公开(公告)号：US20170006701A1

公开(公告)日：2017-01-05

申请号：US15125573

申请日：2014-03-11

Applicant: EMPIRE TECHNOLOGY DEVELOPMENT LLC

Inventor： Vincenzo CASASANTA, III

IPC: H05K1/03 ,  H05K1/11 ,  H05K1/18 ,  H05K3/40 ,  H05K3/12 ,  C08J5/04 ,  B32B5/12 ,  B32B27/08 ,  B32B27/18 ,  B32B27/22 ,  B32B27/36 ,  C08J5/00 ,  H05K1/09 ,  H05K3/00

CPC classification number: H05K1/0366 ,  B32B3/266 ,  B32B5/02 ,  B32B5/08 ,  B32B5/12 ,  B32B5/22 ,  B32B5/26 ,  B32B9/02 ,  B32B9/04 ,  B32B25/02 ,  B32B25/042 ,  B32B25/08 ,  B32B27/08 ,  B32B27/18 ,  B32B27/22 ,  B32B27/28 ,  B32B27/281 ,  B32B27/283 ,  B32B27/285 ,  B32B27/286 ,  B32B27/302 ,  B32B27/304 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B27/38 ,  B32B27/40 ,  B32B27/42 ,  B32B2260/021 ,  B32B2260/04 ,  B32B2260/046 ,  B32B2262/04 ,  B32B2262/062 ,  B32B2262/065 ,  B32B2262/10 ,  B32B2262/101 ,  B32B2262/14 ,  B32B2264/0278 ,  B32B2264/105 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2307/546 ,  B32B2307/7163 ,  B32B2307/75 ,  B32B2457/08 ,  C08J5/005 ,  C08J5/041 ,  C08J2367/04 ,  C08K3/08 ,  C08K2003/0806 ,  H05K1/0353 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/095 ,  H05K1/097 ,  H05K1/115 ,  H05K1/181 ,  H05K3/0011 ,  H05K3/1216 ,  H05K3/1241 ,  H05K3/125 ,  H05K3/1275 ,  H05K3/22 ,  H05K3/4038 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0145 ,  H05K2201/0162 ,  H05K2201/0212 ,  H05K2201/0251 ,  H05K2201/0269 ,  H05K2201/0278 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/0271 ,  H05K2203/0769 ,  H05K2203/1105 ,  H05K2203/176 ,  H05K2203/178 ,  Y02P70/611 ,  Y02P70/613 ,  C08L67/04

Abstract: Biodegradable printed circuit boards, or PCBs, may be produced from substrate sheets that include at least one biodegradable polymer. In addition, the electrical traces used on the PCBs, may also include a biodegradable polymer incorporated with an electrically conductive material. The PCBs may be composted to degrade the PCBs, and the

Abstract translation: 可生物降解的印刷电路板或PCB可以由包括至少一种可生物降解的聚合物的基材片制成。 另外，PCB上使用的电迹线也可以包括结合有导电材料的可生物降解的聚合物。 PCB可能被堆肥以降解PCBs

公开(公告)号：US09512274B2

公开(公告)日：2016-12-06

申请号：US15006303

申请日：2016-01-26

Applicant: International Business Machines Corporation

Inventor： Dylan J. Boday ,  Joseph Kuczynski ,  Robert E. Meyer, III

IPC: C08G77/24 ,  C08G77/22 ,  C08G77/30 ,  C08G77/48 ,  C08G77/52 ,  C08K5/54 ,  B32B27/38 ,  B32B27/20 ,  H05K1/03 ,  C08G77/04 ,  C08L83/08 ,  C08L101/00 ,  C09D5/18 ,  C09D7/12 ,  H05K1/02 ,  H05K3/46 ,  C08G77/00

