公开(公告)号：US20240125050A1

公开(公告)日：2024-04-18

申请号：US18555074

申请日：2022-04-12

Applicant: DUPONT SAFETY & CONSTRUCTION, INC.

Inventor： Yuhei Nishimori ,  Masahiko Ueta

IPC: D21H15/02 ,  D21H13/26 ,  D21H21/00 ,  H05K1/03

CPC classification number: D21H15/02 ,  D21H13/26 ,  D21H21/00 ,  H05K1/0366 ,  H05K2201/0284 ,  H05K2201/0293

Abstract: A circuit board nonwoven fabric comprising a paper-formed structure which comprises a plurality of thick fibers in which the portion of greatest fiber diameter is 5 μm or greater, and a plurality of fine fibers in which the portion of greatest fiber diameter is less than 5 μm, wherein an average fiber length of the thick fibers is greater than an average fiber length of the fine fibers, the number of fine fibers is greater than the number of thick fibers, and the thick fibers have a flat shape with a major axis and a minor axis, the minor axis being oriented in a thickness direction of the paper-formed structure.

公开(公告)号：US11690402B2

公开(公告)日：2023-07-04

申请号：US16868256

申请日：2020-05-06

Applicant: JAPAN TOBACCO INC.

Inventor： Tetsuya Yoshimura ,  Masato Miyauchi

IPC: A24F40/46 ,  A24B15/167 ,  A24F40/57 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K3/12 ,  A24F40/50 ,  B82Y30/00 ,  A24F40/10 ,  A24F40/20

CPC classification number: A24F40/46 ,  A24B15/167 ,  A24F40/50 ,  A24F40/57 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0386 ,  H05K1/092 ,  H05K3/1283 ,  A24F40/10 ,  A24F40/20 ,  B82Y30/00 ,  H05K2201/017 ,  H05K2201/0154 ,  H05K2201/0284 ,  H05K2201/0293

Abstract: A circuit board for a non-combustion flavor inhaler includes a substrate and an electrically conductive ink pattern printed on the substrate. The substrate includes paper. A percentage weight loss of the paper from room temperature to 290° C. is less than 20% of a percentage weight loss of the paper from room temperature to 900° C. under a condition that allows air to flow at a flow rate of 100 mL/min while elevating a temperature of the air at a speed of 10° C./min.

公开(公告)号：US08779298B2

公开(公告)日：2014-07-15

申请号：US13387421

申请日：2010-06-17

Applicant: Richard Asterland

Inventor： Richard Asterland

IPC: H05K1/00

CPC classification number: H05K1/0216 ,  H05K1/0366 ,  H05K3/4688 ,  H05K2201/0284 ,  H05K2201/09309 ,  H05K2201/09518 ,  H05K2201/10689

Abstract: Electronic circuits (1, 101) are disclosed. The electronic circuits comprise a first and a second integrated circuit (10a, 110a, 10b, 110b) and a printed circuit board (PCB) (15, 115). The PCB comprises dielectric layers (30a-c, 130) of polymer-based materials having different dissipation factors arranged in accordance with various embodiments for suppressing noise.

Abstract translation: 公开了电子电路（1,101）。 电子电路包括第一和第二集成电路（10a，110a，10b，110b）和印刷电路板（PCB）（15,115）。 PCB包括根据用于抑制噪声的各种实施例布置的具有不同耗散因数的基于聚合物的材料的介电层（30a-c，130）。

公开(公告)号：US20110183564A1

公开(公告)日：2011-07-28

申请号：US13121867

申请日：2009-09-28

Applicant: Masao Uesaka

Inventor： Masao Uesaka

IPC: B32B15/14 ,  B32B17/06

CPC classification number: B32B27/42 ,  B32B5/02 ,  B32B5/024 ,  B32B5/26 ,  B32B7/12 ,  B32B15/04 ,  B32B15/08 ,  B32B15/14 ,  B32B17/04 ,  B32B27/04 ,  B32B29/002 ,  B32B29/005 ,  B32B29/02 ,  B32B2250/40 ,  B32B2260/021 ,  B32B2260/023 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/20 ,  B32B2307/206 ,  B32B2307/726 ,  B32B2307/7265 ,  B32B2457/00 ,  B32B2457/08 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/022 ,  H05K2201/0284 ,  Y10S428/901 ,  Y10T428/31522 ,  Y10T428/31525 ,  Y10T428/31678 ,  Y10T442/3415

