公开(公告)号：US20140201992A1

公开(公告)日：2014-07-24

申请号：US14097597

申请日：2013-12-05

Applicant: UNIMICRON TECHNOLOGY CORPORATION

Inventor： Yung-Ching Lin ,  Chih-Kuie Yang ,  Ta-Han Lin

IPC: H05K3/40

CPC classification number: H05K3/4647 ,  H05K1/185 ,  H05K2201/0358 ,  H05K2203/1189 ,  Y10T29/49155

Abstract: A method for fabricating a circuit board structure having at least an embedded electronic element is disclosed, which includes the steps of: providing a substrate and embedding at least an electronic element in the substrate with an active surface and a plurality of electrode pads of the electronic element exposed from a surface of the substrate; forming a plurality of conductive bumps on the electrode pads of the electronic element; and covering the surface of the substrate and the active surface of the electronic element with a dielectric layer and a metal layer stacked on the dielectric layer, wherein the conductive bumps penetrate the dielectric layer so as to be in contact with the metal layer, thereby simplifying the fabrication process, reducing the fabrication cost and saving the fabrication time.

Abstract translation: 公开了一种用于制造具有至少嵌入式电子元件的电路板结构的方法，其包括以下步骤：提供基板并且将基板中的至少一个电子元件嵌入到所述基板中，所述基板具有活性表面和所述电子元件的多个电极焊盘 元件从所述基板的表面露出; 在所述电子元件的电极焊盘上形成多个导电凸块; 并且用电介质层和层叠在电介质层上的金属层覆盖基板的表面和电子元件的有源面，其中，导体凸块穿透电介质层以与金属层接触，从而简化 制造工艺，降低制造成本，节省制造时间。

公开(公告)号：US20140162084A1

公开(公告)日：2014-06-12

申请号：US14115803

申请日：2012-05-08

Applicant: JX Nippon Mining & Metals Corporation

Inventor： Kazuki Kammuri

IPC: H05K9/00 ,  B21D33/00

CPC classification number: H05K9/0084 ,  B21D33/00 ,  B32B7/12 ,  B32B15/01 ,  B32B15/08 ,  B32B15/20 ,  B32B27/281 ,  B32B27/32 ,  B32B2255/06 ,  B32B2307/208 ,  B32B2307/212 ,  B32B2307/546 ,  B32B2457/00 ,  B32B2457/20 ,  C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22F1/08 ,  H05K1/09 ,  H05K2201/0355 ,  H05K2201/0358 ,  Y10T29/30 ,  Y10T428/12431 ,  Y10T428/31678

Abstract: A copper foil composite comprising a copper foil and a resin layer laminated, the copper foil containing at least one selected from the group consisting of Sn, Mn, Cr, Zn, Zr, Mg, Ni, Si and Ag at a total of 30 to 500 mass ppm, a tensile strength of the copper foil having of 100 to 180 MPa, a degree of aggregation I200/I0200 of a (100) plane of the copper foil being 30 or more, and an average grain size viewed from a plate surface of the copper foil being 10 to 400 μm.

Abstract translation: 包含铜箔和层压的树脂层的铜箔复合体，含有选自Sn，Mn，Cr，Zn，Zr，Mg，Ni，Si和Ag中的至少一种的铜箔总共为30〜 500质量ppm的铜箔的拉伸强度为100〜180MPa，铜箔的（100）面的聚集度I200 / I0200为30以上，从板面观察的平均粒径 的铜箔为10〜400μm。

公开(公告)号：US08647518B2

公开(公告)日：2014-02-11

申请号：US13757857

申请日：2013-02-04

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Ming-Jaan Ho

IPC: H01B13/00

CPC classification number: H05K1/0296 ,  H05K3/022 ,  H05K3/386 ,  H05K3/4626 ,  H05K3/4655 ,  H05K2201/0154 ,  H05K2201/0358 ,  Y10T428/2804

Abstract: A method for manufacturing a resin coating on copper foil includes following steps. Firstly, two diamines of 2,2-bis[4-(4-aminophenoxy)phenyl] propane and 4,4′-oxydianiline, and two acid anhydrides of pyromellitic diandydride and oxydiphthalic anhydride are added into a polar aprotic solvent and the solvent is stirred to form a mixed solution. Secondly, the mixed solution is heated to a temperature of about 170° C.-190° C. to allow a cross-linking reaction to be completed between the two diamines and the two acid anhydrides, thereby forming a thermoplastic polyimide adhesive fluid. The thermoplastic polyimide adhesive fluid is coated on a copper foil and cured to form a thermoplastic polyimide adhesive layer on the copper foil, thereby obtaining a resin coated copper foil. This disclosure also relates to resin coated copper foil and a method for manufacturing a multi-layer circuit board.

