurality of antenna contacts; (iii) a plurality of conduits extending through the primary board from the antenna contacts to the control contacts; and (iv) an antenna ground plane; a superstrate board including: (i) an inner surface facing the lower surface of the primary board; (ii) an outer surface opposite the inner surface; (iii) a phased array of antenna elements disposed on the inner surface; and a surface-mount package between the lower surface and the inner surface for connecting a subset of the antenna contacts directly to the antenna elements and to provide a substrate between the antenna elements and the antenna ground layer.

公开(公告)号：US20180159247A1

公开(公告)日：2018-06-07

申请号：US15367388

申请日：2016-12-02

Applicant: PERASO TECHNOLOGIES INC.

Inventor： Atabak RASHIDIAN

IPC: H01Q21/06 ,  H01Q1/40 ,  H01Q1/48 ,  H01Q15/16

CPC classification number: H01Q21/065 ,  H01Q1/525 ,  H01Q19/17 ,  H01Q21/0075 ,  H01Q21/20

Abstract: An antenna assembly includes: a support member having opposing first and second sides; an input electrical contact and an output electrical contact; a first array of transmission patch elements supported on the first side and connected to the input electrical contact, the first array configured to receive an input signal via the input electrical contact and generate outbound radiation according to the input signal; a second array of reception patch elements supported on the first side and connected to the output electrical contact, the second array configured to receive inbound radiation and generate an output signal at the output electrical contact according to the outbound radiation; the first array and the second array having a common phase center.