公开(公告)号：USRE49773E1

公开(公告)日：2024-01-02

申请号：US17323779

申请日：2021-05-18

Applicant: NANOPAREIL, LLC

Inventor： Todd J. Menkhaus ,  Hao Fong

IPC: B01D39/16 ,  B01D15/32 ,  B01D15/36 ,  B01D15/38 ,  B01J20/24 ,  B01J20/28 ,  B01J20/32 ,  C07K1/22 ,  D01D5/00 ,  D01F2/24 ,  D01F6/44 ,  D01F6/88 ,  H01L23/48 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

CPC classification number: B01D39/1615 ,  B01D15/327 ,  B01D15/361 ,  B01D15/3809 ,  B01D39/1623 ,  B01D39/1676 ,  B01J20/24 ,  B01J20/28007 ,  B01J20/28038 ,  B01J20/3212 ,  B01J20/3217 ,  B01J20/3248 ,  B01J20/3293 ,  C07K1/22 ,  D01D5/003 ,  D01D5/0007 ,  D01F2/24 ,  D01F6/44 ,  D01F6/88 ,  H01L23/48 ,  H01L24/72 ,  H01L24/73 ,  H01L24/90 ,  H01L24/91 ,  H01L25/0652 ,  H01L25/50 ,  B01D15/3804 ,  B01D2239/025 ,  B01D2239/0414 ,  H01L24/16 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/73201 ,  H01L2224/81138 ,  H01L2224/81815 ,  H01L2224/9211 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06531 ,  H01L2225/06562 ,  H01L2225/06593 ,  H01L2924/0002 ,  H01L2924/157 ,  H01L2924/1579 ,  H01L2924/15153 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/3511 ,  H01L2924/37001 ,  H01L2924/0002 ,  H01L2924/00 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2224/131 ,  H01L2924/014 ,  H01L2224/73201 ,  H01L2224/16 ,  H01L2224/72 ,  H01L2224/9211 ,  H01L2224/81 ,  H01L2224/90 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2224/81138 ,  H01L2924/00012

Abstract: The present invention relates generally to compositions for use in biological and chemical separations, as well as other applications. More specifically, the present invention relates to hybrid felts fabricated from electrospun nanofibers with high permeance and high capacity. Such hybrid felts utilize derivatized cellulose, and at least one non-cellulose-based polymer that may be removed from the felt by subjecting it to moderately elevated temperatures and/or solvents capable of dissolving the non-cellulose-based polymer to leave behind a porous nanofiber felt having more uniform pore sizes and other enhanced properties when compared to single component nanofiber felts.

公开(公告)号：US10026717B2

公开(公告)日：2018-07-17

申请号：US15430943

申请日：2017-02-13

Applicant: Invensas Corporation

Inventor： Cyprian Emeka Uzoh ,  Rajesh Katkar

IPC: H01L25/065 ,  H01L23/00 ,  H01L49/02 ,  B81B7/00

CPC classification number: H01L25/0657 ,  B81B7/0074 ,  B81C1/0023 ,  H01L21/4853 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/522 ,  H01L23/5383 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/24 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/16 ,  H01L25/50 ,  H01L28/10 ,  H01L28/20 ,  H01L28/40 ,  H01L2224/0239 ,  H01L2224/0332 ,  H01L2224/0333 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0347 ,  H01L2224/03614 ,  H01L2224/0391 ,  H01L2224/03912 ,  H01L2224/03914 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05169 ,  H01L2224/05184 ,  H01L2224/05547 ,  H01L2224/05565 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/05611 ,  H01L2224/05616 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05669 ,  H01L2224/05684 ,  H01L2224/1134 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11903 ,  H01L2224/1191 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13025 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2224/13184 ,  H01L2224/13565 ,  H01L2224/13616 ,  H01L2224/1403 ,  H01L2224/14131 ,  H01L2224/14132 ,  H01L2224/14134 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/17181 ,  H01L2224/24147 ,  H01L2224/24227 ,  H01L2224/244 ,  H01L2224/32145 ,  H01L2224/3303 ,  H01L2224/33181 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48149 ,  H01L2224/4903 ,  H01L2224/73201 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81825 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1461 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16251 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/3841 ,  H01L2924/00 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/01028 ,  H01L2224/05 ,  H01L2224/13 ,  H01L2224/81 ,  H01L2224/45099

Abstract: Apparatuses relating generally to a substrate are disclosed. In such an apparatus, first wire bond wires (“first wires”) extend from a surface of the substrate. Second wire bond wires (“second wires”) extend from the surface of the substrate. The first wires and the second wires are external to the substrate. The first wires are disposed at least partially within the second wires. The first wires are of a first height. The second wires are of a second height greater than the first height for coupling of at least one electronic component to the first wires at least partially disposed within the second wires.

