公开(公告)号：US20140069702A1

公开(公告)日：2014-03-13

申请号：US14113541

申请日：2012-04-24

Applicant: Yoshihide Sekito

Inventor： Yoshihide Sekito

IPC: G03F7/035 ,  H05K1/03

CPC classification number: G03F7/035 ,  C08F290/067 ,  C09D5/18 ,  G03F7/033 ,  G03F7/037 ,  G03F7/038 ,  G03F7/0388 ,  H05K1/0373 ,  H05K3/287 ,  H05K2201/012 ,  Y10T428/24355 ,  Y10T428/25 ,  Y10T428/259

Abstract: The photosensitive resin composition contains a (A) binder polymer, (B) cross-linked polymer particles, (C) thermosetting resin, (D) photo-polymerization initiator, and a (E) phosphoric flame retardant, in which a content of the (B) cross-linked polymer particles is 30 parts by weight to 100 parts by weight with respect to the 100 parts by weight of the (A) binder polymer, and an average particle diameter of the (B) cross-linked polymer particles is 1 μm to 10 μm. Therefore, the photosensitive resin composition (i) obtains an excellent tack-free property after being applied and dried, (ii) can be subjected to fine processing, (iii) is formed into a cured film having excellent flexibility, flame retardancy, and electrical insulation reliability, and (iv) causes a substrate to have a small warpage after being cured.

Abstract translation: 感光性树脂组合物含有（A）粘合剂聚合物，（B）交联聚合物颗粒，（C）热固性树脂，（D）光聚合引发剂和（E）磷酸阻燃剂，其中 （B）交联聚合物颗粒相对于100重量份（A）粘合剂聚合物为30重量份至100重量份，（B）交联聚合物颗粒的平均粒径为 1个妈妈到10个妈妈 因此，感光性树脂组合物（i）在施加和干燥后获得优异的无粘性，（ii）可以进行精细加工，（iii）形成为具有优异的柔性，阻燃性和电气性的固化膜 绝缘可靠性，（iv）使基材在固化后具有小的翘曲。

公开(公告)号：US20140004324A1

公开(公告)日：2014-01-02

申请号：US13679777

申请日：2012-11-16

Applicant: ELITE ELECTRONIC MATERIAL (ZHONGSHAN)

Inventor： CHEN-YU HSIEH ,  CHANG-YUAN LI

IPC: C08L71/12 ,  B32B3/10 ,  C08L79/00 ,  B32B15/08 ,  C08L25/08 ,  C08L57/00

CPC classification number: C08L71/123 ,  B32B3/10 ,  B32B15/08 ,  B82Y30/00 ,  C08L25/08 ,  C08L57/00 ,  C08L71/126 ,  C08L79/00 ,  C08L79/02 ,  C08L79/04 ,  H05K1/024 ,  H05K1/0346 ,  H05K1/0353 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0158 ,  H05K2201/0209 ,  Y10T428/24917 ,  Y10T428/31692 ,  C08L23/00

Abstract: A resin composition includes (A) 100 parts by weight of poly(phenylene oxide) resin with styrene end group; (B) 5 to 75 parts by weight of olefin copolymer; and (C) 1 to 150 parts by weight of cyanate resin with poly(phenylene oxide) functional group. The resin composition is characterized by specific composition and proportion conducive to achieving a low dielectric constant, a low dielectric loss, and a high thermal tolerance and preparing a prepreg or a resin film, thereby being applicable to copper-clad laminates and printed circuit boards.

Abstract translation: 树脂组合物包含（A）100重量份的具有苯乙烯端基的聚苯醚树脂; （B）5〜75重量份的烯烃共聚物; 和（C）1〜150重量份具有聚（苯醚）官能团的氰酸酯树脂。 树脂组合物的特征在于具有有助于实现低介电常数，低介电损耗和高耐热性的特定组成和比例，并且制备预浸料或树脂膜，从而可应用于覆铜层压板和印刷电路板。

公开(公告)号：US20130309489A1

公开(公告)日：2013-11-21

申请号：US13981723

申请日：2012-01-31

Applicant: Kouichi Murakami ,  Eijyu Ichinose ,  Atsushi Miyagaki ,  Takashi Mihara ,  Masaki Hazama