CPC classification number: C08K5/5403 ,  B32B27/20 ,  B32B27/38 ,  C08G77/045 ,  C08G77/24 ,  C08G77/30 ,  C08G77/48 ,  C08G77/52 ,  C08G77/80 ,  C08K5/5406 ,  C08L63/00 ,  C08L71/12 ,  C08L83/08 ,  C08L101/00 ,  C08L2201/02 ,  C08L2203/20 ,  C09D5/18 ,  C09D7/63 ,  C09D7/65 ,  H05K1/0298 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/11 ,  H05K3/4626 ,  H05K2201/012 ,  Y10T428/1352

Abstract: A flame retardant filler includes a bridged polysilsesquioxane prepared by sol-gel polymerization. In an exemplary synthetic method, a bridged polysilsesquioxane-based flame retardant filler is prepared by sol-gel polymerization of a monomer having two or more trialkoxysilyl groups attached to an organic bridging group that contains a fire retardant group (e.g., a halogen atom, a phosphinate, a phosphonate, a phosphate ester, and combinations thereof). Bridged polysilsesquioxane particles formed by sol-gel polymerization of (((2,5-dibromo-1,4-phenylene)bis(oxy))bis(ethane-2,1-diyl))bis(trimethoxysilane), for example, and follow-on sol-gel processing may serve both as a filler for rheology control (viscosity, flow, etc.) and a flame retardant.

Abstract translation: 阻燃填料包括通过溶胶 - 凝胶聚合制备的桥连聚倍半硅氧烷。 在示例性的合成方法中，桥连的聚倍半硅氧烷型阻燃填料是通过将具有两个或更多个连接到含有阻燃基团的有机桥连基团的三烷氧基甲硅烷基的单体（例如卤素原子， 次膦酸盐，膦酸盐，磷酸酯及其组合）。 通过（（（2,5-二溴-1,4-亚苯基）双（氧基））双（乙烷-2,1-二基）双（三甲氧基硅烷））和（（（2,5-二溴-1,4-亚苯基）双（氧基））双（三甲氧基硅烷）的溶胶 - 凝胶聚合形成的桥接聚倍半硅氧烷颗粒， 随后的溶胶 - 凝胶加工可用作流变控制（粘度，流动等）和阻燃剂的填料。

公开(公告)号：US09468092B2

公开(公告)日：2016-10-11

申请号：US14405572

申请日：2014-10-08

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Tomoaki Sawada ,  Shingo Yoshioka ,  Takatoshi Abe

IPC: B32B3/12 ,  B32B3/24 ,  B32B15/08 ,  B32B15/092 ,  G06F3/041 ,  H01B1/02 ,  H01L31/0224 ,  H05K1/03 ,  H05K1/02 ,  C08J5/18 ,  C08K7/02 ,  C08L101/00 ,  C08J7/04 ,  C09D105/16 ,  B32B3/26

CPC classification number: H05K1/0271 ,  B32B3/12 ,  B32B3/266 ,  B32B5/02 ,  B32B15/08 ,  B32B15/092 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/103 ,  B32B2262/106 ,  B32B2262/14 ,  B32B2307/202 ,  B32B2307/412 ,  B32B2307/50 ,  B32B2363/00 ,  C08J5/18 ,  C08J7/047 ,  C08J2300/21 ,  C08J2367/02 ,  C08J2400/21 ,  C08J2463/00 ,  C08K7/02 ,  C08L101/00 ,  C09D105/16 ,  C09D163/00 ,  G06F3/041 ,  H01B1/02 ,  H01B1/24 ,  H01L31/022466 ,  H01L31/022491 ,  H05K1/0213 ,  H05K1/0274 ,  H05K1/028 ,  H05K1/0296 ,  H05K1/0326 ,  H05K1/0333 ,  H05K1/0366 ,  H05K2201/0108 ,  H05K2201/012 ,  H05K2201/0323 ,  H05K2201/0326 ,  Y10T428/24331 ,  Y10T428/24917 ,  C08L63/00

Abstract: The present invention relates to an electrically conductive film characterized by being able to undergo elastic deformation, having little residual strain rate and exhibiting stress relaxation properties. More specifically, the present invention relates to an electrically conductive film wherein the stress relaxation rate (R) and the residual strain rate α, as measured in a prescribed extension-restoration test, are as follows: 20%≦R≦95% and 0%≦α≦3%.

