公开(公告)号：USRE49987E1

公开(公告)日：2024-05-28

申请号：US17725442

申请日：2022-04-20

Applicant: Invensas LLC

Inventor： Cyprian Emeka Uzoh ,  Rajesh Katkar

IPC: H01L25/065 ,  B81B7/00 ,  B81C1/00 ,  H01L21/48 ,  H01L23/00 ,  H01L23/367 ,  H01L23/42 ,  H01L23/48 ,  H01L23/498 ,  H01L23/522 ,  H01L23/538 ,  H01L25/00 ,  H01L25/16 ,  H01L49/02

CPC classification number: H01L25/0657 ,  B81B7/0074 ,  B81C1/0023 ,  H01L21/4853 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/522 ,  H01L23/5383 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/24 ,  H01L24/49 ,  H01L24/73 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/16 ,  H01L25/50 ,  H01L28/10 ,  H01L28/20 ,  H01L28/40 ,  H01L24/02 ,  H01L24/17 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L2224/0239 ,  H01L2224/0332 ,  H01L2224/0333 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0347 ,  H01L2224/03614 ,  H01L2224/0391 ,  H01L2224/03912 ,  H01L2224/03914 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05169 ,  H01L2224/05184 ,  H01L2224/05547 ,  H01L2224/05565 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/05611 ,  H01L2224/05616 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05669 ,  H01L2224/05684 ,  H01L2224/1134 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11903 ,  H01L2224/1191 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13025 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2224/13184 ,  H01L2224/13565 ,  H01L2224/13616 ,  H01L2224/1403 ,  H01L2224/14131 ,  H01L2224/14132 ,  H01L2224/14134 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/17181 ,  H01L2224/24147 ,  H01L2224/24227 ,  H01L2224/244 ,  H01L2224/32145 ,  H01L2224/3303 ,  H01L2224/33181 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48149 ,  H01L2224/4903 ,  H01L2224/73201 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81825 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1461 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16251 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/3841 ,  H01L2924/01322 ,  H01L2924/00 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2224/0239 ,  H01L2924/01029 ,  H01L2224/131 ,  H01L2924/014 ,  H01L2224/05568 ,  H01L2924/00014 ,  H01L2224/13147 ,  H01L2924/00014 ,  H01L2224/81825 ,  H01L2924/00014 ,  H01L2224/1147 ,  H01L2924/00014 ,  H01L2224/0347 ,  H01L2924/00014 ,  H01L2224/05147 ,  H01L2924/00014 ,  H01L2224/05647 ,  H01L2924/00014 ,  H01L2224/05124 ,  H01L2924/00014 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05111 ,  H01L2924/00014 ,  H01L2224/05611 ,  H01L2924/00014 ,  H01L2224/05169 ,  H01L2924/00014 ,  H01L2224/05669 ,  H01L2924/00014 ,  H01L2224/05155 ,  H01L2924/00014 ,  H01L2224/05655 ,  H01L2924/00014 ,  H01L2224/05144 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05184 ,  H01L2924/00014 ,  H01L2224/05684 ,  H01L2924/00014 ,  H01L2224/05139 ,  H01L2924/00014 ,  H01L2224/05639 ,  H01L2924/00014 ,  H01L2224/0345 ,  H01L2924/00014 ,  H01L2224/03452 ,  H01L2924/00014 ,  H01L2224/0332 ,  H01L2924/00014 ,  H01L2224/03462 ,  H01L2924/00014 ,  H01L2224/03464 ,  H01L2924/00014 ,  H01L2224/11462 ,  H01L2924/00014 ,  H01L2224/11464 ,  H01L2924/00014 ,  H01L2224/0333 ,  H01L2924/00012 ,  H01L2224/13616 ,  H01L2924/00014 ,  H01L2224/05616 ,  H01L2924/00014 ,  H01L2224/13155 ,  H01L2924/01074 ,  H01L2224/13184 ,  H01L2924/01028 ,  H01L2224/13124 ,  H01L2924/00014 ,  H01L2224/13111 ,  H01L2924/01082 ,  H01L2224/13155 ,  H01L2924/00014 ,  H01L2224/13144 ,  H01L2924/00014 ,  H01L2224/13139 ,  H01L2924/00014 ,  H01L2224/13116 ,  H01L2924/00014 ,  H01L2224/13113 ,  H01L2924/00014 ,  H01L2224/13169 ,  H01L2924/00014 ,  H01L2224/73201 ,  H01L2224/05 ,  H01L2224/13 ,  H01L2224/94 ,  H01L2224/81 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2224/45147 ,  H01L2924/00 ,  H01L2224/97 ,  H01L2224/81 ,  H01L2224/45147 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/20751 ,  H01L2224/45015 ,  H01L2924/20752 ,  H01L2224/45015 ,  H01L2924/20753 ,  H01L2224/45015 ,  H01L2924/20754 ,  H01L2224/45015 ,  H01L2924/20755 ,  H01L2224/45015 ,  H01L2924/20756 ,  H01L2224/45015 ,  H01L2924/20757 ,  H01L2224/45015 ,  H01L2924/20758 ,  H01L2224/45015 ,  H01L2924/20759 ,  H01L2224/45015 ,  H01L2924/2076 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/20751 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/20752 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/20753 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/20754 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/20755 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/20756 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/20757 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/20758 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/20759 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/2076 ,  H01L2924/00014 ,  H01L2224/45099

