中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

106 records (took 0.021 seconds)

    System and method for latching a micro-structure and a process for fabricating a micro-latching structure
    11.
    发明授权
    System and method for latching a micro-structure and a process for fabricating a micro-latching structure 失效
    用于锁定微结构的系统和方法以及用于制造微型锁存结构的工艺

    公开(公告)号：US06617185B1

    公开(公告)日：2003-09-09

    申请号：US10071772

    申请日：2002-02-07

    Applicant: Aaron Geisberger

    Inventor： Aaron Geisberger

    IPC: H01L2100

    CPC classification number: B81C1/00126 ,  B81B2201/031 ,  B81B2201/13 ,  B81C2201/0109 ,  H01H2001/0047 ,  H01H2001/0063 ,  H01H2061/006

    Abstract: In one embodiment, the present invention is directed to a method of fabricating a micro-mechanical latching device, comprising: depositing a structural layer in a fabrication plane, wherein the first structural layer possesses a topography; depositing a sacrificial layer adjacent to the first layer such that the sacrificial layer conforms to the topography of the first layer; depositing a second structural layer that conforms to the topography of the first layer; removing the sacrificial layer; and using at least the first structural layer and second structural layer to fabricate the micro-mechanical latching device.

    Abstract translation: 在一个实施例中，本发明涉及一种制造微机械闭锁装置的方法，包括：在制造平面中沉积结构层，其中所述第一结构层具有形貌; 沉积与第一层相邻的牺牲层，使得牺牲层符合第一层的形貌; 沉积符合第一层的形貌的第二结构层; 去除牺牲层; 并且至少使用第一结构层和第二结构层来制造微机械闭锁装置。

    Bi-directional, single material thermal actuator
    12.
    发明授权
    Bi-directional, single material thermal actuator 有权
    双向单材料热传动器

    公开(公告)号：US06608714B2

    公开(公告)日：2003-08-19

    申请号：US09892616

    申请日：2001-06-28

    Applicant: Heather Shannon Hanson ,  Joseph Nathan Mitchell

    Inventor： Heather Shannon Hanson ,  Joseph Nathan Mitchell

    IPC: G02B2600

    CPC classification number: B81B3/0024 ,  B81B2201/031 ,  B81B2201/11 ,  B81B2203/055 ,  H01H2061/008

    Abstract: A thermal actuator includes a first arm having a proximal end and a distal end, a second arm, parallel to the first arm, having a proximal end and a distal end, and a third arm arranged between and parallel to the first and second arms, the third arm having a proximal end and a distal end. The third arm has at least one portion at the distal end of the third arm having a width that is substantially larger than a width of the first arm and a width of the second arm. The distal ends of the first, second and third arms are coupled together to form a distal end of the thermal actuator, and the first, second and third arms preferably are made of a single material. A number of thermal actuators can be arranged in an array. The thermal actuator or array of thermal actuators can be coupled to an applicator.

    Abstract translation: 热致动器包括具有近端和远端的第一臂，平行于第一臂的第二臂，具有近端和远端，以及布置在第一臂和第二臂之间并平行于第一臂的第三臂， 第三臂具有近端和远端。 第三臂具有在第三臂的远端处的至少一个部分，其宽度基本上大于第一臂的宽度和第二臂的宽度。 第一，第二和第三臂的远端联接在一起以形成热致动器的远端，并且第一，第二和第三臂优选地由单一材料制成。 许多热致动器可以排列成阵列。 热致动器或热致动器阵列可以耦合到施加器。

    Direct acting vertical thermal actuator with controlled bending
    13.
    发明申请
    Direct acting vertical thermal actuator with controlled bending 审中-公开
    具有受控弯曲的直接作用垂直热致动器

    公开(公告)号：US20030137389A1

    公开(公告)日：2003-07-24

    申请号：US10313621

    申请日：2002-12-09

    Applicant: 3M Innovative Properties Company

    Inventor： Billy L. Weaver ,  Douglas P. Goetz ,  Kathy L. Hagen ,  Mike E. Hamerly ,  Robert G. Smith ,  Silva K. Theiss

    IPC: H01H061/00

    CPC classification number: B81B3/0024 ,  B81B3/0037 ,  B81B2201/031 ,  B81B2201/045 ,  B81B2203/0109 ,  B81B2203/0118 ,  B81B2203/058 ,  B82Y15/00 ,  H01H2061/006 ,  H01H2061/008

    Abstract: A micrometer sized, single-stage, vertical thermal actuator with controlled bending capable of repeatable and rapid movement of a micrometer-sized optical device off the surface of a substrate. The vertical thermal actuator is constructed on a surface of a substrate. At least one hot arm has a first end anchored to the surface and a free end located above the surface. A cold arm has a first end anchored to the surface and a free end. The cold arm is located above the hot arm relative to the surface. The cold arm is adapted to provide controlled bending near the first end thereof. A member mechanically and electrically couples the free ends of the hot and cold arms such that the actuator bends generally at the flexure so that the member moves away from the substrate when current is applied to at least the hot arm.

