公开(公告)号：US09181464B2

公开(公告)日：2015-11-10

申请号：US13203216

申请日：2010-01-18

Applicant: Shingo Kaimori ,  Jun Sugawara ,  Akira Mizoguchi ,  Syougo Asai ,  Takuma Yoshisaka ,  Naota Uenishi

Inventor： Shingo Kaimori ,  Jun Sugawara ,  Akira Mizoguchi ,  Syougo Asai ,  Takuma Yoshisaka ,  Naota Uenishi

IPC: B32B3/10 ,  B32B7/12 ,  C09J7/02 ,  C09J167/02 ,  C09J163/04 ,  C09J171/10 ,  C09J163/02 ,  C09J177/00 ,  C09J161/14 ,  C09J167/00 ,  C08G59/30 ,  C08G59/32 ,  C09J163/00 ,  C09J171/00 ,  H05K3/38 ,  C08K5/3437 ,  C08L67/00 ,  C08L77/00 ,  C08L79/04 ,  H05K1/03

CPC classification number: C09J167/00 ,  C08G59/304 ,  C08G59/3272 ,  C08G2650/56 ,  C08K5/3437 ,  C08L67/00 ,  C08L77/00 ,  C08L79/04 ,  C08L2666/14 ,  C09J7/22 ,  C09J7/35 ,  C09J163/00 ,  C09J171/00 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2461/00 ,  C09J2463/00 ,  C09J2467/00 ,  C09J2477/00 ,  H01L2924/00013 ,  H05K1/0393 ,  H05K3/386 ,  H05K2201/012 ,  H05K2201/0145 ,  Y10T428/24802 ,  Y10T428/287 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

Abstract: Provided are an adhesive resin composition that is halogen-free, has good adhesiveness, solder heat resistance, and flame retardancy, and has good flow characteristics, and a laminate and a flexible printed wiring board using the same. The adhesive resin composition contains a phosphorus-containing epoxy resin and/or a phosphorus-containing phenoxy resin, a phosphorus-containing polyester resin having a weight-average molecular weight of more than 20,000 and 150,000 or less, another thermoplastic resin, and a curing agent. The adhesive resin composition preferably further contains a benzoxazine compound. Preferably, substantially no inorganic filler is mixed in the adhesive resin composition.

Abstract translation: 本发明提供无卤素，粘合性，焊料耐热性，阻燃性，流动特性良好的粘合性树脂组合物，以及使用该树脂组合物的层叠体和柔性印刷线路板。 粘合剂树脂组合物含有含磷环氧树脂和/或含磷苯氧树脂，重均分子量大于20,000和150,000以下的含磷聚酯树脂，另一种热塑性树脂和固化 代理商 粘合性树脂组合物优选还含有苯并恶嗪化合物。 优选地，在粘合剂树脂组合物中基本上不混合无机填料。

公开(公告)号：US09139750B2

公开(公告)日：2015-09-22

申请号：US14239045

申请日：2011-09-02

Applicant: Yueshan He

Inventor： Yueshan He

IPC: C09D163/10 ,  B32B15/08 ,  C08K5/5399 ,  C08K5/00 ,  H05K1/03 ,  B32B37/10 ,  B32B38/08 ,  C09D143/02 ,  C09D145/00 ,  C09D171/12 ,  B32B15/14 ,  B32B15/20 ,  C08K3/00 ,  H05K3/02

CPC classification number: C09D163/10 ,  B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  B32B37/10 ,  B32B38/08 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2305/076 ,  C08K3/013 ,  C08K5/0025 ,  C08K5/5399 ,  C09D143/02 ,  C09D145/00 ,  C09D171/12 ,  H05K1/0346 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10T156/1075 ,  C08L63/00

Abstract: A halogen-free resin composition and a method for preparation of copper clad laminate with the same, wherein based on total parts by weight of solid components, the halogen-free resin composition comprises a reactive allyl phenoxy cyclotriphosphazene or vinyl phenoxy cyclotriphosphazene of 5-50 parts, a thermosetting resin of 15-85 parts, a crosslinking curing agent of 1-35 parts, a crosslinking curing accelerant of 0-5 parts and a filler of 0-100 parts. In the present invention, the reactive allyl phenoxy cyclotriphosphazene or vinyl phenoxy cyclotriphosphazene having very low water absorption is introduced into the thermosetting resin, satisfying both the halogen-free and antiflaming requirements and improving the electrical properties of the system, and making it possible to prepare the halogen-free high-frequency high-speed substrate material. The resulted copper clad laminate satisfies the halogen-free requirement, and has advantages such as excellent resistance to heat and moisture, and low dielectric loss.

