INTERLEAVING LASER ABLATION
    13.
    发明申请

    公开(公告)号:US20180321566A1

    公开(公告)日:2018-11-08

    申请号:US15940915

    申请日:2018-03-29

    Abstract: A product includes a substrate, at least one of a conductive layer or a coating layer, and an ablated surface on the substrate. The substrate is at least partially transparent to visible light. The at least one of the conductive layer or the coating layer are disposed over at least a portion of the substrate. The ablated surface includes an interleaved surface profile having a plurality of non-overlapped laser spots and a plurality of overlapped laser spots formed by subjecting the substrate to an interleaving laser ablation process.

Patent Agency Ranking