Abstract: Apparatus(es) and method(s) relate generally to via arrays on a substrate. In one such apparatus, the substrate has a conductive layer. First plated conductors are in a first region extending from a surface of the conductive layer. Second plated conductors are in a second region extending from the surface of the conductive layer. The first plated conductors and the second plated conductors are external to the first substrate. The first region is disposed at least partially within the second region. The first plated conductors are of a first height. The second plated conductors are of a second height greater than the first height. A second substrate is coupled to first ends of the first plated conductors. The second substrate has at least one electronic component coupled thereto. A die is coupled to second ends of the second plated conductors. The die is located over the at least one electronic component.

公开(公告)号：US20170141079A1

公开(公告)日：2017-05-18

申请号：US14939253

申请日：2015-11-12

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： CHIN-FU KAO ,  TSEI-CHUNG FU ,  JING-CHENG LIN

IPC: H01L25/065 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L21/76898 ,  H01L24/05 ,  H01L24/08 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/80 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/50 ,  H01L2224/04 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/05638 ,  H01L2224/05647 ,  H01L2224/05687 ,  H01L2224/0569 ,  H01L2224/08145 ,  H01L2224/1161 ,  H01L2224/11616 ,  H01L2224/11831 ,  H01L2224/13009 ,  H01L2224/13019 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13184 ,  H01L2224/1601 ,  H01L2224/16012 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/73201 ,  H01L2224/73204 ,  H01L2224/80075 ,  H01L2224/80203 ,  H01L2224/80896 ,  H01L2224/8101 ,  H01L2224/81011 ,  H01L2224/81012 ,  H01L2224/81022 ,  H01L2224/81075 ,  H01L2224/81203 ,  H01L2224/81895 ,  H01L2224/83075 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06544 ,  H01L2225/06565 ,  H01L2924/1434 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2924/01014 ,  H01L2924/05442 ,  H01L2924/05042 ,  H01L2924/00014 ,  H01L2924/07025 ,  H01L2224/83 ,  H01L2224/80 ,  H01L2924/00012 ,  H01L2224/08 ,  H01L2224/16 ,  H01L2924/01029 ,  H01L2924/00

Abstract: The present disclosure provides a semiconductor package, including a first device having a first joining surface, a first conductive component at least partially protruding from the first joining surface, a second device having a second joining surface facing the first joining surface, and a second conductive component at least exposing from the second joining surface. The first conductive component and the second conductive component form a joint having a first beak. The first beak points to either the first joining surface or the second joining surface.