Inventor： Kouichi Murakami ,  Eijyu Ichinose ,  Atsushi Miyagaki ,  Takashi Mihara ,  Masaki Hazama

IPC: C09J179/08

CPC classification number: C09J179/08 ,  C08G59/4042 ,  C08G73/1035 ,  C08G73/1042 ,  C08G73/14 ,  C08K5/0066 ,  C08K5/5313 ,  C08L63/00 ,  C08L79/08 ,  C08L79/085 ,  C08L2205/02 ,  C09J7/35 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  C09J2479/08 ,  H05K3/022 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/012 ,  H05K2201/0154 ,  H05K2201/0358 ,  Y10T428/2887

Abstract: There is provided a thermosetting polyimide resin composition which enables production of a cured product exhibiting excellent dimensional stability and which exhibits excellent meltability; there are also provided a cured product of such a composition and an interlaminar adhesive film used for a printed wiring board, the interlaminar adhesive film being formed of the composition. In particular, there are provided a thermosetting polyimide resin composition containing a thermosetting polyimide resin (A) having a biphenyl backbone directly linked to a nitrogen atom of a five-membered cyclic imide backbone and a weight-average molecular weight (Mw) of 3,000 to 150,000, a phosphorus compound (B) represented by specific Formula (b1) or (b2), and an epoxy resin (C); a cured product of such a composition; and an interlaminar adhesive film used for a printed wiring board, the interlaminar adhesive film including a layer formed of the composition, the layer being formed on a carrier film.

Abstract translation: 提供了一种热固性聚酰亚胺树脂组合物，其能够生产显示出优异的尺寸稳定性并且显示出优异的熔融性的固化产物; 还提供了这种组合物的固化产物和用于印刷线路板的层间粘合膜，该层间粘合膜由该组合物形成。 特别地，提供一种热固性聚酰亚胺树脂组合物，其含有具有与五元环酰亚胺骨架的氮原子直接连接的联苯基骨架，重均分子量（Mw）为3,000〜 150,000，由具体式（b1）或（b2）表示的磷化合物（B）和环氧树脂（C）; 这种组合物的固化产物; 以及用于印刷线路板的层间粘合膜，所述层间粘合膜包括由所述组合物形成的层，所述层形成在载体膜上。

公开(公告)号：US20130306357A1

公开(公告)日：2013-11-21

申请号：US13952006

申请日：2013-07-26

Applicant: Taiwan Union Technology Corporation

Inventor： Hsuan Hao HSU ,  Jiun Jie HUANG ,  Mei Ling CHU ,  Hsien Te CHEN

IPC: C09D163/00 ,  H05K3/00

CPC classification number: C09D163/00 ,  C08G59/24 ,  C08G59/4261 ,  C08L63/00 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/0064 ,  H05K2201/012

Abstract: Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin comprising a dicyclopentadiene type epoxy resin; (B) a copolymer of styrene and maleic anhydride as a curing agent; (C) a curing accelerator; (D) an optional silane dispersing agent; (E) an optional phosphorous-containing flame retardant; (F) an optional toughening agent; and (G) an optional inorganic filler.

Abstract translation: 公开了一种用于印刷电路板的环氧树脂组合物，其包括（A）包含二环戊二烯型环氧树脂的环氧树脂; （B）作为固化剂的苯乙烯和马来酸酐的共聚物; （C）固化促进剂; （D）任选的硅烷分散剂; （E）可选的含磷阻燃剂; （F）可选增韧剂; 和（G）可选的无机填料。

