公开(公告)号：US08309636B2

公开(公告)日：2012-11-13

申请号：US13161760

申请日：2011-06-16

Applicant: Hyung Mi Jung ,  Jae Choon Cho ,  Choon Keun Lee

Inventor： Hyung Mi Jung ,  Jae Choon Cho ,  Choon Keun Lee

IPC: C08K5/5397

CPC classification number: H05K1/0353 ,  C08G59/08 ,  C08G59/182 ,  C08G59/186 ,  C08G59/304 ,  C08G59/621 ,  H05K1/0326 ,  H05K3/4655 ,  H05K2201/012 ,  Y10T428/12396

Abstract: There are provided a flame-retardant resin composition for a multilayer wiring board and a multilayer wiring board having the same. The flame-retardant resin composition for a multilayer wiring board according to an exemplary embodiment of the present invention includes a composite epoxy resin including a naphthalene modified epoxy resin, a cresol novolac epoxy resin, a rubber modified epoxy resin and a phosphorous-based epoxy resin, as well as a flame retardant represented by a specific chemical formula. The flame-retardant resin composition for a multilayer wiring board and the multilayer wiring board having the same disclosed herein exhibits excellent flame retardancy, moisture resistance and peel strength.

Abstract translation: 提供了一种用于多层布线板的阻燃树脂组合物和具有该阻燃树脂组合物的多层布线板。 根据本发明的示例性实施方案的用于多层布线板的阻燃树脂组合物包括包含萘改性环氧树脂，甲酚酚醛环氧树脂，橡胶改性环氧树脂和磷基环氧树脂的复合环氧树脂 ，以及由特定化学式表示的阻燃剂。 用于多层布线板的阻燃树脂组合物和其中所公开的多层布线板具有优异的阻燃性，耐湿性和剥离强度。

公开(公告)号：US20120279768A1

公开(公告)日：2012-11-08

申请号：US13102306

申请日：2011-05-06

Applicant: Dylan J. Boday ,  Joseph Kuczynski ,  Robert E. Meyer, III

Inventor： Dylan J. Boday ,  Joseph Kuczynski ,  Robert E. Meyer, III

IPC: H05K1/03 ,  C07F7/08 ,  C07F7/10 ,  C08K5/5419 ,  C08K5/5455

CPC classification number: C07F7/0878 ,  C07F7/081 ,  C07F7/0889 ,  C07F7/0896 ,  C07F7/10 ,  C07F7/1804 ,  C08K3/016 ,  C08K5/5419 ,  C08K5/5465 ,  C08K9/06 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209

Abstract: A flame retardant filler having brominated silica particles, for example, imparts flame retardancy to manufactured articles such as printed circuit boards (PCBs), connectors, and other articles of manufacture that employ thermosetting plastics or thermoplastics. In this example, brominated silica particles serve both as a filler for rheology control (viscosity, flow, etc.) and a flame retardant. In an exemplary application, a PCB laminate stack-up includes conductive planes separated from each other by a dielectric material that includes a flame retardant filler comprised of brominated silica particles. In an exemplary method of synthesizing the brominated silica particles, a monomer having a brominated aromatic functional group is reacted with functionalized silica particles (e.g., isocyanate, vinyl, amine, or epoxy functionalized silica particles). Alternatively, a monomer having a brominated aromatic functional group may be reacted with a silane to produce a brominated alkoxysilane monomer, which is then reacted with the surface of silica particles.

Abstract translation: 具有溴化二氧化硅颗粒的阻燃填料例如赋予制造品例如印刷电路板（PCB），连接器以及使用热塑性塑料或热塑性塑料的其它制品的阻燃性。 在该实施例中，溴化二氧化硅颗粒既用作流变控制（粘度，流动等）和阻燃剂的填料。 在示例性应用中，PCB叠层叠层包括通过包含由溴化二氧化硅颗粒构成的阻燃填料的介电材料彼此分离的导电平面。 在合成溴化二氧化硅颗粒的示例性方法中，具有溴化芳族官能团的单体与官能化二氧化硅颗粒（例如异氰酸酯，乙烯基，胺或环氧官能化二氧化硅颗粒）反应。 或者，具有溴化芳族官能团的单体可以与硅烷反应生成溴化烷氧基硅烷单体，然后与二氧化硅颗粒的表面反应。