Abstract translation: 在铜箔上制造树脂涂层的方法包括以下步骤。 首先，将2-二[4-（4-氨基苯氧基）苯基]丙烷和4,4'-氧联二苯胺的二胺和均苯四甲酸二二异氰酸酯和氧联二邻苯二甲酸酐的两种酸酐加入极性非质子溶剂中，溶剂为 搅拌形成混合溶液。 其次，将混合溶液加热至约170℃-190℃的温度，以便在两种二胺和两种酸酐之间完成交联反应，由此形成热塑性聚酰亚胺粘合剂流体。 将热塑性聚酰亚胺粘合剂流体涂覆在铜箔上并固化以在铜箔上形成热塑性聚酰亚胺粘合剂层，从而获得涂覆有树脂的铜箔。 本公开还涉及树脂涂布铜箔和制造多层电路板的方法。

公开(公告)号：US20130309489A1

公开(公告)日：2013-11-21

申请号：US13981723

申请日：2012-01-31

Applicant: Kouichi Murakami ,  Eijyu Ichinose ,  Atsushi Miyagaki ,  Takashi Mihara ,  Masaki Hazama

Inventor： Kouichi Murakami ,  Eijyu Ichinose ,  Atsushi Miyagaki ,  Takashi Mihara ,  Masaki Hazama

IPC: C09J179/08

CPC classification number: C09J179/08 ,  C08G59/4042 ,  C08G73/1035 ,  C08G73/1042 ,  C08G73/14 ,  C08K5/0066 ,  C08K5/5313 ,  C08L63/00 ,  C08L79/08 ,  C08L79/085 ,  C08L2205/02 ,  C09J7/35 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  C09J2479/08 ,  H05K3/022 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/012 ,  H05K2201/0154 ,  H05K2201/0358 ,  Y10T428/2887

Abstract: There is provided a thermosetting polyimide resin composition which enables production of a cured product exhibiting excellent dimensional stability and which exhibits excellent meltability; there are also provided a cured product of such a composition and an interlaminar adhesive film used for a printed wiring board, the interlaminar adhesive film being formed of the composition. In particular, there are provided a thermosetting polyimide resin composition containing a thermosetting polyimide resin (A) having a biphenyl backbone directly linked to a nitrogen atom of a five-membered cyclic imide backbone and a weight-average molecular weight (Mw) of 3,000 to 150,000, a phosphorus compound (B) represented by specific Formula (b1) or (b2), and an epoxy resin (C); a cured product of such a composition; and an interlaminar adhesive film used for a printed wiring board, the interlaminar adhesive film including a layer formed of the composition, the layer being formed on a carrier film.

Abstract translation: 提供了一种热固性聚酰亚胺树脂组合物，其能够生产显示出优异的尺寸稳定性并且显示出优异的熔融性的固化产物; 还提供了这种组合物的固化产物和用于印刷线路板的层间粘合膜，该层间粘合膜由该组合物形成。 特别地，提供一种热固性聚酰亚胺树脂组合物，其含有具有与五元环酰亚胺骨架的氮原子直接连接的联苯基骨架，重均分子量（Mw）为3,000〜 150,000，由具体式（b1）或（b2）表示的磷化合物（B）和环氧树脂（C）; 这种组合物的固化产物; 以及用于印刷线路板的层间粘合膜，所述层间粘合膜包括由所述组合物形成的层，所述层形成在载体膜上。

公开(公告)号：US08530752B2

公开(公告)日：2013-09-10

申请号：US12632948

申请日：2009-12-08

Applicant: Kenichi Kawabata ,  Takaaki Morita

Inventor： Kenichi Kawabata ,  Takaaki Morita

IPC: H05K1/16

CPC classification number: H05K3/4652 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24226 ,  H01L2224/2518 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H05K1/185 ,  H05K3/0044 ,  H05K3/0058 ,  H05K3/4602 ,  H05K3/4682 ,  H05K3/4688 ,  H05K2201/0358 ,  H05K2201/09518 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2203/0152 ,  H05K2203/025 ,  H05K2203/0554 ,  H05K2203/1105 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y10T29/49128 ,  Y10T428/24917 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

Abstract: A multilayer circuit board comprises core layers 101 and 102 made of a core material impregnated with resin, resin layers 111 and 112 interposed between the core layers 101 and 102, a wiring pattern 140 embedded in the resin layers 111 and 112. The core layers 101 and 102 have a thickness of 100 μm or smaller, whereby the entire board can significantly be thinned. Furthermore, the less strong resin layers 111 and 112 are interposed between the hard core layers 101 and 102, whereby the entire board has increased strength.