Abstract translation: 本发明涉及一种导电膜，其特征在于能够进行弹性变形，几乎没有残余应变率和显示应力松弛性能。 更具体地说，本发明涉及一种导电膜，其中在规定的延伸恢复试验中测量的应力松弛率（R）和残余应变速率α如下：20％≤R≤95％和0 ％≤α≤3％。

公开(公告)号：US09428679B2

公开(公告)日：2016-08-30

申请号：US14623721

申请日：2015-02-17

Applicant: Henkel AG & Co. KGAA

Inventor： Emilie Barriau ,  Stefan Kreiling ,  Rainer Schoenfeld ,  Manfred Doering

IPC: C09J179/04 ,  C09J179/02 ,  C08L79/02 ,  H05K3/28 ,  C09D179/04

CPC classification number: C09J179/04 ,  C08L79/02 ,  C09D179/04 ,  C09J179/02 ,  H05K3/28 ,  H05K2201/012

Abstract: The present invention relates to flame-retardant polymerizable compositions comprising at least one benzoxazine compound and particular phosphorus-containing polymers. The present invention further provides adhesives, sealants or coating materials comprising the polymerizable composition according to the invention, and polymerization products of said composition.

Abstract translation: 本发明涉及包含至少一种苯并恶嗪化合物和特定含磷聚合物的阻燃聚合性组合物。 本发明还提供了包含本发明的可聚合组合物的粘合剂，密封剂或涂料，以及所述组合物的聚合产物。

公开(公告)号：US20160194466A1

公开(公告)日：2016-07-07

申请号：US14915937

申请日：2014-10-23

Applicant: TEIJIN DUPONT FILMS JAPAN LIMITED

Inventor： Yumiko NAKAMURA ,  Naomi MIZUNO ,  Taro OYA

IPC: C08J5/18 ,  H05K1/03 ,  B32B27/36 ,  B32B15/09 ,  B32B27/20 ,  H05K1/02 ,  C08K5/5313

CPC classification number: C08J5/18 ,  B32B3/00 ,  B32B15/08 ,  B32B15/09 ,  B32B15/20 ,  B32B27/06 ,  B32B27/18 ,  B32B27/20 ,  B32B27/36 ,  B32B2250/02 ,  B32B2307/202 ,  B32B2307/3065 ,  B32B2307/518 ,  B32B2307/538 ,  B32B2307/54 ,  B32B2367/00 ,  B32B2457/08 ,  B32B2457/12 ,  C08J3/203 ,  C08J2367/02 ,  C08K3/016 ,  C08K5/49 ,  C08K5/51 ,  C08K5/53 ,  C08K5/5313 ,  C08L67/02 ,  C08L67/03 ,  H05K1/028 ,  H05K1/03 ,  H05K1/0326 ,  H05K1/0353 ,  H05K1/0373 ,  H05K1/0393 ,  H05K1/09 ,  H05K2201/012 ,  H05K2201/0145 ,  H05K2201/0209 ,  Y10T428/24355 ,  Y10T428/25 ,  Y10T428/31681 ,  Y10T428/31786

Abstract: A flame-retardant biaxially oriented polyester film is obtained by imparting flame retardancy to a polyester film itself using a phosphorus flame retardant, a flame-retardant polyester film laminate is formed from the same, and a flexible circuit board is provided. The present invention is obtained from a flame-retardant biaxially oriented polyester film which contains, based on the weight of the polyester film, 70 to 99.5% by weight of polyethylene terephthalate or polyethylene naphthalate, and 0.5 to 30% by weight of flame retardant particles having an average particle diameter of 0.5 to 3.0 μm and being represented by a specific phosphinate or diphosphinate, wherein the number of coarse particles having a maximum length of 10 μm or more contained in the polyester film is 10/m2 or less.