公开(公告)号：US09604168B2

公开(公告)日：2017-03-28

申请号：US14000981

申请日：2013-02-14

Applicant: Nanopareil, LLC

Inventor： Todd Menkhaus ,  Hao Fong

IPC: B01D37/00 ,  B01D39/16 ,  B01D39/18 ,  B01D71/06 ,  B01D71/12 ,  B01D71/14 ,  B01D71/16 ,  B01D71/18 ,  B01D71/20 ,  B32B27/02 ,  D01D5/00 ,  D04H1/42 ,  H01L23/48 ,  H01L25/065 ,  H01L25/00 ,  D01F2/24 ,  D01F6/44 ,  D01F6/88 ,  B01J20/24 ,  B01J20/28 ,  B01J20/32 ,  H01L23/00 ,  B01D15/38 ,  B01D15/32 ,  B01D15/36

CPC classification number: B01D39/1615 ,  B01D15/327 ,  B01D15/361 ,  B01D15/3804 ,  B01D15/3809 ,  B01D39/1623 ,  B01D39/1676 ,  B01D2239/025 ,  B01D2239/0414 ,  B01J20/24 ,  B01J20/28007 ,  B01J20/28038 ,  B01J20/3212 ,  B01J20/3217 ,  B01J20/3248 ,  B01J20/3293 ,  C07K1/22 ,  D01D5/0007 ,  D01D5/003 ,  D01F2/24 ,  D01F6/44 ,  D01F6/88 ,  H01L23/48 ,  H01L24/16 ,  H01L24/72 ,  H01L24/73 ,  H01L24/90 ,  H01L24/91 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/73201 ,  H01L2224/81138 ,  H01L2224/81815 ,  H01L2224/9211 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06531 ,  H01L2225/06562 ,  H01L2225/06593 ,  H01L2924/0002 ,  H01L2924/15153 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/3511 ,  H01L2924/37001 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/16 ,  H01L2224/72 ,  H01L2224/81 ,  H01L2224/90 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: The present invention relates generally to compositions for use in biological and chemical separations, as well as other applications. More specifically, the present invention relates to hybrid felts fabricated from electrospun nanofibers with high permeance and high capacity. Such hybrid felts utilize derivatized cellulose, and at least one non-cellulose-based polymer that may be removed from the felt by subjecting it to moderately elevated temperatures and/or solvents capable of dissolving the non-cellulose-based polymer to leave behind a porous nanofiber felt having more uniform pore sizes and other enhanced properties when compared to single component nanofiber felts.

公开(公告)号：US20150380377A1

公开(公告)日：2015-12-31

申请号：US14841381

申请日：2015-08-31

Applicant: Invensas Corporation

Inventor： CYPRIAN EMEKA UZOH ,  Rajesh Katkar

IPC: H01L23/00 ,  H01L25/16

CPC classification number: H01L25/0657 ,  B81B7/0074 ,  H01L21/4853 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/522 ,  H01L23/5383 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/24 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/16 ,  H01L25/50 ,  H01L28/10 ,  H01L28/20 ,  H01L28/40 ,  H01L2224/0239 ,  H01L2224/0332 ,  H01L2224/0333 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0347 ,  H01L2224/03614 ,  H01L2224/0391 ,  H01L2224/03912 ,  H01L2224/03914 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05169 ,  H01L2224/05184 ,  H01L2224/05547 ,  H01L2224/05565 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/05611 ,  H01L2224/05616 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05669 ,  H01L2224/05684 ,  H01L2224/1134 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11903 ,  H01L2224/1191 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13025 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2224/13184 ,  H01L2224/13565 ,  H01L2224/13616 ,  H01L2224/1403 ,  H01L2224/14131 ,  H01L2224/14132 ,  H01L2224/14134 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/17181 ,  H01L2224/24147 ,  H01L2224/24227 ,  H01L2224/244 ,  H01L2224/32145 ,  H01L2224/3303 ,  H01L2224/33181 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48149 ,  H01L2224/4903 ,  H01L2224/73201 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81825 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1461 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16251 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/3841 ,  H01L2924/00 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/01074 ,  H01L2924/01028 ,  H01L2924/01082 ,  H01L2224/05 ,  H01L2224/13 ,  H01L2224/81 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2224/45099