公开(公告)号：US08288003B2

公开(公告)日：2012-10-16

申请号：US13256724

申请日：2009-08-05

Applicant: Koji Hayashi ,  Yoshiyuki Takahashi ,  Ichirou Ogura

Inventor： Koji Hayashi ,  Yoshiyuki Takahashi ,  Ichirou Ogura

IPC: B32B27/38 ,  C08L61/00 ,  C08L63/00 ,  C08L85/02 ,  C08G59/62 ,  C07F9/28 ,  C07F9/547 ,  H01L23/29

CPC classification number: H05K1/0326 ,  C07F9/657172 ,  C08G8/28 ,  C08G59/621 ,  C08L61/14 ,  C08L63/00 ,  H05K2201/012 ,  Y10T428/31511

Abstract: Provided are a method for producing a phosphorus-containing phenolic compound in which reactivity is considerably excellent in the reaction between a phosphorus-containing compound and an aromatic nucleus of a phenol; in the case of using a polyhydric phenol or a phenolic resin as the phenol, a novel phosphorus-containing phenolic compound that serves as a curing agent for an epoxy resin and imparts excellent heat resistance to a cured product; a curable resin composition containing the novel phosphorus-containing phenolic compound; a cured product of the curable resin composition; a printed wiring board; and a semiconductor sealing material. An aromatic aldehyde (a1) having an alkoxy group as a substituent on an aromatic nucleus is allowed to react with an organic phosphorus compound (a2) intramolecularly having a P—H group or a P—OH group. The resultant reaction product is then allowed to react with a phenol (a3).

Abstract translation: 提供一种含磷酚类化合物的制造方法，其中在含磷化合物和苯酚的芳香核之间的反应中反应性相当优异; 在使用多元酚或酚醛树脂作为酚的情况下，作为环氧树脂固化剂的新型含磷酚类化合物，赋予固化物优异的耐热性; 含有新型含磷酚类化合物的固化性树脂组合物; 固化性树脂组合物的固化物; 印刷线路板; 和半导体密封材料。 在芳香核上具有烷氧基作为取代基的芳族醛（a1）与分子内具有P-H基或P-OH基的有机磷化合物（a2）反应。 然后使所得反应产物与苯酚（a3）反应。

公开(公告)号：US20120103507A1

公开(公告)日：2012-05-03

申请号：US13137937

申请日：2011-09-21

Applicant: Jae Choon Cho ,  Hyung Mi Jung ,  Hwa Young Lee ,  Choon Keun Lee

Inventor： Jae Choon Cho ,  Hyung Mi Jung ,  Hwa Young Lee ,  Choon Keun Lee

IPC: B32B38/04 ,  G03F7/09 ,  B32B37/14 ,  H01L21/02 ,  B32B37/02 ,  G03F7/028 ,  G03F7/38

CPC classification number: H05K3/4676 ,  G03F7/027 ,  G03F7/038 ,  G03F7/0385 ,  H05K3/4661 ,  H05K2201/012 ,  Y10T156/1057

Abstract: Disclosed herein is a method for manufacturing a circuit board. The method for manufacturing a circuit board includes: preparing a photosensitive composite; preparing a build-up insulating film by casting the photosensitive composite into a film made of poly ethylene terephthalate (PET) material; stacking the build-up insulation film on the board; forming via holes on the build-up insulation film by using a photolithography process; and forming conductive vias in the via holes.

Abstract translation: 本文公开了一种用于制造电路板的方法。 制造电路板的方法包括：制备光敏复合材料; 通过将光敏复合材料浇铸成由聚对苯二甲酸乙二醇酯（PET）材料制成的膜来制备积聚绝缘膜; 将积层绝缘膜堆叠在板上; 通过使用光刻工艺在积层绝缘膜上形成通孔; 以及在通孔中形成导电通孔。

公开(公告)号：US20120006588A1

公开(公告)日：2012-01-12

申请号：US13258402

申请日：2010-02-02

Applicant: Hidetaka Kakiuchi ,  Yoshihiko Nakamura ,  Shunji Araki ,  Yuki Miyoshi

Inventor： Hidetaka Kakiuchi ,  Yoshihiko Nakamura ,  Shunji Araki ,  Yuki Miyoshi

