公开(公告)号：US20160095209A1

公开(公告)日：2016-03-31

申请号：US14498958

申请日：2014-09-26

Applicant: Intel Corporation

Inventor： Robert STARKSTON ,  John GUZEK ,  Patrick NARDI ,  Keith JONES ,  Javier SOTO GONZALEZ

IPC: H05K1/02 ,  H01L23/498 ,  H05K1/18 ,  H01L21/48 ,  H05K1/11 ,  H01L23/31 ,  H01L23/00

CPC classification number: H05K1/0271 ,  H01L23/16 ,  H01L23/49833 ,  H01L23/562 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/284 ,  H05K2201/09136 ,  H05K2201/10977 ,  H05K2201/2009

Abstract: Techniques are disclosed for forming a package substrate with integrated stiffener. A panel of package substrates are provided. An adhesion layer is then formed on each package substrate of the panel of package substrates. A panel of stiffeners are then attached to the panel of package substrates by the adhesion layer, each stiffener corresponding to a respective package substrate. The panel of package substrates is then singulated into individual package substrates with integrated stiffeners. The stiffeners on the singulated package substrates include tabs that extend to the edges of the package substrates.

Abstract translation: 公开了用于形成具有集成的加强件的封装衬底的技术。 提供了一组封装基板。 然后在封装衬底面板的每个封装衬底上形成粘附层。 然后，通过粘合层将一块扶强材板附接到封装基板的面板，每个加强件对应于相应的封装基板。 然后将封装衬底的面板分成具有集成的加强件的单个封装衬底。 单个封装衬底上的加强件包括延伸到封装衬底的边缘的突片。

公开(公告)号：US09293970B2

公开(公告)日：2016-03-22

申请号：US14025000

申请日：2013-09-12

Applicant: JTEKT CORPORATION

Inventor： Motoo Nakai ,  Yasuyuki Wakita

IPC: H02K11/00 ,  B62D5/04 ,  H05K1/02 ,  H05K1/18 ,  H02K5/22 ,  H05K3/00 ,  H05K3/46

CPC classification number: H02K15/02 ,  B62D5/0406 ,  H01L2924/0002 ,  H02K3/50 ,  H02K5/225 ,  H02K11/38 ,  H02K2203/03 ,  H05K1/0203 ,  H05K1/0263 ,  H05K1/185 ,  H05K3/0058 ,  H05K3/4632 ,  H05K2201/10166 ,  H05K2201/2009 ,  H01L2924/00

Abstract: A control device of a motor unit has a gear housing having a supporting wall portion, a ceramic portion formed on the supporting wall portion, a circuit board body fixed to the ceramic portion, a power element located inside the circuit board body, and a load receiving member that is located around the power element inside the circuit board body and receives a load applied to the circuit board body.

Abstract translation: 马达单元的控制装置具有齿轮壳体，该齿轮壳体具有支撑壁部分，形成在支撑壁部分上的陶瓷部分，固定到陶瓷部分的电路板主体，位于电路板主体内部的功率元件和负载 所述接收构件位于所述电路板主体内部并且接收施加到所述电路板主体的负载。

公开(公告)号：US09247651B2

公开(公告)日：2016-01-26

申请号：US12754929

申请日：2010-04-06

Applicant: Hirohito Watanabe

Inventor： Hirohito Watanabe

IPC: H05K1/00 ,  H05K1/03 ,  H05K1/16 ,  H05K1/11 ,  H05K3/28 ,  H05K1/02 ,  H05K3/00 ,  H05K3/38

CPC classification number: H05K3/281 ,  H05K1/0281 ,  H05K3/0058 ,  H05K3/386 ,  H05K2201/2009 ,  H05K2203/0195 ,  H05K2203/0278 ,  Y10T29/49124

Abstract: To improve reliability by preventing separation of a sheet material attached on a flexible printed circuit, provided is a flexible printed circuit including a printed board body and a reinforcing board. A leaked portion of an adhesive agent is formed to leak in an outward direction relative to an end surface of the reinforcing board. The leaked portion adheres to part of the end surface of the reinforcing board to be continuous from a lower end of the end surface to form an inclined surface tapered in the outward direction. The leaked portion is formed such that a portion thereof that covers the end surface has an adhesion height hA, as measured from an adhesive surface of the reinforcing board, of greater than 0% and not greater than 80% of the thickness H1 of the reinforcing board.