公开(公告)号：US09553079B1

公开(公告)日：2017-01-24

申请号：US14969765

申请日：2015-12-15

Applicant: International Business Machines Corporation

Inventor： Jean Audet ,  Luc G. Guerin ,  Richard Langlois ,  Stephan L. Martel ,  Sylvain E. Ouimet

IPC: H01L21/00 ,  H01L25/16 ,  H01L23/00 ,  H01L21/56 ,  H01L23/498 ,  H01L49/02

CPC classification number: H01L24/08 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/73 ,  H01L24/81 ,  H01L25/16 ,  H01L28/40 ,  H01L2224/0401 ,  H01L2224/08265 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/16265 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/73201 ,  H01L2224/73204 ,  H01L2224/80815 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/81986 ,  H01L2224/92125 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A flip chip assembly is disclosed that includes a die with die circuitry and a plurality of electrical contacts electrically connected to the die circuitry. A substrate includes electrical contacts that are juxtaposed with and electrically connected to corresponding die electrical contacts. A passive component is disposed between the die and the substrate, and includes a dielectric disposed between a first electrode and a second electrode. The first electrode is electrically connected to a first of the die electrical contacts and a corresponding substrate electrical contact, and the second electrode is electrically connected to a second of the die electrical contacts and a corresponding substrate electrical contact.

Abstract translation: 公开了一种倒装芯片组件，其包括具有管芯电路的管芯和电连接到管芯电路的多个电触点。 衬底包括与相应的管芯电触头并置并电连接的电触头。 无源部件设置在管芯和衬底之间，并且包括设置在第一电极和第二电极之间的电介质。 第一电极电连接到第一管芯电触点和对应的衬底电接触，并且第二电极电连接到第二管芯电触点和相应的衬底电接触。

公开(公告)号：US20150380367A1

公开(公告)日：2015-12-31

申请号：US14717606

申请日：2015-05-20

Applicant: Semiconductor Manufacturing International (Shanghai) Corporation

Inventor： Fucheng CHEN

IPC: H01L23/00

CPC classification number: H01L24/05 ,  H01L24/03 ,  H01L24/06 ,  H01L24/08 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/80 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02175 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0381 ,  H01L2224/03831 ,  H01L2224/04 ,  H01L2224/0401 ,  H01L2224/05018 ,  H01L2224/05027 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05181 ,  H01L2224/05187 ,  H01L2224/05558 ,  H01L2224/05562 ,  H01L2224/05572 ,  H01L2224/05611 ,  H01L2224/05647 ,  H01L2224/05681 ,  H01L2224/05687 ,  H01L2224/06051 ,  H01L2224/061 ,  H01L2224/06505 ,  H01L2224/08058 ,  H01L2224/08111 ,  H01L2224/08145 ,  H01L2224/10145 ,  H01L2224/1148 ,  H01L2224/1181 ,  H01L2224/13022 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16058 ,  H01L2224/16145 ,  H01L2224/27831 ,  H01L2224/29187 ,  H01L2224/32145 ,  H01L2224/73101 ,  H01L2224/73104 ,  H01L2224/73201 ,  H01L2224/73204 ,  H01L2224/80011 ,  H01L2224/80012 ,  H01L2224/80203 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/81011 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81895 ,  H01L2224/81948 ,  H01L2224/83011 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83896 ,  H01L2224/83948 ,  H01L2224/9211 ,  H01L2225/06513 ,  H01L2225/06555 ,  H01L2225/06593 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/00014 ,  H01L2924/04941 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/05442 ,  H01L2924/059 ,  H01L2924/04642 ,  H01L2924/05042 ,  H01L2224/05 ,  H01L2224/13 ,  H01L2224/08 ,  H01L2224/16 ,  H01L2224/80 ,  H01L2924/00

Abstract: A chip includes a substrate and a dielectric layer disposed on the substrate. The dielectric layer includes a first dielectric region and a second dielectric region surrounding an outer periphery of the first dielectric region. A top surface of the first dielectric region is disposed below a top surface of the second dielectric region. The chip further includes a metal pad disposed in a through-hole in the first dielectric region and contacting a portion of the substrate.