Abstract translation: 无卤素树脂组合物及其制备方法，其中基于总重量份的固体组分，无卤树脂组合物包含5-50的反应性烯丙基苯氧基环三磷腈或乙烯基苯氧基环三磷腈 部件，15-85份的热固性树脂，1-35份交联固化剂，0-5份交联固化促进剂和0-100份填料。 在本发明中，具有非常低吸水性的反应性烯丙基苯氧基环三磷腈或乙烯基苯氧基环三磷腈引入到热固性树脂中，满足无卤素和抗泡沫性要求，并且改善了体系的电性能，并且使得可以制备 无卤素高频高速基板材料。 所得到的覆铜层压板满足无卤素要求，具有优异的耐热湿性和低介电损耗。

公开(公告)号：US20150247015A1

公开(公告)日：2015-09-03

申请号：US14617071

申请日：2015-02-09

Applicant: Shengyi Technology Co., Ltd.

Inventor： Yong CHEN

IPC: C08J5/24 ,  C08L63/00 ,  C08L63/04 ,  C08L63/08

CPC classification number: C08J5/24 ,  C08G59/42 ,  C08G59/4261 ,  C08J2363/00 ,  C08J2363/04 ,  C08J2363/10 ,  C08L63/00 ,  C08L2201/02 ,  C08L2203/20 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  C08L25/04 ,  C08L25/18

Abstract: The present invention discloses a thermosetting resin composition, which comprises epoxy resin with 2 or more than 2 epoxy groups in each resin molecule; and active ester containing styrene structure. The thermosetting resin composition is used to prepare resin sheet, resin composite metal copper foil, prepreg, laminate, copper clad laminate, printed circuit board and the like. The thermosetting resin composition significantly reduces the probability of delamination in PCB substrate, and the obtained resin composition has excellent thermal stability and moisture-heat resistance, low dielectric constant and dielectric loss angle tangent, and excellent flame retardancy.

Abstract translation: 本发明公开了一种热固性树脂组合物，其包含在每个树脂分子中具有2个或多于2个环氧基的环氧树脂; 和含有苯乙烯结构的活性酯。 热固性树脂组合物用于制备树脂片，树脂复合金属铜箔，预浸料，叠层，覆铜层压板，印刷电路板等。 热固性树脂组合物显着地降低了PCB基板中的分层的可能性，所得到的树脂组合物具有优异的热稳定性和耐湿热性，低介电常数和介电损耗角切线，以及优异的阻燃性。

公开(公告)号：US20140349090A1

公开(公告)日：2014-11-27

申请号：US13948399

申请日：2013-07-23

Applicant: ELITE MATERIAL CO., LTD.

Inventor： CHEN-YU HSIEH

IPC: H05K1/05 ,  C08L71/02

CPC classification number: C08L71/02 ,  C08K5/5399 ,  C08L21/00 ,  C08L71/12 ,  C08L79/08 ,  H05K1/0353 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10T428/24917 ,  Y10T428/31681

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of polyphenylene oxide resin; (B) 10 to 50 parts by weight of maleimide resin; (C) 5 to 100 parts by weight of polybutadiene copolymer; (D) 5 to 30 parts by weight of cyanate ester resin; and (E) 15 to 150 parts by weight of phosphazene. The halogen-free resin composition is characterized by specific ingredients and proportions thereof to achieve circuit board laminate properties, such as a high glass transition temperature, low coefficient of thermal expansion, low dielectric properties, heat resistance, flame retardation, and being halogen-free, and thus is applicable to the manufacturing of a prepreg or resin film, thereby being applicable to the manufacturing of metal laminates and printed circuit boards.

Abstract translation: 无卤素树脂组合物包含（A）100重量份聚苯醚树脂; （B）10〜50重量份马来酰亚胺树脂; （C）5〜100重量份的聚丁二烯共聚物; （D）5〜30重量份的氰酸酯树脂; 和（E）15〜150重量份的磷腈。 无卤素树脂组合物的特征在于其特定成分和比例，以实现电路板层压性能，例如高玻璃化转变温度，低热膨胀系数，低介电性能，耐热性，阻燃性和无卤素 ，因此可以应用于预浸料或树脂膜的制造，从而适用于金属层叠体和印刷电路板的制造。