IPC: H05K1/00 ,  B32B15/092 ,  C09D163/04

CPC classification number: B32B15/092 ,  B32B7/12 ,  B32B15/14 ,  B32B27/10 ,  B32B27/12 ,  B32B27/281 ,  B32B27/36 ,  B32B27/38 ,  B32B29/002 ,  B32B2255/06 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/02 ,  B32B2262/101 ,  B32B2307/204 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/732 ,  B32B2457/08 ,  C08G59/1488 ,  C08G59/4021 ,  C08G59/62 ,  C08G59/686 ,  C08J5/24 ,  C08J2363/00 ,  C08K5/49 ,  C08L63/00 ,  H05K1/0326 ,  H05K2201/012 ,  Y10T428/31529 ,  C08L71/12 ,  C08L71/126

Abstract: An epoxy resin composition is provided having the necessary flame retardancy and heat resistance for a laminate or multilayer board, and having superior dielectric properties without exhibiting any decrease in interlayer adhesiveness.The epoxy resin composition contains a polyfunctional epoxy resin (A), a polyphenylene ether compound (B) and a phosphorus-modified curing agent (C). A polyphenylene ether (B1) having a number-average molecular weight of 500 to 3000 and an average of 1.0 to 3.0 hydroxyl groups per molecule, and an epoxy resin (B2) obtained by reacting this polyphenylene ether (B1) with an epoxy resin (D) having an average of 2.3 or fewer epoxy groups per molecule and the like, are included as the polyphenylene ether compound (B). A phosphorus-modified epoxy resin (P) is included in at least one selected from the polyfunctional epoxy resin (A), the epoxy resin (D) and a component other than the (A), (B) and (C) above. The phosphorus content is 1.5 to 4.5 mass % as a percentage of the resin solids in the epoxy resin composition.

Abstract translation: 提供一种环氧树脂组合物，其对于层压板或多层板具有必要的阻燃性和耐热性，并且具有优异的介电性能，而不会显示出层间粘合性的任何降低。 环氧树脂组合物含有多官能环氧树脂（A），聚苯醚化合物（B）和磷改性固化剂（C）。 通过使该聚苯醚（B1）与环氧树脂（B1）反应而获得的数均分子量为500〜3000，平均每分子具有1.0〜3.0个羟基的聚苯醚（B1） 作为聚苯醚化合物（B），包含平均每分子的环氧基平均为2.3以下的D）作为聚苯醚化合物（B）。 选自多官能环氧树脂（A），环氧树脂（D）和除上述（A），（B）和（C）以外的成分中的至少一种包含磷改性环氧树脂（P）。 磷含量为环氧树脂组合物中树脂固体的百分比为1.5〜4.5质量％。

公开(公告)号：US20110305883A1

公开(公告)日：2011-12-15

申请号：US13203216

申请日：2010-01-18

Applicant: Shingo Kaimori ,  Jun Sugawara ,  Akira Mizoguchi ,  Syougo Asai ,  Takuma Yoshisaka ,  Naota Uenishi

Inventor： Shingo Kaimori ,  Jun Sugawara ,  Akira Mizoguchi ,  Syougo Asai ,  Takuma Yoshisaka ,  Naota Uenishi

IPC: B32B3/10 ,  C09J7/02 ,  C09J167/02 ,  C09J163/04 ,  C09J171/10 ,  C09J163/02 ,  C09J177/00 ,  B32B7/12 ,  C09J161/14

CPC classification number: C09J167/00 ,  C08G59/304 ,  C08G59/3272 ,  C08G2650/56 ,  C08K5/3437 ,  C08L67/00 ,  C08L77/00 ,  C08L79/04 ,  C08L2666/14 ,  C09J7/22 ,  C09J7/35 ,  C09J163/00 ,  C09J171/00 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2461/00 ,  C09J2463/00 ,  C09J2467/00 ,  C09J2477/00 ,  H01L2924/00013 ,  H05K1/0393 ,  H05K3/386 ,  H05K2201/012 ,  H05K2201/0145 ,  Y10T428/24802 ,  Y10T428/287 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

Abstract: Provided are an adhesive resin composition that is halogen-free, has good adhesiveness, solder heat resistance, and flame retardancy, and has good flow characteristics, and a laminate and a flexible printed wiring board using the same. The adhesive resin composition contains a phosphorus-containing epoxy resin and/or a phosphorus-containing phenoxy resin, a phosphorus-containing polyester resin having a weight-average molecular weight of more than 20,000 and 150,000 or less, another thermoplastic resin, and a curing agent. The adhesive resin composition preferably further contains a benzoxazine compound. Preferably, substantially no inorganic filler is mixed in the adhesive resin composition.

