COMPOSTABLE AND ANTIMICROBIAL MATERIAL FOR USE IN PACKAGING MATERIAL

    公开(公告)号:US20240117180A1

    公开(公告)日:2024-04-11

    申请号:US18518898

    申请日:2023-11-24

    Applicant: Gene Benfatti

    Inventor: Gene Benfatti

    Abstract: A compostable and antimicrobial material for packaging products, in particular the packaging products for foodstuffs, vegetables, fruits, and the like. The compostable and antimicrobial material includes 1-5 parts polylactic acid, 93.5-99.4 parts of polybutylene terephthalate adipate, 0.6-1.5 parts of antimicrobial material, 0.1-0.5 parts of lubricant, 0.3-0.8 parts of antioxidant, 10-15 parts of filler, 1-3 parts of plasticizer, Defoamer 0.1-0.2 parts, antihydrolytic agent 0.5-1 part. The antimicrobial material includes the following parts by weight: 1-2 parts of halloysite nanotubes, 0.2-0.5 wormwood extract, 1.5-2 parts of ethanol, 0.3-0.6 parts of polyglyceryl sebacate, 0.4-0.7 parts of bamboo fiber, 0.1-0.3 parts of loofah fiber emulsion.

    Biodegradable Composite Material for Electronic Devices and Electrical Engineering

    公开(公告)号:US20240110057A1

    公开(公告)日:2024-04-04

    申请号:US18220830

    申请日:2023-07-12

    CPC classification number: C08L67/04 H05K1/036 C08L2201/06

    Abstract: The application describes a multilayer biodegradable electrically insulating composite material consisting of compressed layers of glass cloth or fiberglass pre-impregnated with a biodegradable polymer binder or alternately stacked layers of glass fiber and a polymer binder film. The developed material is close in its characteristics to the substrates of commercial printed circuit boards. Biodegradable electrically insulating composite material can be used as a substrate for creating single-sided or double-sided or multilayer printed circuit boards based on them, and can also be used to manufacture various electrical insulating materials and structures.

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