公开(公告)号：US09556019B2

公开(公告)日：2017-01-31

申请号：US14705630

申请日：2015-05-06

Applicant: InvenSense, Inc.

Inventor： Michael Dueweke ,  Martin Lim

IPC: H01L29/84 ,  B81C1/00 ,  B81B7/00

CPC classification number: B81B7/0038 ,  B81B7/02 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/00285 ,  B81C1/00293 ,  B81C2201/0161 ,  B81C2203/0785

Abstract: A method and system for changing a pressure within at least one enclosure in a MEMS device are disclosed. In a first aspect, the method comprises applying a laser through one of the at least two substrates onto a material which changes the pressure within at least one enclosure when exposed to the laser, wherein the at least one enclosure is formed by the at least two substrates. In a second aspect, the system comprises a MEMS device that includes a first substrate, a second substrate bonded to the first substrate, wherein at least one enclosure is located between the first and the second substrates, a metal layer within one of the first substrate and the second substrate, and a material vertically oriented over the metal layer, wherein when the material is heated the material changes a pressure within the at least one enclosure.

Abstract translation: 公开了一种用于改变MEMS装置中的至少一个外壳内的压力的方法和系统。 在第一方面，所述方法包括将激光通过所述至少两个基板之一施加到当暴露于所述激光器时改变至少一个外壳内的压力的材料，其中所述至少一个外壳由所述至少两个基板形成 底物。 在第二方面，该系统包括MEMS器件，其包括第一衬底，与第一衬底结合的第二衬底，其中至少一个外壳位于第一和第二衬底之间，第一衬底之一内的金属层 和第二基底以及垂直取向在金属层上的材料，其中当材料被加热时，材料改变至少一个外壳内的压力。

公开(公告)号：US20050225413A1

公开(公告)日：2005-10-13

申请号：US11145745

申请日：2005-06-06

Applicant: Michael Kozicki ,  Anthony Walton ,  Stefan Enderling

Inventor： Michael Kozicki ,  Anthony Walton ,  Stefan Enderling

IPC: B81B3/00 ,  H01L21/00 ,  H03H3/007 ,  H03H9/24

CPC classification number: H03H3/0072 ,  B81B3/0078 ,  B81B2201/0271 ,  B81C2201/0161 ,  H03H9/2457 ,  H03H9/2463

Abstract: A microelectromechanical structure and device and methods of forming and using the structure and device are disclosed. The structure includes a mechanical element, an ion conductor and a plurality of electrodes. Mechanical properties of the structure are altered by applying a bias across the electrodes. Such structures can be used to form devices such as resonators for RF applications.

Abstract translation: 公开了一种微机电结构及其结构和装置的形成和使用方法。 该结构包括机械元件，离子导体和多个电极。 通过在电极上施加偏压来改变结构的机械性能。 这种结构可以用于形成用于RF应用的诸如谐振器的器件。

公开(公告)号：US20030045019A1

公开(公告)日：2003-03-06

申请号：US10231962

申请日：2002-08-30

Applicant: HRL LABORATORIES, LLC

Inventor： Randall L. Kubena

IPC: H01L021/00

CPC classification number: B81C1/00206 ,  B81B2201/0214 ,  B81C1/00904 ,  B81C2201/0161 ,  G01N29/036 ,  G01N2291/0256

Abstract: A method for fabricating a sensor for chemical and/or biological materials, comprising steps of providing a wafer comprising a plurality of cantilever assemblies, each of the assemblies comprising a cantilever member and a micro-channel plate bonded to the cantilever member, the micro-channel plate further comprising a micro-channel, functionalizing each of the cantilevers by directing a flow of a plurality of functionalizing materials through the micro-channels, and dicing the wafer into a plurality of the sensors. Each of the cantilever assemblies comprises substrate comprising control and sense electrodes deposited on its top side and scribe marks etched on its back side; a cantilever member comprising a cantilever, a seed layer and a contact pad formed on top side of the cantilever member; and the micro-channel plate comprises a micro-channel housing defining the micro-channel etched through the housing, wherein the back side of the cantilever member is bonded to the substrate and the micro-channel plate is bonded to said top side of the cantilever member. Control electronics are incorporated into the substrate for a completely integrated design.

Abstract translation: 一种用于制造用于化学和/或生物材料的传感器的方法，包括提供包括多个悬臂组件的晶片的步骤，每个组件包括悬臂构件和结合到悬臂构件的微通道板， 通道板还包括微通道，通过引导多个功能化材料的流动通过微通道来对每个悬臂进行功能化，并将晶片切割成多个传感器。 每个悬臂组件包括包括沉积在其顶侧上的控制和感测电极的基板以及在其背面蚀刻的划痕; 悬臂构件，其包括形成在悬臂构件的顶侧上的悬臂，种子层和接触垫; 并且所述微通道板包括限定通过所述壳体蚀刻的所述微通道的微通道壳体，其中所述悬臂构件的背面接合到所述基板，并且所述微通道板结合到所述悬臂的所述顶侧 会员。 控制电子器件集成到基板中，用于完全集成的设计。