Abstract: The object of the present invention is to provide a metal-clad phenolic resin laminate having a combination of machine properties, electrical properties and tracking resistance. A metal-clad phenolic resin laminate obtained by heating and pressing a lamination which comprises: (i) a central layered portion comprising one paper base prepreg which is made of a paper base impregnated with a first phenolic resin composition containing a resol-based resin, or a predetermined number of the paper base prepregs laid on each other; (ii) outer layered portions laid on an upper and a lower sides of the central layered portion, in which each of the outer layered portions comprises one glass fiber substrate prepreg which is made of a glass fiber substrate impregnated with a second phenolic resin composition containing a resol-based resin, or a predetermined number of the glass fiber substrate prepregs laid on each other; and (iii) a metal foil laid at least on one of the outer layered portions laid on the upper and lower sides of the central layered portion.

Abstract translation: 本发明的目的是提供一种具有机械性能，电性能和耐追踪性的组合的包覆金属的酚醛树脂层压板。 一种通过加热和压制叠层体而获得的包覆金属的酚醛树脂层压体，其包括：（i）中央层叠部分，其包含一个纸基预浸料，该纸基预浸料由浸渍有含有甲阶酚醛树脂树脂的第一酚醛树脂组合物的纸基制成， 或相互放置的预定数量的纸基预浸料坯; （ii）放置在中央层叠部的上侧和下侧的外层叠部分，其中每个外层层部分包括一个玻璃纤维基材预浸料，其由浸渍有第二酚醛树脂组合物的玻璃纤维基材制成，所述第二酚醛树脂组合物含有 或者预定数量的玻璃纤维基材预浸料， 和（iii）铺置在中央层叠部的上侧和下侧的至少一个外部层叠部分上的金属箔。

公开(公告)号：US06270363B1

公开(公告)日：2001-08-07

申请号：US09315373

申请日：1999-05-18

Applicant: Peter J. Brofman ,  John U. Knickerbocker ,  Sudipta K. Ray ,  Kathleen A. Stalter

Inventor： Peter J. Brofman ,  John U. Knickerbocker ,  Sudipta K. Ray ,  Kathleen A. Stalter

IPC: H01R458

CPC classification number: H01L24/29 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/81101 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01R12/52 ,  H01R13/2414 ,  H01R43/0256 ,  H05K3/321 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/0272 ,  H05K2201/0284 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2203/0425 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A compressible interposer comprising an interposer sheet having a plurality of apertures filled with a dielectric material having a substantially uniform suspension of conductive particles therein forming a plurality of conductive sites. Preferably, the number of conductive sites on the interposer are greater in number than the number of contact pads on the electronic components such that precise alignment of the interposer between the electronic components is not required. The apertures of the interposer sheet confine the conductive particles within the dielectric material such that during compression of the interposer between the electronic components, z-axis conductive pathways are formed without shorting in the x and y directions. Preferably, the interposer sheet comprises polyimide. Preferably, the dielectric material comprises polyimide-siloxane. Preferably, the conductive particles have a diameter of about 2 to about 20 &mgr;m and comprise of a material selected from the group consisting of copper, gold, silver, nickel, palladium, platinum, and alloys thereof. The particles may also be coated with an additional conductive material such as solder having a lower melting temperature. Most preferably, the conductive particles comprise solder coated copper particles. The conductive particles are present in an amount of about 30 to about 90 wt. % of the total weight of the conductive particles and the dielectric material.

Abstract translation: 一种可压缩插入件，其包括插入片，所述插入片具有填充有形成多个导电部位的导电粒子的基本均匀悬浮液的电介质材料的多个孔。 优选地，内插器上的导电位置的数量大于电子部件上的接触焊盘的数量，使得不需要电子部件之间的插入器的精确对准。 插入片的孔径将导电粒子限制在电介质材料内，使得在电子部件之间的插入件压缩期间，在x和y方向上形成z轴传导路径而不会短路。 优选地，插入片包括聚酰亚胺。 优选地，电介质材料包括聚酰亚胺 - 硅氧烷。 优选地，导电颗粒的直径为约2至约20μm，并且包括选自铜，金，银，镍，钯，铂及其合金的材料。 颗粒也可以涂覆有另外的导电材料，例如具有较低熔融温度的焊料。 最优选地，导电颗粒包括焊料涂覆的铜颗粒。 导电颗粒的存在量为约30至约90wt。 导电颗粒和电介质材料的总重量的百分比。