Abstract translation: 芯片包括衬底和设置在衬底上的电介质层。 电介质层包括第一电介质区域和围绕第一电介质区域的外围的第二电介质区域。 第一电介质区域的顶表面设置在第二电介质区域的顶表面下方。 芯片还包括设置在第一电介质区域中的通孔中并与衬底的一部分接触的金属焊盘。

公开(公告)号：US20150187701A1

公开(公告)日：2015-07-02

申请号：US14141000

申请日：2013-12-26

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Shu-Ting Tsai ,  Dun-Nian Yaung ,  Jen-Cheng Liu ,  Szu-Ying Chen ,  U-Ting Chen

IPC: H01L23/538 ,  H01L25/00 ,  H01L25/065

CPC classification number: H01L25/50 ,  H01L21/76805 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/08 ,  H01L24/24 ,  H01L24/73 ,  H01L24/80 ,  H01L24/82 ,  H01L24/92 ,  H01L25/0657 ,  H01L2224/08145 ,  H01L2224/2405 ,  H01L2224/24146 ,  H01L2224/24147 ,  H01L2224/245 ,  H01L2224/73201 ,  H01L2224/73251 ,  H01L2224/80894 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/82101 ,  H01L2224/82106 ,  H01L2224/82931 ,  H01L2224/82947 ,  H01L2224/9202 ,  H01L2224/9212 ,  H01L2224/9222 ,  H01L2225/06544 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/00012 ,  H01L2924/01074 ,  H01L2924/01029 ,  H01L2924/01013 ,  H01L2224/08 ,  H01L2224/24 ,  H01L2224/80 ,  H01L2224/82 ,  H01L2224/8203 ,  H01L2224/821 ,  H01L2224/80001 ,  H01L2924/00

Abstract: Semiconductor devices and methods of manufacture thereof are disclosed. In some embodiments, a semiconductor device includes a first semiconductor chip including a first substrate and a first conductive feature formed over the first substrate, and a second semiconductor chip bonded to the first semiconductor chip. The second semiconductor chip includes a second substrate and a second conductive feature formed over the second substrate. A conductive plug is disposed through the first conductive feature and is coupled to the second conductive feature. The conductive plug includes a first portion disposed over the first conductive feature, the first portion having a first width, and a second portion disposed beneath or within the first conductive feature. The second portion has a second width. The first width is greater than the second width.

Abstract translation: 公开了半导体器件及其制造方法。 在一些实施例中，半导体器件包括第一半导体芯片，第一半导体芯片包括第一衬底和形成在第一衬底上的第一导电特征，以及接合到第一半导体芯片的第二半导体芯片。 第二半导体芯片包括形成在第二基板上的第二基板和第二导电特征。 导电插头设置穿过第一导电特征并耦合到第二导电特征。 导电插塞包括设置在第一导电特征上的第一部分，第一部分具有第一宽度，以及设置在第一导电特征之下或之内的第二部分。 第二部分具有第二宽度。 第一宽度大于第二宽度。

公开(公告)号：US08742576B2

公开(公告)日：2014-06-03

申请号：US13397593

申请日：2012-02-15

Applicant: Hiren D. Thacker ,  Hyung Suk Yang ,  Ivan Shubin ,  John E. Cunningham

Inventor： Hiren D. Thacker ,  Hyung Suk Yang ,  Ivan Shubin ,  John E. Cunningham

IPC: H01L23/48 ,  H01L23/498 ,  H01L21/50

CPC classification number: H01L25/0652 ,  H01L23/48 ,  H01L24/16 ,  H01L24/72 ,  H01L24/73 ,  H01L24/90 ,  H01L24/91 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/73201 ,  H01L2224/73251 ,  H01L2224/81138 ,  H01L2224/81815 ,  H01L2224/9211 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06531 ,  H01L2225/06562 ,  H01L2225/06593 ,  H01L2924/15153 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/3511 ,  H01L2924/37001 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/16 ,  H01L2224/72 ,  H01L2224/81 ,  H01L2224/90 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An MCM includes a two-dimensional array of facing chips, including island chips and bridge chips that communicate with each other using overlapping connectors. In order to maintain the relative vertical spacing of these connectors, compressible structures are in cavities in a substrate, which house the bridge chips, provide a compressive force on back surfaces of the bridge chips. These compressible structures include a compliant material with shape and volume compression. In this way, the MCM may ensure that facing surfaces of the island chips and the bridge chips, as well as connectors on these surfaces, are approximately coplanar without bending the bridge chips.

Abstract translation: MCM包括面向芯片的二维阵列，包括使用重叠连接器彼此通信的岛芯片和桥芯片。 为了保持这些连接器的相对垂直间隔，可压缩结构位于衬底中的空腔中，其容纳桥芯片，在桥芯片的后表面上提供压缩力。 这些可压缩结构包括具有形状和体积压缩的柔性材料。 以这种方式，MCM可以确保岛芯片和桥芯片的面对表面以及这些表面上的连接器在不弯曲桥接芯片的情况下大致共面。

公开(公告)号：US08633600B2

公开(公告)日：2014-01-21

申请号：US12886851

申请日：2010-09-21

Applicant: Manfred Mengel ,  Joachim Mahler ,  Khalil Hosseini

Inventor： Manfred Mengel ,  Joachim Mahler ,  Khalil Hosseini

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/83 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73201 ,  H01L2224/73204 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01032 ,  H01L2924/01031 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/0401

Abstract: A device includes a semiconductor material having a first surface. A first material is applied to the first surface and a fiber material is embedded in the first material.