公开(公告)号：US08519273B2

公开(公告)日：2013-08-27

申请号：US12937018

申请日：2009-02-13

Applicant: Sankar Paul ,  Dirk M. Baars

Inventor： Sankar Paul ,  Dirk M. Baars

IPC: H05K1/00

CPC classification number: H05K1/0373 ,  B32B7/12 ,  B32B15/06 ,  B32B15/08 ,  B32B15/085 ,  B32B15/20 ,  B32B27/285 ,  B32B27/32 ,  B32B2255/06 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2262/0276 ,  B32B2264/0278 ,  B32B2307/204 ,  B32B2307/302 ,  B32B2307/3065 ,  B32B2307/50 ,  B32B2307/54 ,  B32B2307/714 ,  B32B2307/7265 ,  B32B2307/734 ,  B32B2457/00 ,  C08K3/22 ,  C08L15/00 ,  C08L19/006 ,  C08L71/12 ,  C08L2666/14 ,  C09D5/24 ,  C09D7/61 ,  C09J107/00 ,  C12Q1/6886 ,  C12Q2600/154 ,  C12Q2600/156 ,  H05K1/032 ,  H05K3/386 ,  H05K3/4626 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0355 ,  H05K2203/122 ,  Y10T156/10 ,  Y10T428/24802 ,  Y10T428/2804 ,  Y10T428/31826 ,  Y10T428/31833 ,  Y10T428/31855 ,  Y10T428/31909 ,  Y10T428/31924 ,  Y10T428/31931 ,  Y10T428/31938 ,  C08L2666/08

Abstract: A circuit subassembly, comprising: a conductive layer, a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition a polybutadiene or polyisoprene resin, about 30 to about 70 percent by weight of a magnesium hydroxide having less than about 1000 ppm of ionic contaminants, and about 5 to about 15 percent by weight of a nitrogen-containing compound, wherein the nitrogen-containing compound comprises at least about 15 weight percent of nitrogen; and an adhesive layer disposed between and in intimate contact with the conductive layer and the dielectric layer, wherein the adhesive comprises a poly(arylene ether), wherein the circuit subassembly has a UL-94 rating of at least V-1.

Abstract translation: 一种电路子组件，包括：导电层，由热固性组合物形成的电介质层，其中所述热固性组合物基于所述热固性组合物的总重量包含聚丁二烯或聚异戊二烯树脂，约30至约70重量％ 具有小于约1000ppm的离子污染物的氢氧化镁和约5至约15重量％的含氮化合物，其中所述含氮化合物包含至少约15重量％的氮; 以及设置在所述导电层和所述电介质层之间并且与所述电介质层紧密接触的粘合剂层，其中所述粘合剂包括聚（亚芳基醚），其中所述电路子组件具有至少V-1的UL-94等级。

公开(公告)号：US20130215628A1

公开(公告)日：2013-08-22

申请号：US13882126

申请日：2011-10-27

Applicant: Takashi Matsuda ,  Kiyotaka Komori ,  Akiyoshi Nozue ,  Takayuki Suzue ,  Mitsuyoshi Nishino ,  Toshiyuki Asahi ,  Naoyuki Tani ,  Yoshito Kitagawa

Inventor： Takashi Matsuda ,  Kiyotaka Komori ,  Akiyoshi Nozue ,  Takayuki Suzue ,  Mitsuyoshi Nishino ,  Toshiyuki Asahi ,  Naoyuki Tani ,  Yoshito Kitagawa

IPC: H05K1/03

CPC classification number: H05K1/038 ,  C08J5/24 ,  C08K3/013 ,  C08K3/22 ,  C08K2003/2217 ,  C08K2003/2227 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10T442/20 ,  Y10T442/3415 ,  Y10T442/3472 ,  Y10T442/656 ,  Y10T442/659

Abstract: A laminate with superior thermal conductivity, heat resistance, drill workability, and fire retardancy is provided. In a prepreg obtained by impregnating a woven or nonwoven fabric base with a thermosetting resin composition, the thermosetting resin composition contains 80 to 200 parts by volume of an inorganic filler per 100 parts by volume of a thermosetting resin, the inorganic filler contains (A) gibbsite type aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 μm and (B) magnesium oxide having an average particle diameter (D50) of 0.5 to 15 μm, and a compounding ratio (volume ratio) of the gibbsite type aluminum hydroxide particles (A) to the magnesium oxide (B) is 1:0.3 to 3.