公开(公告)号：US5116670A

公开(公告)日：1992-05-26

申请号：US589578

申请日：1990-09-28

Applicant: Noboru Suzuki ,  Masaharu Yoshida ,  Satoshi Noda ,  Minoru Takaishi ,  Kenichiro Takiguchi ,  Hiroshi Uchida ,  Takeshi Onoda

Inventor： Noboru Suzuki ,  Masaharu Yoshida ,  Satoshi Noda ,  Minoru Takaishi ,  Kenichiro Takiguchi ,  Hiroshi Uchida ,  Takeshi Onoda

IPC: C08F299/04 ,  C08J5/06 ,  C08J5/24 ,  H05K1/03 ,  H05K3/38

CPC classification number: C08J5/24 ,  C08F299/0485 ,  C08J5/06 ,  H05K1/0366 ,  C08J2367/07 ,  H05K2201/0145 ,  H05K2201/0166 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K3/386 ,  Y10S428/901 ,  Y10T428/31522 ,  Y10T428/3162 ,  Y10T428/31652 ,  Y10T428/31681 ,  Y10T428/31688 ,  Y10T428/31703 ,  Y10T428/3179 ,  Y10T428/31794 ,  Y10T442/3415

Abstract: Resin compositions for laminated sheets and laminated sheets produced therefrom are disclosed, the compositions comprising at least one allyl ester resin composed of a polybasic acid and a polyhydric alcohol, wherein an allyl ester group of said resin is bonded to at least one of terminals thereof.

公开(公告)号：US5069954A

公开(公告)日：1991-12-03

申请号：US149355

申请日：1988-01-28

Applicant: Donald Cole ,  Robert W. Smith

Inventor： Donald Cole ,  Robert W. Smith

IPC: B44C1/16 ,  B44C1/165 ,  B44C1/17 ,  H05K1/09 ,  H05K3/20 ,  H05K3/28 ,  H05K3/38

CPC classification number: H05K3/207 ,  B44C1/16 ,  B44C1/165 ,  B44C1/172 ,  H05K1/092 ,  H05K2201/0284 ,  H05K2203/0143 ,  H05K2203/0534 ,  H05K2203/1105 ,  H05K3/1275 ,  H05K3/28 ,  H05K3/386 ,  Y10T428/2486 ,  Y10T428/24876 ,  Y10T428/2839

Abstract: A transfer for use with automatic offset application equipment comprises a backing paper, release layer, design layer and covercoat layer, in which the covercoat layer is formed from a heat-activatable adhesive and extends over an area greater than that of the design layer. Preferably the design layer also has heat-activatable adhesive properties. Such transfers are especially for use with enamel printing inks for the decoration of ceramic ware. In use, a heated platen is used to melt the release layer and a heated pressure pad is brought into contact with the transfer to activate the adhesive and effect the transferring operation.

公开(公告)号：US4894271A

公开(公告)日：1990-01-16

申请号：US190986

申请日：1988-05-06

Applicant: Kiyoshi Hani ,  Mutsuko Hayama ,  Yoshio Nishimoto ,  Hiroshi Hishiki ,  Minoru Kimura ,  Tatsushi Nakai

Inventor： Kiyoshi Hani ,  Mutsuko Hayama ,  Yoshio Nishimoto ,  Hiroshi Hishiki ,  Minoru Kimura ,  Tatsushi Nakai

IPC: B32B15/14 ,  H05K1/03 ,  H05K1/05 ,  H05K3/42 ,  H05K3/44

CPC classification number: B32B15/14 ,  H05K1/0366 ,  H05K1/056 ,  H05K3/445 ,  H05K2201/0251 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2201/0355 ,  H05K3/427 ,  Y10S428/901 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/24934 ,  Y10T428/31678

Abstract: Method of printed circuit board manufacture, and resulting board. A plurality of prepreg sheets composed of ceramic paper and containing different quantities of a resin are laid on each side of a core metal sheet having a through hole. A copper foil is laid on the prepreg sheets on each side of the core. All of the layers are pressed together under heat to make a metal-core printed wiring board. The prepreg sheets form an insulating layer having a high heat-dissipating capacity on each side of the core and a reliable insulator in its through hole. The ceramic paper consists essentially of short ceramic fibers having a diameter not exceeding fiber microns and a length of 5 to 500 microns, and contains 3 to 10% by weight of microfibrillated cellulose fibers as a binder for the ceramic fibers.