Abstract translation: 本发明提供无卤素，粘合性，焊料耐热性，阻燃性，流动特性良好的粘合性树脂组合物，以及使用该树脂组合物的层叠体和柔性印刷线路板。 粘合剂树脂组合物含有含磷环氧树脂和/或含磷苯氧树脂，重均分子量大于20,000和150,000以下的含磷聚酯树脂，另一种热塑性树脂和固化 代理商 粘合性树脂组合物优选还含有苯并恶嗪化合物。 优选地，在粘合剂树脂组合物中基本上不混合无机填料。

公开(公告)号：US20110207866A1

公开(公告)日：2011-08-25

申请号：US12712238

申请日：2010-02-25

Applicant: Robert M. Japp ,  Kostas I. Papathomas

Inventor： Robert M. Japp ,  Kostas I. Papathomas

IPC: C08K5/07

CPC classification number: H01L23/145 ,  C08K5/0008 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K1/0326 ,  H05K1/0353 ,  H05K2201/012 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0239 ,  H01L2924/00

Abstract: A dielectric composition for forming a dielectric layer usable in circuitized substrates such as PCBs, chip carriers and the like. The composition includes at least three resins: a halogen-free flame retardant, methyl ethyl ketone (prior to final layer formation), manganese octoate, and a coupling agent. The composition does not include a halogen or a fluoropolymer as part thereof. Dielectric layers formed from the composition are capable of withstanding the relatively high temperatures associated with lead-free solder applications. The composition may or may not include inorganic filler as part thereof.

Abstract translation: 用于形成电介质层的电介质组合物，可用于诸如PCB，芯片载体等的电路化基板中。 该组合物包括至少三种树脂：无卤阻燃剂，甲基乙基酮（最终层形成之前），辛酸锰和偶联剂。 该组合物不包括卤素或含氟聚合物作为其一部分。 由组合物形成的介电层能够承受与无铅焊料应用相关的相对较高的温度。 组合物可以包括或可以不包括作为其一部分的无机填料。

公开(公告)号：US20110045303A1

公开(公告)日：2011-02-24

申请号：US12861742

申请日：2010-08-23

Applicant: Yueshan He ,  Tao Cheng ,  Shiguo Su ,  Biwu Wang ,  Jie Li

Inventor： Yueshan He ,  Tao Cheng ,  Shiguo Su ,  Biwu Wang ,  Jie Li

IPC: B32B15/08 ,  C08K5/5399 ,  B32B27/38

CPC classification number: C08K5/357 ,  C08G59/5073 ,  C08G59/621 ,  C08G59/686 ,  C08J5/24 ,  C08J2385/02 ,  C08J2463/00 ,  C08K5/5399 ,  C08L63/00 ,  H05K1/0326 ,  H05K1/0353 ,  H05K1/0366 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10T428/24994 ,  Y10T428/31511 ,  Y10T428/31529

Abstract: The present invention provides a halogen-free flame retardant resin composition, and, a prepreg, a laminate, and a laminate for printed circuit that are made from the halogen-free flame retardant resin composition. The halogen-free flame retardant resin composition comprises: (A) 40-80 parts by weight of the mixture of a phenoxyphosphazene compound (A1) and a dihydrobenzoxazine ring-containing compound (A2), and, the weight ratio between the phenoxyphosphazene compound (A1) and the dihydrobenzoxazine ring-containing compound (A2) being between 1:10 and 1:2; (B) 15-45 parts by weight of a polyepoxy compound; (C) 5-25 parts by weight of a phenolic resin type hardener; and (D) 0.1-1 parts by weight of an imidazole type compound as the curing accelerator. The prepreg, the laminate, and the laminate for printed circuit that are made from the halogen-free flame retardant resin composition provided by the present invention, have excellent flame retardancy, as well as has high glass transition temperature (Tg), high thermal resistance, high flexural strength, high reliability, low dielectric dissipation factor, low moisture, low C.T.E, good chemical resistance, and good processability.