Abstract translation: 提供了具有优良的导热性，耐热性，钻孔加工性和阻燃性的层压材料。 在通过用热固性树脂组合物浸渍织造或非织造布基材而获得的预浸料中，热固性树脂组合物每100体积份的热固性树脂含有80〜200体积份的无机填料，无机填料含有（A） 平均粒径（D50）为2〜15μm的三水铝矿型氢氧化铝粒子和（B）平均粒径（D50）为0.5〜15μm的氧化镁和三水铝矿型配合比（体积比） 氢氧化铝粒子（A）与氧化镁（B）的摩尔比为1:0.3〜3。

公开(公告)号：US20130161080A1

公开(公告)日：2013-06-27

申请号：US13335658

申请日：2011-12-22

Applicant: Yu-Te LIN

Inventor： Yu-Te LIN

IPC: H05K1/09 ,  C08L63/02 ,  C08K5/521 ,  C08L35/06 ,  C08K3/36 ,  C08L63/08 ,  C08L79/04 ,  B32B15/08 ,  C08K5/5399

CPC classification number: C08G59/56 ,  B32B15/092 ,  B32B27/04 ,  B32B27/20 ,  B32B27/38 ,  C08G59/4284 ,  C08G73/0233 ,  C08K5/0025 ,  C08K5/0066 ,  C08K5/49 ,  C08L25/04 ,  C08L35/06 ,  C08L63/00 ,  C08L79/02 ,  C08L79/04 ,  H05K1/0346 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10S428/901 ,  Y10T428/24994 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31529

Abstract: A halogen-free resin composition includes (A) 100 parts per hundred resin of epoxy resin; (B) 1 to 100 parts per hundred resin of benzoxazine resin; (C) 1 to 100 parts per hundred resin of styrene-maleic anhydride; (D) 0.5 to 30 parts per hundred resin of amine curing agent; and (E) 5 to 150 parts per hundred resin of halogen-free flame retardant. The composition obtains properties of low dielectric constant, low dissipation factor, high heat resistance and flame retardancy by specific composition and ratio. Thus, a prepreg or a resin film, which can be applied to a copper clad laminate and a printed circuit board, is formed.

Abstract translation: 无卤树脂组合物包含（A）100份/ 100份环氧树脂树脂; （B）1〜100份/ 100份苯并恶嗪树脂; （C）1〜100份/ 100份苯乙烯 - 马来酸酐树脂; （D）0.5〜30份/ 100份胺固化剂树脂; 和（E）每100份无卤阻燃剂树脂为5至150份。 该组合物通过特定组成和比例获得低介电常数，低耗散因子，高耐热性和阻燃性的性质。 因此，可以形成可应用于覆铜层压板和印刷电路板的预浸料坯或树脂膜。

公开(公告)号：US20130115472A1

公开(公告)日：2013-05-09

申请号：US13680568

申请日：2012-11-19

Applicant: Elite Material Co., Ltd.

Inventor： Li-Chih YU ,  Tse-An LEE

IPC: C08L65/00 ,  B32B15/08

CPC classification number: C08L65/00 ,  B32B15/08 ,  C08G73/0655 ,  C08K3/013 ,  C08K3/26 ,  C08K3/36 ,  C08K5/09 ,  C08K5/5399 ,  C08L35/06 ,  C08L71/12 ,  C08L79/04 ,  H05K1/0353 ,  H05K3/022 ,  H05K2201/012 ,  Y10T428/31699 ,  C08K3/0033

Abstract: The halogen-free resin composition comprises (A) 100 parts by weight of cyanate ester resin; (B) 5 to 50 parts by weight of styrene-maleic anhydride; (C) 5 to 100 parts by weight of polyphenylene oxide resin; (D) 10 to 150 parts by weight of phosphazene; and (E) 10 to 1000 parts by weight of inorganic filler. By using specific components at specific proportions, the halogen-free resin composition offers the features of low dielectric constant, low dissipation factor, high heat resistance and high flame retardancy, and can be made into prepreg or resin film, and thereby used in copper clad laminate or printed circuit board.