公开(公告)号：US08865311B2

公开(公告)日：2014-10-21

申请号：US12438132

申请日：2007-09-20

Applicant: Akihiko Tobisawa

Inventor： Akihiko Tobisawa

IPC: B32B27/38 ,  B32B15/092 ,  H05K1/03 ,  C08G59/32 ,  C08G59/50 ,  C08G59/38 ,  C08L63/00 ,  C08J5/24

CPC classification number: H05K1/0353 ,  C08G59/3218 ,  C08G59/38 ,  C08G59/5086 ,  C08J5/24 ,  C08J2363/00 ,  C08L63/00 ,  H05K2201/012 ,  Y10T428/31511 ,  Y10T428/31529

Abstract: A resin composition used to prepare a sheet-like prepreg by impregnating a substrate with the resin composition includes an epoxy resin that contains a naphthalene-modified epoxy resin, and a triazine-modified novolac resin. A sheet-like prepreg is formed by impregnating a substrate with the resin composition. A laminate formed using the prepreg exhibits excellent flame retardancy, solder heat resistance, and lead-free heat resistance, has a small coefficient of linear expansion in the thickness direction, and has excellent adhesion to a conductor circuit.

Abstract translation: 用于通过用树脂组合物浸渍基材来制备片状预浸料的树脂组合物包括含有萘改性环氧树脂的环氧树脂和三嗪改性酚醛清漆树脂。 通过用树脂组合物浸渍基材来形成片状预浸料。 使用该预浸料形成的层压体具有优异的阻燃性，焊料耐热性和无铅耐热性，在厚度方向上的线膨胀系数小，对导体电路的粘附性优异。

公开(公告)号：US20140272328A1

公开(公告)日：2014-09-18

申请号：US14208144

申请日：2014-03-13

Applicant: Plasma Systems Holdings, Inc.

Inventor： Michael Forney ,  James Stameson

IPC: H05K5/03

CPC classification number: H05K3/285 ,  C08G59/686 ,  H05K1/0326 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10T428/24802

Abstract: Disclosed herein are embodiments of an epoxy casting resin system which can be used to at least partially cover an electronic component or mechanism. In some embodiments, the epoxy resin can have a low viscosity, while maintaining advantageous physical, thermal, and electrical properties. Further described are methods for making embodiments of the epoxy casting resin.

Abstract translation: 本文公开了可用于至少部分地覆盖电子部件或机构的环氧树脂浇铸树脂体系的实施方案。 在一些实施方案中，环氧树脂可以具有低粘度，同时保持有利的物理，热和电性能。 进一步描述了制备环氧树脂浇铸树脂的实施方案的方法。

公开(公告)号：US20140224529A1

公开(公告)日：2014-08-14

申请号：US14123262

申请日：2012-06-04

Applicant: Shu Dobashi ,  Yuji Toyama ,  Tsuneo Koike ,  Makoto Tai ,  Marc-Andre Lebel ,  Jan-Pleun Lens

Inventor： Shu Dobashi ,  Yuji Toyama ,  Tsuneo Koike ,  Makoto Tai ,  Marc-Andre Lebel ,  Jan-Pleun Lens

IPC: H05K1/03 ,  H05K1/02

CPC classification number: H05K1/0326 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B32B27/281 ,  B32B27/36 ,  B32B27/38 ,  B32B2264/0207 ,  B32B2307/304 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/718 ,  B32B2457/08 ,  C08G59/304 ,  C08K5/5333 ,  C08L63/00 ,  C09K21/14 ,  H05K1/028 ,  H05K3/285 ,  H05K3/386 ,  H05K2201/012 ,  H05K2201/0154 ,  Y10T428/31511 ,  C08L101/00 ,  C08L85/02

Abstract: To provide a flame-retardant resin composition that has superior adhesion subsequent to curing and molding when used as a printed wiring board adhesive and that provides superior printed wiring board electrical characteristics; and a flexible printed wiring board metal-clad laminate, a coverlay, a flexible printed wiring board adhesive sheet, and a flexible printed wiring board employing this resin composition. (SOLUTION) The flame-retardant resin composition comprises a thermosetting resin, a hardener, and a phosphorus-containing polymer.

Abstract translation: 提供一种阻燃树脂组合物，其在用作印刷线路板粘合剂时具有优异的固化和模塑粘合性，并且提供优异的印刷线路板电气特性; 以及柔性印刷电路板覆金属层压板，覆盖层，柔性印刷线路板粘合片和使用该树脂组合物的柔性印刷线路板。 （解决方案）阻燃树脂组合物包含热固性树脂，固化剂和含磷聚合物。

公开(公告)号：US20140178697A1

公开(公告)日：2014-06-26

申请号：US13834473

申请日：2013-03-15

Applicant: ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD.