Abstract translation: 本发明提供一种无卤阻燃树脂组合物，以及由无卤阻燃树脂组合物制成的无卤阻燃树脂组合物，预浸料，层压材料和印刷电路用层压材料。 无卤阻燃树脂组合物包含：（A）40-80重量份的苯氧基磷腈化合物（A1）和含二氢苯并恶嗪环的化合物（A2）的混合物，以及苯氧基磷腈化合物（ A1）和含二氢苯并恶嗪环的化合物（A2）为1:10至1:2之间; （B）15-45重量份聚环氧化合物; （C）5-25重量份酚醛树脂型固化剂; 和（D）0.1-1重量份作为固化促进剂的咪唑型化合物。 由本发明提供的无卤阻燃树脂组合物制成的预浸料，层压板和印刷电路用层压板具有优异的阻燃性，并且具有高玻璃化转变温度（Tg），高耐热性 抗弯强度高，可靠性高，介电损耗因数低，水分低，CTE低，耐化学性好，加工性好。

公开(公告)号：US07758964B2

公开(公告)日：2010-07-20

申请号：US11352125

申请日：2006-02-10

Applicant: David D. Lu ,  Eumi Pyun

Inventor： David D. Lu ,  Eumi Pyun

IPC: B32B27/40 ,  C08K5/53

CPC classification number: C09D5/18 ,  C08K5/5313 ,  C09D175/04 ,  C09K21/14 ,  H05K3/285 ,  H05K2201/012 ,  Y10T428/31551 ,  C08L75/04

Abstract: A flame-resistant electrical circuit covercoat composition includes a phosphinate and a urethane solder mask. The composition can be used as a covercoat for flexible circuits.

Abstract translation: 阻燃电路覆盖层组合物包括次膦酸盐和聚氨酯焊接掩模。 该组合物可用作柔性电路的覆盖层。

公开(公告)号：US20100143728A1

公开(公告)日：2010-06-10

申请号：US12443260

申请日：2007-09-10

Applicant: Shinji Tsuchikawa ,  Tomohiko Kotake ,  Masanori Akiyama

Inventor： Shinji Tsuchikawa ,  Tomohiko Kotake ,  Masanori Akiyama

IPC: B32B15/08 ,  C08K5/3492 ,  C08K5/31 ,  B32B27/26

CPC classification number: H05K1/0373 ,  B32B15/08 ,  B32B15/092 ,  B32B15/14 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2305/076 ,  B32B2457/08 ,  C08G59/4021 ,  C08G59/4042 ,  C08G59/506 ,  C08G59/5086 ,  C08G73/12 ,  C08G73/124 ,  C08J5/24 ,  C08J2363/04 ,  C08J2363/08 ,  C08J2423/22 ,  C08J2425/08 ,  C08L25/08 ,  C08L63/00 ,  C08L63/04 ,  C08L63/08 ,  C08L79/085 ,  C08L2201/02 ,  C08L2203/20 ,  H05K1/0353 ,  H05K2201/012 ,  Y10T428/31678 ,  C08L2666/04

Abstract: The present invention provides a thermosetting resin composition comprising (A) a curing agent having an acidic substituent and an unsaturated maleimide group which is produced by a specific method, (B) a 6-substituted guanamine compound and/or dicyandiamide, (C) a copolymer resin comprising specific monomer units and (D) an epoxy resin and a prepreg and a laminated plate which are prepared by using the same. The thermosetting resin composition of the present invention is balanced in all of a copper foil adhesive property, a heat resistance, a moisture absorption, a flame resistance, a metal-stuck heat resistance, a relative dielectric constant and a dielectric loss tangent. They have a low toxicity and are excellent in a safety and a working environment, and therefore a prepreg and a laminated plate which have excellent performances are obtained by using the above thermosetting resin composition.

Abstract translation: 本发明提供一种热固性树脂组合物，其包含（A）具有酸性取代基的固化剂和通过特定方法制备的不饱和马来酰亚胺基团，（B）6-取代胍胺化合物和/或双氰胺，（C） 包含特定单体单元的共聚物树脂和（D）通过使用它们制备的环氧树脂和预浸料和层压板。 本发明的热固性树脂组合物的铜箔粘合性，耐热性，吸湿性，阻燃性，金属粘着耐热性，相对介电常数和介电损耗角正切均衡。 它们具有低毒性，安全性和工作环境优异，因此通过使用上述热固性树脂组合物可以获得具有优异性能的预浸料和层压板。