Abstract: Apparatuses relating generally to a substrate are disclosed. In such an apparatus, first wire bond wires (“first wires”) extend from a surface of the substrate. Second wire bond wires (“second wires”) extend from the surface of the substrate. The first wires and the second wires are external to the substrate. The first wires are disposed at least partially within the second wires. The first wires are of a first height. The second wires are of a second height greater than the first height for coupling of at least one electronic component to the first wires at least partially disposed within the second wires.

Abstract translation: 公开了一般涉及衬底的装置。 在这种装置中，第一线接合线（“第一线”）从衬底的表面延伸。 第二线接合线（“第二线”）从衬底的表面延伸。 第一线和第二线在衬底外部。 第一导线至少部分地设置在第二导线内。 第一根导线是第一个高度。 第二导线的第二高度大于第一高度，用于将至少一个电子部件耦合到至少部分地设置在第二导线内的第一导线。

公开(公告)号：US20240282745A1

公开(公告)日：2024-08-22

申请号：US18648334

申请日：2024-04-27

Applicant: JUSUNG ENGINEERING CO., LTD.

Inventor： Jung Bae KIM ,  Min Jong KEUM ,  Young Tae YOON ,  Kyung Guk LEE

IPC: H01L23/00 ,  H10K59/131

CPC classification number: H01L24/73 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L24/90 ,  H01L24/92 ,  H10K59/131 ,  H01L2224/16225 ,  H01L2224/73201 ,  H01L2224/9212

Abstract: The present disclosure relates to an electrode connection element, a light emitting apparatus including the same, and a method for manufacturing the light emitting apparatus, and more particularly, to an electrode connection element, a light emitting apparatus including the same, and a method for manufacturing the light emitting apparatus, which are for electrically connecting an electrode terminal and an external drive circuit. An electrode connection element according to an exemplary embodiment includes: an upper connection member coming into contact with an upper surface of an electrode terminal formed on a substrate; a lower connection member configured to support a lower surface of the substrate; a connection member configured to connect the upper connection member and the lower connection member to each other.

公开(公告)号：US09984988B2

公开(公告)日：2018-05-29

申请号：US15396845

申请日：2017-01-03

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Jean Audet ,  Luc G. Guerin ,  Richard Langlois ,  Stephan L. Martel ,  Sylvain E. Ouimet

IPC: H01L23/48 ,  H01L23/00

CPC classification number: H01L24/08 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/73 ,  H01L24/81 ,  H01L25/16 ,  H01L28/40 ,  H01L2224/0401 ,  H01L2224/08265 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/16265 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/73201 ,  H01L2224/73204 ,  H01L2224/80815 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/81986 ,  H01L2224/92125 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A flip chip assembly is disclosed that includes a die with die circuitry and a plurality of electrical contacts electrically connected to the die circuitry. A substrate includes electrical contacts that are juxtaposed with and electrically connected to corresponding die electrical contacts. A passive component is disposed between the die and the substrate, and includes a dielectric disposed between a first electrode and a second electrode. The first electrode is electrically connected to a first of the die electrical contacts and a corresponding substrate electrical contact, and the second electrode is electrically connected to a second of the die electrical contacts and a corresponding substrate electrical contact.