Inventor： CHANG-YUAN LI ,  LI-CHIH YU ,  HONG-XIA PENG

IPC: H05K1/03

CPC classification number: H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10T428/31529

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 2 to 15 parts by weight of oxydianiline (ODA); and (C) 2 to 20 parts by weight of amino triazine novolac (ATN) resin. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby achieve a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high flame retardation, and thus is suitable for producing a prepreg or resin film to thereby be applicable to copper clad laminates and printed circuit boards.

Abstract translation: 无卤树脂组合物包含（A）100重量份环氧树脂; （B）2〜15重量份氧化二苯胺（ODA）; 和（C）2〜20重量份氨基三嗪酚醛清漆（ATN）树脂。 无卤树脂组合物包括特定成分，其特征在于其特定比例，从而实现低介电常数，低介电损耗因子，高耐热性和高阻燃性，因此适用于制备预浸料或 树脂膜，从而可应用于铜包覆层压板和印刷电路板。

公开(公告)号：US20140138128A1

公开(公告)日：2014-05-22

申请号：US14163527

申请日：2014-01-24

Applicant: Arlon

Inventor： Daniel Chang ,  Sam Najjar

IPC: H01B3/40 ,  H05K1/02 ,  H05K1/03

CPC classification number: H01B3/40 ,  C08J5/24 ,  C08J2379/04 ,  C08K3/36 ,  C08K5/523 ,  C08L79/04 ,  H05K1/0298 ,  H05K1/03 ,  H05K1/0353 ,  H05K1/0373 ,  H05K2201/012 ,  Y10T428/249955 ,  Y10T428/31511 ,  Y10T428/31525 ,  Y10T428/31529 ,  Y10T428/31721 ,  Y10T428/31725 ,  Y10T428/31786 ,  Y10T428/31931 ,  Y10T442/20 ,  Y10T442/2475

Abstract: In accordance with the present invention, compositions are described which are useful, for example, for the preparation of metal-clad laminate structures, methods for the preparation thereof, and various uses therefor. Invention metal-clad laminate structures are useful, for example, in the multi-layer board (MLB) industry, in the preparation of burn-in test boards and high reliability boards, in applications where low coefficient of thermal expansion (CTE) is beneficial, in the preparation of boards used in down-hole drilling, and the like.

Abstract translation: 根据本发明，描述了可用于例如制备覆金属层压结构体的方法，其制备方法及其各种用途的组合物。 本发明的金属包覆层压结构在例如多层板（MLB）工业中，在制备老化试验板和高可靠性板的情况下，在低热膨胀系数（CTE）有益的应用中是有用的 在制备用于井下钻孔的板材等中。

公开(公告)号：US20140113118A1

公开(公告)日：2014-04-24

申请号：US13739428

申请日：2013-01-11

Applicant: ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD

Inventor： RONG-TAO WANG ,  CHEN-YU HSIEH ,  ZIQIAN MA ,  WENJUN TIAN ,  WENFENG LU

IPC: H05K1/03 ,  C09D171/08

CPC classification number: H05K1/0353 ,  B32B15/14 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2305/076 ,  B32B2457/08 ,  C08G73/0655 ,  C08K3/22 ,  C08K3/36 ,  C08L45/00 ,  C08L71/126 ,  C08L79/04 ,  C09D171/08 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10T428/24917 ,  Y10T428/31699 ,  C08L65/00

Abstract: A halogen-free resin composition including (A) 100 parts by weight of polyphenylene ether resin containing an alkenyl group; (B) 10 to 50 parts by weight of cyclo olefin copolymer (COC); (C) 5 to 50 parts by weight of 1,2,4-trivinylcyclohexane resin and/or 1,3,5-triethyloxymethyl cyclohexane resin; and (D) 5 to 150 parts by weight of polyphenylene ether pre-polymerized branch cyanate ester. The halogen-free resin composition can manifest low dielectric constant, low dielectric dissipation factor, high heat resistance, and high glass transition temperature by using the specified ingredient in the specified ratio, thus can be used in preparing a prepreg or a resin film, which is applicable to copper clad laminates and printed circuit boards.

Abstract translation: 一种无卤树脂组合物，其包含（A）100重量份含有烯基的聚苯醚树脂; （B）10〜50重量份的环烯烃共聚物（COC）; （C）5〜50重量份1,2,4-三乙烯基环己烷树脂和/或1,3,5-三乙氧基甲基环己烷树脂; 和（D）5〜150重量份的聚苯醚预聚分支氰酸酯。 无卤素树脂组合物可以通过以规定比例使用规定的成分而表现出低介电常数，低介电损耗因子，高耐热性和高玻璃化转变温度，因此可用于制备预浸料或树脂膜，其中 适用于铜包层压板和印刷电路板。