    Abstract translation: 具有受控弯曲的微米尺寸的单级垂直热致动器，其能够将微米尺寸的光学器件重复并快速移动离开衬底的表面。 垂直热致动器构造在基板的表面上。 至少一个热臂具有锚固在表面上的第一端和位于表面上方的自由端。 冷臂具有锚固在表面上的第一端和自由端。 冷臂相对于表面位于热臂上方。 冷臂适于在其第一端附近提供受控的弯曲。 机构和电气耦合热臂和冷臂的自由端，使得致动器大体上弯曲弯曲，使得当电流施加到至少热臂时，构件移动离开衬底。

    Integrated electromechanical switch and tunable capacitor and method of making the same
    14.
    发明申请
    Integrated electromechanical switch and tunable capacitor and method of making the same 有权
    集成机电开关和可调谐电容器及其制造方法

    公开(公告)号：US20020171121A1

    公开(公告)日：2002-11-21

    申请号：US10147300

    申请日：2002-05-17

    Inventor： Mehmet Ozgur

    IPC: H01L029/00

    CPC classification number: H01H1/0036 ,  B81B2201/014 ,  B81B2201/031 ,  B81C1/00246 ,  B81C2203/0735 ,  H01H61/00 ,  H01H2061/006

    Abstract: A monolithically integrated, electromechanical microwave switch, capable of handling signals from DC to millimeter-wave frequencies, and an integrated electromechanical tunable capacitor are described. Both electromechanical devices include movable beams actuated either by thermo-mechanical or by electrostatic forces. The devices are fabricated directly on finished silicon-based integrated circuit wafers, such as CMOS, BiCMOS or bipolar wafers. The movable beams are formed by selectively removing the supporting silicon underneath the thin films available in a silicon-based integrated circuit technology, which incorporates at least one polysilicon layer and two metallization layers. A cavity and a thick, low-loss metallization are used to form an electrode above the movable beam. A thick mechanical support layer is formed on regions where the cavity is located, or substrate is bulk-micro-machined, i.e., etched.

    Abstract translation: 描述了能够处理从DC到毫米波频率的信号的单片集成的机电微波开关，以及集成的机电可调电容器。 两个机电装置都包括通过热机械或静电力而致动的可移动梁。 这些器件直接在成品硅基集成电路晶片上制造，例如CMOS，BiCMOS或双极晶片。 可移动光束通过选择性地去除在基于硅的集成电路技术中可用的薄膜下面的支撑硅而形成，该技术包括至少一个多晶硅层和两个金属化层。 使用空腔和厚的低损耗金属化在可动梁的上方形成电极。 在空腔所在的区域上形成厚的机械支撑层，或者衬底被体微加工，即蚀刻。

    Silicon micromachined optical device
    15.
    发明申请
    Silicon micromachined optical device 失效
    硅微加工光学器件

    公开(公告)号：US20020135864A1

    公开(公告)日：2002-09-26

    申请号：US09843024

    申请日：2001-04-25

    Inventor： Chen-Wei Chiu ,  Aramais Avakian ,  Tom Tsao ,  Fukang Jiang ,  Jeff Dickson ,  Yu-Chong Tai

    IPC: G02F001/29

    CPC classification number: G02B6/3566 ,  B81B3/0051 ,  B81B2201/031 ,  B81B2201/045 ,  B81B2203/0118 ,  B81B2203/058 ,  B81C1/00214 ,  G02B6/3518 ,  G02B6/3546 ,  G02B6/3572 ,  G02B6/3576 ,  G02B6/3584 ,  G02B6/3594

    Abstract: An apparatus at least partially intercepts a plurality of light beams propagating along a respective plurality of beam paths. The apparatus includes a single crystal silicon substrate and an array including a plurality of modules. Each module includes a reflector comprising single crystal silicon and a reflector surface lying in a reflector plane substantially perpendicular to the substrate surface. Each module further includes a reflector support which mounts the reflector to move substantially within the reflector plane with a displacement component along the surface normal direction of the substrate surface. Each module further includes a reflector driver responsive to electrical current to selectively move the reflector between a first position and a second position.

    Abstract translation: 一种装置至少部分截取沿着相应的多个光束路径传播的多个光束。 该装置包括单晶硅衬底和包括多个模块的阵列。 每个模块包括反射器，其包括单晶硅和位于基本上垂直于衬底表面的反射器平面中的反射器表面。 每个模块还包括反射器支撑件，其将反射器安装成基本上在反射器平面内，沿着基板表面的法线方向具有位移分量。 每个模块还包括响应于电流的反射器驱动器，以在第一位置和第二位置之间选择性地移动反射器。

    Microelectromechanical systems including thermally actuated beams on heaters that move with the thermally actuated beams
    16.
    发明授权
    Microelectromechanical systems including thermally actuated beams on heaters that move with the thermally actuated beams 失效
    微机电系统包括加热器上的热致动梁，其与热致动梁一起移动

    公开(公告)号：US06333583B1

    公开(公告)日：2001-12-25

    申请号：US09537588

    申请日：2000-03-28

    Applicant: Ramaswamy Mahadevan ,  Edward A. Hill ,  Robert L. Wood ,  Allen Cowen