公开(公告)号：US09741693B2

公开(公告)日：2017-08-22

申请号：US14939253

申请日：2015-11-12

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： Chin-Fu Kao ,  Tsei-Chung Fu ,  Jing-Cheng Lin

IPC: H01L25/065 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L21/76898 ,  H01L24/05 ,  H01L24/08 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/80 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/50 ,  H01L2224/04 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/05638 ,  H01L2224/05647 ,  H01L2224/05687 ,  H01L2224/0569 ,  H01L2224/08145 ,  H01L2224/1161 ,  H01L2224/11616 ,  H01L2224/11831 ,  H01L2224/13009 ,  H01L2224/13019 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13184 ,  H01L2224/1601 ,  H01L2224/16012 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/73201 ,  H01L2224/73204 ,  H01L2224/80075 ,  H01L2224/80203 ,  H01L2224/80896 ,  H01L2224/8101 ,  H01L2224/81011 ,  H01L2224/81012 ,  H01L2224/81022 ,  H01L2224/81075 ,  H01L2224/81203 ,  H01L2224/81895 ,  H01L2224/83075 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06544 ,  H01L2225/06565 ,  H01L2924/1434 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2924/01014 ,  H01L2924/05442 ,  H01L2924/05042 ,  H01L2924/00014 ,  H01L2924/07025 ,  H01L2224/83 ,  H01L2224/80 ,  H01L2924/00012 ,  H01L2224/08 ,  H01L2224/16 ,  H01L2924/01029 ,  H01L2924/00

Abstract: The present disclosure provides a semiconductor package, including a first device having a first joining surface, a first conductive component at least partially protruding from the first joining surface, a second device having a second joining surface facing the first joining surface, and a second conductive component at least exposing from the second joining surface. The first conductive component and the second conductive component form a joint having a first beak. The first beak points to either the first joining surface or the second joining surface.

公开(公告)号：US20170170134A1

公开(公告)日：2017-06-15

申请号：US15396845

申请日：2017-01-03

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： JEAN AUDET ,  LUC G. GUERIN ,  RICHARD LANGLOIS ,  STEPHAN L. MARTEL ,  SYLVAIN E. OUIMET

IPC: H01L23/00

CPC classification number: H01L24/08 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/73 ,  H01L24/81 ,  H01L25/16 ,  H01L28/40 ,  H01L2224/0401 ,  H01L2224/08265 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/16265 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/73201 ,  H01L2224/73204 ,  H01L2224/80815 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/81986 ,  H01L2224/92125 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A flip chip assembly is disclosed that includes a die with die circuitry and a plurality of electrical contacts electrically connected to the die circuitry. A substrate includes electrical contacts that are juxtaposed with and electrically connected to corresponding die electrical contacts. A passive component is disposed between the die and the substrate, and includes a dielectric disposed between a first electrode and a second electrode. The first electrode is electrically connected to a first of the die electrical contacts and a corresponding substrate electrical contact, and the second electrode is electrically connected to a second of the die electrical contacts and a corresponding substrate electrical contact.