Abstract translation: 通过使用磷阻燃剂赋予聚酯膜本身的阻燃性，由该阻燃双轴取向聚酯膜形成阻燃性双轴取向聚酯膜，由其形成阻燃聚酯膜层压体，并且设置柔性电路板。 本发明由阻燃性双轴取向聚酯膜获得，该聚酯膜基于聚酯膜的重量为70〜99.5重量％的聚对苯二甲酸乙二醇酯或聚萘二甲酸乙二醇酯，0.5〜30重量％的阻燃粒子 平均粒径为0.5〜3.0μm，由特定的次膦酸酯或二次膦酸盐表示，其中聚酯膜中所含的最大长度为10μm以上的粗粒子数为10个/ m 2以下。

公开(公告)号：US20160177082A1

公开(公告)日：2016-06-23

申请号：US14973809

申请日：2015-12-18

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao LIAO ,  Dein-Run FUNG ,  Ying-Te HUANG ,  Hao-Sheng CHEN ,  Hung-Yi CHANG ,  Chia-Lin LIU

IPC: C08L51/08 ,  H05K1/09 ,  H05K1/03 ,  C08J5/04 ,  C08J5/24

CPC classification number: C08J5/24 ,  C08J3/246 ,  C08J2351/08 ,  C08J2409/00 ,  C08L71/126 ,  C08L2205/025 ,  C08L2205/03 ,  C08L2205/05 ,  H05K1/032 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  C08L9/00

Abstract: A thermosetting resin composition due to containing a modified PPE resin as a main ingredient is suited for use in making a pregreg or a copper foil substrate, when hardened, featuring a small dielectric constant (Dk), a low dielectric dissipation factor (Df) and a high Tg as well as a high resistance to heat and flame, this outstanding result is because the modified PPE resin is formed with a novel two-dimensional hardenable structure prepared to have side-chain reactive functional groups being provided in addition to those at the terminal ends of the main chain of the PPE resin thereof.

Abstract translation: 由于含有改性PPE树脂作为主要成分的热固性树脂组合物适用于制造预浸料或铜箔基材时，硬化时具有小介电常数（Dk），低介电损耗因数（Df）和 高Tg以及高耐热性和耐火性，这是因为改性PPE树脂由新型二维可硬化结构形成，除了具有侧链反应性官能团 其PPE树脂的主链的末端。

公开(公告)号：US20160137842A1

公开(公告)日：2016-05-19

申请号：US15006640

申请日：2016-01-26

Applicant: International Business Machines Corporation

Inventor： Dylan J. Boday ,  Joseph Kuczynski ,  Robert E. Meyer, III

IPC: C08L83/08 ,  C08L101/00

CPC classification number: C08K5/5403 ,  B32B27/20 ,  B32B27/38 ,  C08G77/045 ,  C08G77/24 ,  C08G77/30 ,  C08G77/48 ,  C08G77/52 ,  C08G77/80 ,  C08K5/5406 ,  C08L63/00 ,  C08L71/12 ,  C08L83/08 ,  C08L101/00 ,  C08L2201/02 ,  C08L2203/20 ,  C09D5/18 ,  C09D7/63 ,  C09D7/65 ,  H05K1/0298 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/11 ,  H05K3/4626 ,  H05K2201/012 ,  Y10T428/1352

Abstract: A bridged polysilsesquioxane-based flame retardant filler imparts flame retardancy to manufactured articles such as connectors and other articles of manufacture that employ thermosetting plastics or thermoplastics. In an exemplary synthetic method, a bridged polysilsesquioxane-based flame retardant filler is prepared by sol-gel polymerization of a monomer having two or more trialkoxysilyl groups attached to an organic bridging group that contains a fire retardant group (e.g., a halogen atom, a phosphinate, a phosphonate, a phosphate ester, and combinations thereof). Bridged polysilsesquioxane particles formed by sol-gel polymerization of (((2,5-dibromo-1,4-phenylene)bis(oxy))bis(ethane-2,1-diyl))bis(tri-methoxysilane), for example, and follow-on sol-gel processing may serve both as a filler for rheology control (viscosity, flow, etc.) and a flame retardant.