    Inventor： Ramaswamy Mahadevan ,  Edward A. Hill ,  Robert L. Wood ,  Allen Cowen

    IPC: H01N1000

    CPC classification number: B81B3/0024 ,  B81B2201/031 ,  B81B2203/0109 ,  B81B2203/051 ,  F03G7/06 ,  H01H1/0036 ,  H01H61/02 ,  H01H2001/0068 ,  H01H2061/006

    Abstract: Improved microelectromechanical structures include spaced-apart supports on a microelectronic substrate and a beam that extends between the spaced-apart supports and that expands upon application of heat thereto to thereby cause displacement of the beam between the spaced-apart supports. A heater, located on the beam, applies heat to the beam and displaces with the beam as the beam displaces. Therefore, heat can be directly applied to the arched beam, thereby reducing thermal loss between the heater and the arched beam. Furthermore, an air gap between the heater and arched beam may not need to be heated, thereby allowing improved transient thermal response. Moreover, displacing the heater as the arched beam displaces may further reduce thermal loss and transient thermal response by reducing the separation between the heater and the arched beam as the arched beam displaces.

    Abstract translation: 改进的微机电结构包括微电子衬底上的间隔开的支撑件和在间隔开的支撑件之间延伸的梁，并且在施加热量时膨胀，从而导致梁在间隔开的支撑件之间的位移。 位于梁上的加热器对梁施加热量，并随着梁的移位而与梁一起移位。 因此，可以将热量直接施加到拱形梁上，从而减少加热器与拱形梁之间的热损失。 此外，加热器和拱形梁之间的空气间隙可能不需要被加热，从而允许改善的瞬态热响应。 此外，当拱形梁移位时移动加热器可以通过当拱形梁移位时减小加热器和拱形梁之间的间隔来进一步减少热损失和瞬态热响应。

    Microactuators including a metal layer on distal portions of an arched beam
    17.
    发明授权
    Microactuators including a metal layer on distal portions of an arched beam 有权
    微型致动器包括在拱形梁的远端部分上的金属层

    公开(公告)号：US06255757B1

    公开(公告)日：2001-07-03

    申请号：US09388321

    申请日：1999-09-01

    Applicant: Vijayakumar R. Dhuler ,  Mark David Walters

    Inventor： Vijayakumar R. Dhuler ,  Mark David Walters

    IPC: H02N1000

    CPC classification number: F15C5/00 ,  B81B3/0051 ,  B81B2201/031 ,  B81B2201/054 ,  B81B2203/0109 ,  B81B2203/051 ,  B81C2203/031 ,  B81C2203/036 ,  F16K99/0001 ,  F16K99/0007 ,  F16K99/0009 ,  F16K99/0011 ,  F16K99/0036 ,  F16K2099/0074 ,  F16K2099/008 ,  H01H2001/0042

    Abstract: A microelectromechanical (MEMS) device is provided that includes a microelectronic substrate and a thermally actuated microactuator and associated components disposed on the substrate and formed as a unitary structure from a single crystalline material, wherein the associated components arc actuated by the microactuator upon thermal actuation thereof. For example, the MEMS device may be a valve. As such, the valve may include at least one valve plate that is controllably brought into engagement with at least one valve opening in the microelectronic substrate by selective actuation of the microactuator. While the MEMS device can include various microactuators, the microactuator advantageously includes a pair of spaced apart supports disposed on the substrate and at least one arched beam extending therebetween. By heating the at least one arched beam of the microactuator, the arched beams will further arch such that the microactuator moves between a closed position in which the valve plate sealingly engages the valve opening and an open position in which the valve plate is at least partly disengaged from and does not seal the valve opening. The microactuator may further include metallization traces on distal portions of the arched beams to constrain the thermally actuated regions of arched beams to medial portions thereof. The valve may also include a latch for maintaining the valve plate in a desired position without requiring continuous energy input to the microactuator. An advantageous method for fabricating a MEMS valve having unitary structure single crystalline components is also provided.

    Abstract translation: 提供了一种微机电（MEMS）装置，其包括微电子基板和热致动微致动器以及设置在基板上并由单晶材料形成为单一结构的相关部件，其中相关联的部件由微致动器在其热致动时被致动 。 例如，MEMS器件可以是阀。 因此，阀可以包括至少一个阀板，该阀板通过选择性地致动微致动器而可控制地与微电子衬底中的至少一个阀开口接合。 虽然MEMS器件可以包括各种微致动器，微致动器有利地包括设置在基板上的一对间隔开的支撑件和在其间延伸的至少一个拱形梁。 通过加热微致动器的至少一个拱形梁，拱形梁将进一步拱起，使得微致动器在关闭位置之间移动，在该关闭位置中阀板密封地接合阀开口和打开位置，在该位置阀板至少部分地 与阀开口脱离并不密封。 微致动器还可以包括在拱形梁的远侧部分上的金属化迹线，以将拱形梁的热致动区域约束到其中间部分。 阀还可以包括用于将阀板保持在期望位置的闩锁，而不需要连续的能量输入到微致动器。 还提供了一种用于制造具有单一结构单晶组件的MEMS阀的有利方法。

Patent Agency Ranking