公开(公告)号：US20150145141A1

公开(公告)日：2015-05-28

申请号：US14087252

申请日：2013-11-22

Applicant: Invensas Corporation

Inventor： Cyprian Emeka Uzoh ,  Rajesh Katkar

IPC: H01L23/538 ,  H01L23/00

CPC classification number: H01L25/50 ,  H01L21/31111 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/76898 ,  H01L23/49811 ,  H01L23/5384 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/24 ,  H01L24/32 ,  H01L24/33 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L24/89 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/02311 ,  H01L2224/02317 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0239 ,  H01L2224/0331 ,  H01L2224/0332 ,  H01L2224/0333 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0347 ,  H01L2224/03614 ,  H01L2224/0391 ,  H01L2224/03912 ,  H01L2224/03914 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05169 ,  H01L2224/05184 ,  H01L2224/05547 ,  H01L2224/05565 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/05611 ,  H01L2224/05616 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05669 ,  H01L2224/05684 ,  H01L2224/08146 ,  H01L2224/0823 ,  H01L2224/1134 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11903 ,  H01L2224/1191 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2224/13184 ,  H01L2224/13565 ,  H01L2224/13616 ,  H01L2224/1403 ,  H01L2224/14131 ,  H01L2224/14134 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/24147 ,  H01L2224/24227 ,  H01L2224/244 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/3303 ,  H01L2224/33181 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/4805 ,  H01L2224/48108 ,  H01L2224/48149 ,  H01L2224/4903 ,  H01L2224/49426 ,  H01L2224/73201 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81825 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/381 ,  H01L2924/3841 ,  H01L2924/386 ,  H01L2924/00 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/01074 ,  H01L2924/01028 ,  H01L2924/01082 ,  H01L2224/05 ,  H01L2224/13 ,  H01L2224/16225 ,  H01L2224/81 ,  H01L2224/45616 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2224/45099

Abstract: An apparatus relating generally to a substrate is disclosed. In such an apparatus, a first bond via array has first wires extending from a surface of the substrate. A second bond via array has second wires extending from the surface of the substrate. The first bond via array is disposed at least partially within the second bond via array. The first wires of the first bond via array are of a first height. The second wires of the second bond via array are of a second height greater than the first height for coupling of at least one die to the first bond via array at least partially disposed within the second bond via array.

Abstract translation: 公开了一般涉及基板的装置。 在这种装置中，第一接合通孔阵列具有从衬底的表面延伸的第一线。 第二结合通孔阵列具有从衬底的表面延伸的第二线。 通过阵列的第一结合通过阵列至少部分地设置在第二结合内。 第一结合通孔阵列的第一条导线具有第一高度。 第二接合通孔阵列的第二线具有大于用于将至少一个管芯耦合至第一接合的第一高度的第二高度，该阵列至少部分地设置在第二接合通孔阵列内。

公开(公告)号：US20130207261A1

公开(公告)日：2013-08-15

申请号：US13397593

申请日：2012-02-15

Applicant: Hiren D. Thacker ,  Hyung Suk Yang ,  Ivan Shubin ,  John E. Cunningham

Inventor： Hiren D. Thacker ,  Hyung Suk Yang ,  Ivan Shubin ,  John E. Cunningham

IPC: H01L23/498 ,  H01L21/50 ,  H01L23/488

CPC classification number: H01L25/0652 ,  H01L23/48 ,  H01L24/16 ,  H01L24/72 ,  H01L24/73 ,  H01L24/90 ,  H01L24/91 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/73201 ,  H01L2224/73251 ,  H01L2224/81138 ,  H01L2224/81815 ,  H01L2224/9211 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06531 ,  H01L2225/06562 ,  H01L2225/06593 ,  H01L2924/15153 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/3511 ,  H01L2924/37001 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/16 ,  H01L2224/72 ,  H01L2224/81 ,  H01L2224/90 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An MCM includes a two-dimensional array of facing chips, including island chips and bridge chips that communicate with each other using overlapping connectors. In order to maintain the relative vertical spacing of these connectors, compressible structures are in cavities in a substrate, which house the bridge chips, provide a compressive force on back surfaces of the bridge chips. These compressible structures include a compliant material with shape and volume compression. In this way, the MCM may ensure that facing surfaces of the island chips and the bridge chips, as well as connectors on these surfaces, are approximately coplanar without bending the bridge chips.

Abstract translation: MCM包括面向芯片的二维阵列，包括使用重叠连接器彼此通信的岛芯片和桥芯片。 为了保持这些连接器的相对垂直间隔，可压缩结构位于衬底中的空腔中，其容纳桥芯片，在桥芯片的后表面上提供压缩力。 这些可压缩结构包括具有形状和体积压缩的柔性材料。 以这种方式，MCM可以确保岛芯片和桥芯片的面对表面以及这些表面上的连接器在不弯曲桥接芯片的情况下大致共面。