Abstract translation: 印刷电路板制造方法和所得板。 在具有通孔的芯金属片的每一侧上放置多个由陶瓷纸构成并含有不同量树脂的预浸料片。 在芯的每一侧上的预浸片上放置铜箔。 所有的层在加热下压在一起以制成金属芯印刷线路板。 预浸片形成在芯的每一侧具有高散热能力的绝缘层和在其通孔中的可靠的绝缘体。 陶瓷纸基本上由直径不超过纤维微米并且长度为5至500微米的短陶瓷纤维组成，并且包含3至10重量％的作为陶瓷纤维的粘合剂的微纤化纤维素纤维。

公开(公告)号：US4799996A

公开(公告)日：1989-01-24

申请号：US78166

申请日：1987-07-27

Applicant: Robert Cassat

Inventor： Robert Cassat

IPC: C08L61/06 ,  C08G59/00 ,  C08G59/18 ,  C08G85/00 ,  C08L61/00 ,  C08L61/04 ,  C08L63/00 ,  H05K1/03 ,  H05K3/10 ,  H05K3/18 ,  H05K3/38 ,  D21H1/48

CPC classification number: H05K3/188 ,  H05K1/0373 ,  H05K3/387 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2201/0245 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/1157 ,  H05K2203/125 ,  H05K3/105 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/256

Abstract: Substrate composites, well adopted for the production of metallized printed circuits and facilely prepared by, e.g., papermaking procedures, include a central core layer comprising fibrous cellulosic material or flaked mica within a matrix of a thermosetting resin binder, said central core element having coextensively laminated to at least one of the face surfaces thereof, a lamina of a thermosetting resin comprising non-conductive metal oxide filler material distributed therethrough, and said metal oxide being borohydride reduceable and reactive to form unstable metal hydride intermediates.

Abstract translation: 用于生产金属化印刷电路并通过例如造纸方法容易制备的基材复合材料包括在热固性树脂粘合剂的基体内包含纤维状纤维素材料或薄片状云母的中心芯层，所述中心芯部元件具有共同层压 至少一个其表面，包含分布在其中的非导电金属氧化物填充材料的热固性树脂的层，并且所述金属氧化物是硼氢化物可还原和反应以形成不稳定的金属氢化物中间体。

公开(公告)号：US4571279A

公开(公告)日：1986-02-18

申请号：US555836

申请日：1983-11-28

Applicant: Masayuki Oizumi ,  Masakazu Uekita ,  Masana Goto ,  Ichiro Azumi ,  Shoji Uozumi ,  Masaharu Abe ,  Yasuo Fushiki ,  Minoru Isshiki ,  Kunio Kawasaki

Inventor： Masayuki Oizumi ,  Masakazu Uekita ,  Masana Goto ,  Ichiro Azumi ,  Shoji Uozumi ,  Masaharu Abe ,  Yasuo Fushiki ,  Minoru Isshiki ,  Kunio Kawasaki

IPC: B32B37/00 ,  B29C57/00 ,  B29C63/00 ,  B29C67/00 ,  B29C70/00 ,  B29C70/50 ,  B32B15/08 ,  B32B27/04 ,  B32B38/08 ,  D21H25/06 ,  H05K1/03 ,  H05K3/02 ,  B32B31/00 ,  C09J5/02

CPC classification number: B32B38/08 ,  B29C70/50 ,  B32B27/04 ,  D21H25/06 ,  H05K1/0346 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0166 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/1545 ,  H05K3/022 ,  Y10S428/901 ,  Y10T156/1085 ,  Y10T29/49124 ,  Y10T442/3431 ,  Y10T442/3528 ,  Y10T442/656 ,  Y10T442/67

Abstract: A continuous process for producing reinforced resin laminates comprising the steps of impregnating a fibrous substrate with a liquid resin which is free of volatile solvent and is capable of curing without generating liquid and gaseous byproducts, laminating a plurality of the resin-impregnated substrates into a unitary member, sandwiching the laminate between a pair of covering sheets, and curing the laminate between said pair of covering sheets without applying appreciable pressure. The improvement comprises adjusting the final resin content in said resin impregnated substrate at 10 to 90% by weight based on the total weight of said impregnated substrate.

Abstract translation: 一种用于生产增强树脂层压板的连续方法，包括以下步骤：用不含挥发性溶剂的液体树脂浸渍纤维基材，并且能够固化而不产生液体和气体副产物，将多个浸渍树脂的基材层压成单一 构件，将层压体夹在一对覆盖片之间，并且在施加明显的压力之间固化所述一对覆盖片之间的层压体。 该改进包括基于所述浸渍的基材的总重量将所述树脂浸渍的基材中的最终树脂含量调节为10至90重量％。