Abstract translation: 多层电路板包括由浸渍有树脂的芯材制成的芯层101和102，插入在芯层101和102之间的树脂层111和112，嵌入在树脂层111和112中的布线图案140.芯层101 102的厚度为100μm以下，从而能够使整个基板变薄。 此外，较不强的树脂层111和112插入在硬芯层101和102之间，由此整个板具有增加的强度。

公开(公告)号：US08507100B2

公开(公告)日：2013-08-13

申请号：US12688276

申请日：2010-01-15

Applicant: Kenji Tanaka ,  Kazumasa Takeuchi ,  Nobuyuki Ogawa ,  Katsuyuki Masuda

Inventor： Kenji Tanaka ,  Kazumasa Takeuchi ,  Nobuyuki Ogawa ,  Katsuyuki Masuda

IPC: B32B15/08

CPC classification number: B32B27/36 ,  B32B7/04 ,  B32B15/08 ,  B32B25/08 ,  B32B25/14 ,  B32B27/08 ,  B32B27/281 ,  B32B27/322 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/748 ,  B32B2457/00 ,  C08G73/14 ,  H05K3/386 ,  H05K2201/0358 ,  Y10T156/10 ,  Y10T428/24355 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: The invention aims to provide a resin primer which can stick an insulator layer to a conductor foil whereof the surface is not much roughened with sufficient adhesive force, a conductor foil with resin, a laminated sheet and a method of manufacturing same. The resin primer of the invention comprises a resin having film-forming ability and a breaking energy of 0.15 J or more. The conductor foil with resin of the invention comprises a resin layer comprising a conductor foil and the aforesaid resin primer. Further, the laminated sheet of the invention comprises the conductor foil, an insulating layer disposed facing the conductor foil, and a resin layer comprising the aforesaid resin primer disposed between the conductor foil and insulating layer so that it is in contact therewith. This laminated sheet can be manufactured by heating and pressurizing a laminate comprising the aforesaid conductor foil with resin, and a prepreg laminated on this resin layer.

Abstract translation: 本发明的目的是提供一种树脂底漆，其可以将绝缘体层粘附到具有足够的粘合力的表面不被粗糙化的导体箔上，具有树脂的导体箔，层压片及其制造方法。 本发明的树脂底漆包括具有成膜能力和断裂能为0.15J以上的树脂。 本发明的具有树脂的导体箔包括由导体箔和上述树脂底漆构成的树脂层。 此外，本发明的层压片包括导体箔，与导体箔相对设置的绝缘层，以及包含设置在导体箔与绝缘层之间的上述树脂底漆的树脂层，使其与其接触。 该层叠片材可以通过用树脂对包含上述导体箔的层压体进行加热加压，并将该层压在该树脂层上的预浸料坯来制造。

公开(公告)号：US20130071676A1

公开(公告)日：2013-03-21

申请号：US13579073

申请日：2011-06-16

Applicant: Kazuki Kammuri

Inventor： Kazuki Kammuri

IPC: B32B15/08

CPC classification number: H05K3/022 ,  B32B15/08 ,  B32B15/085 ,  B32B15/09 ,  B32B15/20 ,  B32B2457/08 ,  H05K1/0393 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0358 ,  Y10T428/31678

Abstract: A copper foil composite comprising a copper foil and a resin layer laminated thereon, wherein equation 1:(f3×t3)/(f2×t2)≧1 is satisfied when t2 (mm) is a thickness of the copper foil, f2 (MPa) is a stress of the copper foil under tensile strain of 4%, t3 (mm) is a thickness of the resin layer, f3 (MPa) is a stress of the resin layer under tensile strain of 4%, and equation 2:1≦33f1/(F×T) is satisfied when f1 (N/mm) is 180° peeling strength between the copper foil and the resin layer, F(MPa) is strength of the copper foil composite under tensile strain of 30%, and T (mm) is a thickness of the copper foil composite.

Abstract translation: 包含铜箔和层叠在其上的树脂层的铜箔复合体，当t2（mm）为铜箔的厚度时，满足式（f3×t3）/（f2×t2）≥1），f2（MPa ）是拉伸应变为4％时的铜箔的应力，t3（mm）是树脂层的厚度，f3（MPa）是树脂层在拉伸应变下的应力为4％，式2：1＆nlE ;当f 1（N / mm）是铜箔和树脂层之间的180°剥离强度时，满足33f1 /（F×T），F（MPa）是拉伸应变下的铜箔复合材料的强度为30％， T（mm）是铜箔复合体的厚度。

公开(公告)号：US20120219777A1

公开(公告)日：2012-08-30

申请号：US13404867

申请日：2012-02-24

Applicant: Johann R. Schumacher ,  Steven M. Schultz ,  Stanley E. Wilson ,  Tarun Amla