Abstract translation: 桥接的聚倍半硅氧烷型阻燃填料对制造的制品（例如使用热固性塑料或热塑性塑料的连接件和其他制品）赋予阻燃性。 在示例性的合成方法中，桥连的聚倍半硅氧烷型阻燃填料是通过将具有两个或更多个连接到含有阻燃基团的有机桥连基团的三烷氧基甲硅烷基的单体（例如卤素原子， 次膦酸盐，膦酸盐，磷酸酯及其组合）。 通过（（（（2,5-二溴-1,4-亚苯基）双（氧基））双（乙烷-2,1-二基）双（三甲氧基硅烷）双（三甲氧基硅烷）的溶胶 - 凝胶聚合形成的桥接聚倍半硅氧烷颗粒 ，并且随后的溶胶 - 凝胶加工可用作流变控制（粘度，流动等）和阻燃剂的填料。

公开(公告)号：US09318402B2

公开(公告)日：2016-04-19

申请号：US14005920

申请日：2012-03-22

Applicant: Michio Yaginuma ,  Shoichi Ito ,  Yoshitaka Ueno

Inventor： Michio Yaginuma ,  Shoichi Ito ,  Yoshitaka Ueno

IPC: B32B15/08 ,  B32B15/082 ,  B32B15/092 ,  B32B27/04 ,  B32B27/18 ,  B32B27/30 ,  B32B27/38 ,  C08L63/00 ,  C08L71/12 ,  C08J5/24 ,  H01L23/29 ,  H05K1/03 ,  C08G59/40 ,  B32B15/14 ,  C08L71/02 ,  C08G73/00 ,  H05K3/02

CPC classification number: H01L23/295 ,  B32B15/08 ,  B32B15/14 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2305/076 ,  B32B2457/08 ,  C08G59/4014 ,  C08G73/00 ,  C08G73/0655 ,  C08J5/24 ,  C08J2363/00 ,  C08J2371/02 ,  C08J2375/04 ,  C08L63/00 ,  C08L71/02 ,  H01L2924/0002 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/012 ,  H01L2924/00

Abstract: A resin composition is provided which can be suitably used in a printed circuit board having excellent electrical properties, heat resistance and peel strength, with flame retardancy maintained, a prepreg and resin sheet which use the same, and a metal foil-clad laminate which uses the prepreg. A resin composition including a polyphenylene ether (A), a specific phosphorus-containing cyanate ester compound (B), a non-halogenated epoxy resin (C), a cyanate ester compound (D) and a filler (E) is used.

Abstract translation: 提供一种树脂组合物，其可以适用于具有优异的电性能，耐热性和剥离强度，保持阻燃性的印刷电路板，使用该树脂组合物的预浸料和树脂片，以及使用 预浸料 使用包含聚苯醚（A），特定含磷氰酸酯化合物（B），非卤化环氧树脂（C），氰酸酯化合物（D）和填料（E）的树脂组合物。