Abstract translation: 无卤树脂组合物包含（A）100重量份氰酸酯树脂; （B）5〜50重量份苯乙烯 - 马来酸酐; （C）5〜100重量份聚苯醚树脂; （D）10〜150重量份的磷腈; 和（E）10〜1000重量份的无机填料。 通过使用特定比例的特定成分，无卤树脂组合物具有低介电常数，低耗散因数，高耐热性和高阻燃性的特点，可制成预浸料或树脂膜，从而用于铜包覆 层压板或印刷电路板。

公开(公告)号：US20130101857A1

公开(公告)日：2013-04-25

申请号：US13807663

申请日：2011-06-08

Applicant: Kazuo Arita ,  Etsuko Suzuki

Inventor： Kazuo Arita ,  Etsuko Suzuki

IPC: C08G65/48 ,  H01B3/40 ,  H05K1/03 ,  C08L71/08 ,  C09D171/08

CPC classification number: C08G65/48 ,  C08G59/08 ,  C08G59/42 ,  C08G59/4223 ,  C08G59/4276 ,  C08J5/24 ,  C08J2363/00 ,  C08J2371/08 ,  C08L63/00 ,  C08L67/03 ,  C08L71/08 ,  C09D171/08 ,  H01B3/40 ,  H01B3/421 ,  H05K1/0326 ,  H05K3/323 ,  H05K3/4676 ,  H05K2201/012 ,  Y10T428/31511 ,  Y10T428/31529

Abstract: A thermosetting resin composition contains an active ester resin (A) and an epoxy resin (B) as essential components, the active ester resin (A) having a resin structure which includes a polyaryleneoxy structure (I) and in which aromatic carbon atoms in a plurality of the polyaryleneoxy structures (I) are linked through a structural site (II) represented by a structural formula 1 (wherein Ar represents a phenylene group, a phenylene group nuclear-substituted by 1 to 3 alkyl groups each having 1 to 4 carbon atoms, a naphthylene group, or a naphthylene group nuclear-substituted by 1 to 3 alkyl groups each having 1 to 4 carbon atoms).

Abstract translation: 作为必要成分的热固性树脂组合物含有活性酯树脂（A）和环氧树脂（B），具有树脂结构的活性酯树脂（A）含有聚亚芳基氧基结构（I），其中芳香族碳原子 多个聚亚芳基氧基结构（I）通过由结构式1表示的结构位点（II）连接（其中Ar表示亚苯基，被1〜3个碳原子数为1〜4的烷基核取代的亚苯基） ，亚萘基或被1〜3个碳原子数为1〜4的烷基核取代的亚萘基）。

公开(公告)号：US20130025916A1

公开(公告)日：2013-01-31

申请号：US13360177

申请日：2012-01-27

Applicant: Sergei V. Levchik ,  Anantha Desikan

Inventor： Sergei V. Levchik ,  Anantha Desikan

IPC: B32B27/38 ,  H05K1/09 ,  B32B27/12

CPC classification number: B32B5/024 ,  B32B5/26 ,  B32B5/28 ,  B32B15/14 ,  B32B15/20 ,  B32B2250/05 ,  B32B2250/40 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/3065 ,  B32B2307/714 ,  B32B2457/08 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2203/121 ,  Y10T428/249921 ,  Y10T428/31511

Abstract: There is provided herein an epoxy laminate comprising (a) an epoxy resin composition further comprising (i) at least one curable epoxy resin, (ii) at least one curing agent, (iii) at least one curing catalyst; and, (iv) a flame retardant effective amount of at least one metal phosphonate represented by the general formula: where Me is a metal, n is equal to the valency of the metal which is in the range of from 1 to 4, R1 is a linear or branched alkyl of up to about 12 carbon atoms, R2 is a linear or branched alkyl of up to about 12 carbon atoms or a substituted aryl or unsubstituted aryl of general formula: where R3 hydrogen, or a branched or linear alkyl of up to about 4 carbon atoms, or NH2 or CN or NO2, (b) a reinforcing material; and, (c) a copper foil.

Abstract translation: 本文提供环氧层压板，其包含（a）环氧树脂组合物，其还包含（i）至少一种可固化环氧树脂，（ii）至少一种固化剂，（iii）至少一种固化催化剂; 和（iv）阻燃有效量的至少一种由以下通式表示的金属膦酸盐：其中Me是金属，n等于金属的化合价在1至4的范围内，R1是 高达约12个碳原子的直链或支链烷基，R2是直至约12个碳原子的直链或支链烷基或具有以下通式的取代的芳基或未取代的芳基：其中R 3为氢或上述的支链或直链烷基 至约4个碳原子，或NH 2或CN或NO 2，（b）增强材料; 和（c）铜箔。