Abstract translation: 一种器件包括具有第一表面的半导体材料。 将第一材料施加到第一表面，并且将纤维材料嵌入第一材料中。

公开(公告)号：US20120068364A1

公开(公告)日：2012-03-22

申请号：US12886851

申请日：2010-09-21

Applicant: Manfred Mengel ,  Joachim Mahler ,  Khalil Hosseini

Inventor： Manfred Mengel ,  Joachim Mahler ,  Khalil Hosseini

IPC: H01L23/485 ,  H01L21/78 ,  H01L23/488

CPC classification number: H01L24/83 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73201 ,  H01L2224/73204 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01032 ,  H01L2924/01031 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/0401

Abstract: A device includes a semiconductor material having a first surface. A first material is applied to the first surface and a fiber material is embedded in the first material.

Abstract translation: 一种器件包括具有第一表面的半导体材料。 将第一材料施加到第一表面，并且将纤维材料嵌入第一材料中。

公开(公告)号：US20180301436A1

公开(公告)日：2018-10-18

申请号：US16008531

申请日：2018-06-14

Applicant: Invensas Corporation

Inventor： Cyprian Emeka Uzoh ,  Rajesh Katkar

IPC: H01L25/065 ,  H01L49/02 ,  B81B7/00 ,  H01L25/00 ,  H01L25/16 ,  H01L23/00 ,  H01L23/538 ,  H01L23/522 ,  H01L23/498 ,  H01L23/48 ,  H01L23/42 ,  H01L23/367 ,  H01L21/48

CPC classification number: H01L25/0657 ,  B81B7/0074 ,  H01L21/4853 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/522 ,  H01L23/5383 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/24 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/16 ,  H01L25/50 ,  H01L28/10 ,  H01L28/20 ,  H01L28/40 ,  H01L2224/0239 ,  H01L2224/0332 ,  H01L2224/0333 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0347 ,  H01L2224/03614 ,  H01L2224/0391 ,  H01L2224/03912 ,  H01L2224/03914 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05169 ,  H01L2224/05184 ,  H01L2224/05547 ,  H01L2224/05565 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/05611 ,  H01L2224/05616 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05669 ,  H01L2224/05684 ,  H01L2224/1134 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11903 ,  H01L2224/1191 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13025 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2224/13184 ,  H01L2224/13565 ,  H01L2224/13616 ,  H01L2224/1403 ,  H01L2224/14131 ,  H01L2224/14132 ,  H01L2224/14134 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/17181 ,  H01L2224/24147 ,  H01L2224/24227 ,  H01L2224/244 ,  H01L2224/32145 ,  H01L2224/3303 ,  H01L2224/33181 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48149 ,  H01L2224/4903 ,  H01L2224/73201 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81825 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1461 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16251 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/3841 ,  H01L2924/00 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/01028 ,  H01L2224/05 ,  H01L2224/13 ,  H01L2224/81 ,  H01L2224/45099

Abstract: Apparatuses relating generally to a substrate are disclosed. In such an apparatus, first wire bond wires (“first wires”) extend from a surface of the substrate. Second wire bond wires (“second wires”) extend from the surface of the substrate. The first wires and the second wires are external to the substrate. The first wires are disposed at least partially within the second wires. The first wires are of a first height. The second wires are of a second height greater than the first height for coupling of at least one electronic component to the first wires at least partially disposed within the second wires.

公开(公告)号：US20180197835A1

公开(公告)日：2018-07-12

申请号：US15740111

申请日：2016-06-28

Applicant: Lumileds Holding B.V.

Inventor： Sander Noijen ,  Rene Ubachs ,  Olaf Van Der Sluis

IPC: H01L23/00

CPC classification number: H01L24/72 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L24/92 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/1319 ,  H01L2224/17183 ,  H01L2224/17517 ,  H01L2224/291 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/72 ,  H01L2224/73201 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73251 ,  H01L2224/81192 ,  H01L2224/81899 ,  H01L2224/83104 ,  H01L2224/92125 ,  H01L2224/32 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014

Abstract: A device comprises a surface mount component on a substrate, in which the surface mount component is attached by a set of discrete mechanical coupling parts and by a bonding layer. This enables the mechanical coupling properties and the electrical/thermal properties to be optimized separately.