Abstract translation: 为了通过防止附着在柔性印刷电路上的片材的分离来提高可靠性，提供了包括印刷板主体和加强板的柔性印刷电路。 粘合剂的泄漏部形成为相对于加强板的端面在向外方向泄漏。 泄漏部分粘附在加强板的端面的一部分上，从端面的下端连续，形成向外方向倾斜的倾斜面。 泄漏部分形成为使得其覆盖端面的部分具有从加强板的粘合表面测量的粘合高度hA大于加强件的厚度H1的0％且不大于80％ 板。

公开(公告)号：US20160007458A1

公开(公告)日：2016-01-07

申请号：US14755173

申请日：2015-06-30

Applicant: NITTO DENKO CORPORATION

Inventor： Naohiro TERADA ,  Yoshito FUJIMURA

IPC: H05K1/11

CPC classification number: H05K1/181 ,  H05K1/0281 ,  H05K1/189 ,  H05K2201/0394 ,  H05K2201/2009 ,  Y02P70/611

Abstract: A suspension board with circuit includes a metal supporting board having a support opening portion passing through a thickness direction; a base insulating layer disposed on an upper surface of the metal supporting board and having an insulating opening portion passing through the thickness direction, when projected in the thickness direction, to be included in the support opening portion; and a conductive layer having a wire portion disposed on an upper surface of the base insulating layer and a terminal portion disposed in the insulating opening portion to be connected to an electronic element and connected to the wire portion. The base insulating layer has a cutout portion obtained by cutting out the base insulating layer in a direction orthogonal to the thickness direction and continuous to the insulating opening portion and the terminal portion includes a terminal free end portion opened by the cutout portion.

Abstract translation: 具有电路的悬挂板包括具有穿过厚度方向的支撑开口部分的金属支撑板; 基底绝缘层，其设置在所述金属支撑基板的上表面上，具有贯穿所述厚度方向的绝缘开口部，当在厚度方向上突出时，所述绝缘开口部包含在所述支撑开口部中; 以及导电层，其具有布置在所述基底绝缘层的上表面上的导线部分和设置在所述绝缘开口部分中以连接到电子元件并连接到所述导线部分的端子部分。 所述基底绝缘层具有通过在与所述厚度方向正交的方向上切割所述基底绝缘层而与所述绝缘开口部连续的端部而形成的切口部，并且所述端子部包括由所述切口部开口的端子自由端部。

公开(公告)号：US20150373830A1

公开(公告)日：2015-12-24

申请号：US14665772

申请日：2015-03-23

Applicant: Kabushiki Kaisha Toshiba

Inventor： Shigenori Miyagawa ,  Daisuke Maehara

IPC: H05K1/02

CPC classification number: H05K1/028 ,  H05K1/0281 ,  H05K3/4691 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/09145 ,  H05K2201/09781 ,  H05K2201/2009

Abstract: According to one embodiment, a composite substrate includes a soft layer, a hard layer, a rigid portion and a flexible portion. The soft layer includes a first conductor layer with a conductor pattern and a first flexible insulating layer. The hard layer includes a second conductor layer with a conductor pattern and a second rigid insulating layer. The rigid portion is formed by laminating the soft layer and the hard layer. The flexible portion includes a transition portion which is in proximity to the rigid portion by extending the soft layer and is wider than an interconnect portion.

Abstract translation: 根据一个实施例，复合基板包括软层，硬质层，刚性部分和柔性部分。 软层包括具有导体图案的第一导体层和第一柔性绝缘层。 硬层包括具有导体图案的第二导体层和第二刚性绝缘层。 刚性部分通过层压软层和硬层形成。 柔性部分包括通过延伸软层并且比互连部分更宽的靠近刚性部分的过渡部分。

公开(公告)号：US09177821B2

公开(公告)日：2015-11-03

申请号：US14259042

申请日：2014-04-22

Applicant: Electronics and Telecommunications Research Institute

Inventor： Soon-Won Jung ,  Jae Bon Koo ,  Chan Woo Park ,  Bock Soon Na ,  Sang Chul Lim ,  Sang Seok Lee ,  Kyoung Ik Cho ,  Hye Yong Chu