公开(公告)号：US09255185B2

公开(公告)日：2016-02-09

申请号：US13584017

申请日：2012-08-13

Applicant: Dylan J. Boday ,  Joseph Kuczynski ,  Robert E. Meyer, III

Inventor： Dylan J. Boday ,  Joseph Kuczynski ,  Robert E. Meyer, III

IPC: C08G77/60 ,  C08G77/30 ,  C08G77/48 ,  C08G77/52 ,  C08G77/24 ,  H05K1/03 ,  H05K3/46

CPC classification number: C08K5/5403 ,  B32B27/20 ,  B32B27/38 ,  C08G77/045 ,  C08G77/24 ,  C08G77/30 ,  C08G77/48 ,  C08G77/52 ,  C08G77/80 ,  C08K5/5406 ,  C08L63/00 ,  C08L71/12 ,  C08L83/08 ,  C08L101/00 ,  C08L2201/02 ,  C08L2203/20 ,  C09D5/18 ,  C09D7/63 ,  C09D7/65 ,  H05K1/0298 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/11 ,  H05K3/4626 ,  H05K2201/012 ,  Y10T428/1352

Abstract: A bridged polysilsesquioxane-based flame retardant filler imparts flame retardancy to manufactured articles such as printed circuit boards (PCBs), connectors, and other articles of manufacture that employ thermosetting plastics or thermoplastics. In an exemplary synthetic method, a bridged polysilsesquioxane-based flame retardant filler is prepared by sol-gel polymerization of a monomer having two or more trialkoxysilyl groups attached to an organic bridging group that contains a fire retardant group (e.g., a halogen atom, a phosphinate, a phosphonate, a phosphate ester, and combinations thereof). Bridged polysilsesquioxane particles formed by sol-gel polymerization of (((2,5-dibromo-1,4-phenylene)bis(oxy))bis(ethane-2,1-diyl))bis(trimethoxysilane), for example, and follow-on sol-gel processing may serve both as a filler for rheology control (viscosity, flow, etc.) and a flame retardant. In an exemplary application, a PCB laminate stack-up includes conductive planes separated from each other by a dielectric material that includes a bridged polysilsesquioxane-based flame retardant filler.

Abstract translation: 桥接的聚倍半硅氧烷基阻燃填料对诸如使用热固性塑料或热塑性塑料的印刷电路板（PCB），连接器和其它制品制成的制品赋予阻燃性。 在示例性的合成方法中，桥连的聚倍半硅氧烷型阻燃填料是通过将具有两个或更多个连接到含有阻燃基团的有机桥连基团的三烷氧基甲硅烷基的单体（例如卤素原子， 次膦酸盐，膦酸盐，磷酸酯及其组合）。 通过（（（2,5-二溴-1,4-亚苯基）双（氧基））双（乙烷-2,1-二基）双（三甲氧基硅烷））和（（（2,5-二溴-1,4-亚苯基）双（氧基））双（三甲氧基硅烷）的溶胶 - 凝胶聚合形成的桥接聚倍半硅氧烷颗粒， 随后的溶胶 - 凝胶加工可用作流变控制（粘度，流动等）和阻燃剂的填料。 在示例性应用中，PCB叠层叠层包括通过包括桥连聚倍半硅氧烷基阻燃填料的介电材料彼此分离的导电平面。

公开(公告)号：US09185801B2

公开(公告)日：2015-11-10

申请号：US13834473

申请日：2013-03-15

Applicant: ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO.,LTD

Inventor： Chang-Yuan Li ,  Li-Chih Yu ,  Hong-Xia Peng

IPC: B32B27/38 ,  H05K1/03

CPC classification number: H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10T428/31529

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 2 to 15 parts by weight of oxydianiline (ODA); and (C) 2 to 20 parts by weight of amino triazine novolac (ATN) resin. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby achieve a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high flame retardation, and thus is suitable for producing a prepreg or resin film to thereby be applicable to copper clad laminates and printed circuit boards.

Abstract translation: 无卤树脂组合物包含（A）100重量份环氧树脂; （B）2〜15重量份氧化二苯胺（ODA）; 和（C）2〜20重量份氨基三嗪酚醛清漆（ATN）树脂。 无卤树脂组合物包括特定成分，其特征在于其特定比例，从而实现低介电常数，低介电损耗因子，高耐热性和高阻燃性，因此适用于制备预浸料或 树脂膜，从而可应用于铜包覆层压板和印刷电路板。