Inventor： Johann R. Schumacher ,  Steven M. Schultz ,  Stanley E. Wilson ,  Tarun Amla

IPC: B32B7/02 ,  B32B37/10 ,  B32B37/06 ,  B32B37/26

CPC classification number: B32B15/14 ,  B32B5/024 ,  B32B15/20 ,  B32B2038/0076 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2309/105 ,  B32B2311/12 ,  B32B2315/085 ,  B32B2457/08 ,  H05K1/0366 ,  H05K3/022 ,  H05K2201/029 ,  H05K2201/0358 ,  H05K2203/1545 ,  Y10T428/24975

Abstract: Ultrathin copper clad laminates including a fabric sheet material layer having a first planar surface, a second planar surface and an original thickness of from about 10 to about 30 microns and at least one copper foil sheet that is adhered to a planar surface of the fabric sheet material by a cured resin wherein the base laminate has a thickness of from about 1.0 to about 1.75 mils.

Abstract translation: 超薄铜箔层压板包括具有第一平表面，第二平面表面和约10至约30微米的原始厚度的织物片材层和至少一个铜箔片，所述铜箔片粘附到织物片的平坦表面上 材料通过固化树脂，其中基底层压板具有约1.0至约1.75密耳的厚度。

公开(公告)号：US20120018197A1

公开(公告)日：2012-01-26

申请号：US13145959

申请日：2010-01-22

Applicant: Young Seok Park ,  Eun Song Baik ,  Yang Seob Kim ,  Dong Bo Yang

Inventor： Young Seok Park ,  Eun Song Baik ,  Yang Seob Kim ,  Dong Bo Yang

IPC: H05K1/00 ,  B32B7/02 ,  B32B37/12 ,  B32B27/08

CPC classification number: B32B15/043 ,  B32B7/02 ,  B32B7/12 ,  B32B15/20 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2255/28 ,  B32B2307/202 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/546 ,  B32B2307/714 ,  B32B2307/732 ,  B32B2457/08 ,  H05K1/036 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/0358 ,  Y10T428/24975 ,  Y10T428/31515

Abstract: Provided are a flexible metal clad laminate including: (a) a first conductive metal foil in which a first polyimide layer is formed on a surface thereof; and (b) a second conductive metal foil in which a second polyimide layer is formed on a surface thereof, wherein the first polyimide layer and the second polyimide layer are joined together by an epoxy adhesive, and a method of manufacturing the same. The inventive flexible metal clad laminate can maintain the intrinsic properties of polyimide, and thus, can exhibit good heat resistance and flexibility to comparable with a conventional two-layer, double-sided flexible copper clad laminate, and a manufacturing process thereof is simple and easy, thus ensuring enhanced productivity and economical effectiveness.

Abstract translation: 提供一种柔性金属覆层层压板，其包括：（a）第一导电金属箔，其中在其表面上形成第一聚酰亚胺层; 和（b）其表面上形成第二聚酰亚胺层的第二导电金属箔及其制造方法，其中第一聚酰亚胺层和第二聚酰亚胺层通过环氧粘合剂接合在一起。 本发明的柔性金属包覆层压板可以保持聚酰亚胺的固有性质，因此，与传统的双层双面柔性覆铜层压板相比可显示良好的耐热性和柔软性，其制造工艺简单易行 ，从而确保提高生产力和经济效益。

公开(公告)号：US20110281126A1

公开(公告)日：2011-11-17

申请号：US13142189

申请日：2009-12-10

Applicant: Mitsuru Nozaki ,  Takabumi Oomori ,  Akihiro Nomoto ,  Norikatsu Akiyama ,  Eiji Nagata ,  Masashi Yano

Inventor： Mitsuru Nozaki ,  Takabumi Oomori ,  Akihiro Nomoto ,  Norikatsu Akiyama ,  Eiji Nagata ,  Masashi Yano

IPC: B32B15/08

CPC classification number: H05K3/386 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0358 ,  Y10T428/31681

Abstract: This invention relates to a resin composite copper foil capable of applying a copper foil with very small unevenness on a copper foil (matte) surface without deteriorating adhesion force to a resin composition of a copper-clad laminate, and more particularly to a resin composite copper foil comprising a copper foil and a polyimide resin layer wherein the polyimide resin layer contains a specific block copolymerized polyimide resin and an inorganic filler.

Abstract translation: 本发明涉及一种能够在铜箔（哑光）表面上施加非常小的不均匀性的铜箔的树脂复合铜箔，而不会对覆铜层压板的树脂组合物造成附着力的降低，更具体地说，涉及一种树脂复合铜 包括铜箔和聚酰亚胺树脂层的箔，其中聚酰亚胺树脂层含有特定的嵌段共聚聚酰亚胺树脂和无机填料。