IPC: H01L21/338 ,  H01L21/311 ,  H01L29/66

CPC classification number: H01L21/311 ,  G09F9/301 ,  H01L29/66477 ,  H01L51/0023 ,  H01L51/0055 ,  H01L51/0525 ,  H01L51/102 ,  H05K1/0283 ,  H05K1/0333 ,  H05K1/16 ,  H05K3/0017 ,  H05K3/007 ,  H05K2201/0133 ,  H05K2201/0162 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/10166 ,  H05K2201/2009 ,  H05K2203/308

Abstract: Provided is a method of fabricating an electronic circuit. The method includes preparing a substrate, forming a polymer film on the substrate, patterning the polymer film to form a polymer pattern, and forming an electronic device on the polymer pattern.

Abstract translation: 提供一种制造电子电路的方法。 该方法包括制备基底，在基底上形成聚合物膜，图案化聚合物膜以形成聚合物图案，并在聚合物图案上形成电子器件。

公开(公告)号：US09167697B2

公开(公告)日：2015-10-20

申请号：US13792362

申请日：2013-03-11

Applicant: Samsung Display Co., Ltd.

Inventor： Joon-Sam Kim ,  Jong-Hwan Kim ,  Sang-Won Yeo

IPC: H05K1/16 ,  H05K1/18 ,  H05K3/32 ,  G09G3/32

CPC classification number: H05K1/181 ,  G09G3/3208 ,  H05K3/323 ,  H05K2201/2009 ,  H05K2203/0278 ,  H05K2203/166

Abstract: A display panel that includes: a display substrate; a driving chip bonded onto the display substrate; an anisotropic conductive film provided between the display substrate and the driving chip; and a protection film attached to a bottom of the display substrate, and the protection film is provided with a bending prevention means.

Abstract translation: 一种显示面板，包括：显示基板; 驱动芯片，结合到显示基板上; 设置在显示基板和驱动芯片之间的各向异性导电膜; 以及附着在显示基板的底部的保护膜，并且保护膜设置有弯曲防止装置。

公开(公告)号：US20150264806A1

公开(公告)日：2015-09-17

申请号：US14335700

申请日：2014-07-18

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Akihiko HAPPOYA ,  Daigo SUZUKI

IPC: H05K1/02 ,  H05K3/38 ,  H05K3/10

CPC classification number: H05K1/0298 ,  H05K1/028 ,  H05K1/0281 ,  H05K3/0061 ,  H05K3/10 ,  H05K3/38 ,  H05K2201/09036 ,  H05K2201/2009 ,  Y10T29/49155

Abstract: According to one embodiment, a printed wiring board includes a circuit board, a ground pattern provided on the circuit board, a wiring pattern provided on the circuit board, a conductive reinforcing plate covering the ground pattern and the wiring pattern and electrically connected with the ground pattern, and an insulating portion provided between the conductive reinforcing plate and the wiring pattern.

Abstract translation: 根据一个实施例，印刷电路板包括电路板，设置在电路板上的接地图案，设置在电路板上的布线图案，覆盖接地图案的导电加强板和布线图案并与地面电连接 以及设置在导电性加强板和布线图案之间的绝缘部。

公开(公告)号：US20150159812A1

公开(公告)日：2015-06-11

申请号：US14099483

申请日：2013-12-06

Applicant: Richard Speer ,  David Hamby ,  Kenneth Grossman

Inventor： Richard Speer ,  David Hamby ,  Kenneth Grossman

IPC: F21K99/00 ,  H05K1/18

CPC classification number: H05K1/189 ,  H05K1/0281 ,  H05K2201/10106 ,  H05K2201/2009

Abstract: Substrates for electronic components are disclosed. In some example embodiments, a light source is provided with a substrate, at least one electronic package coupled to said substrate by an adhesive at an associated mounting location, and a stiffener proximate to said mounting location for reducing flexing of said substrate in said mounting location compared to flexing of said substrate in said mounting location in the absence of said stiffener.

Abstract translation: 公开了电子部件用基板。 在一些示例性实施例中，光源设置有基底，至少一个电子封装，通过相关联的安装位置处的粘合剂耦合到所述基底，以及靠近所述安装位置的加强件，用于减少所述基板在所述安装位置的弯曲 相比于在没有所述加强件的情况下在所述安装位置中的所述基板的弯曲。

公开(公告)号：US20150116970A1

公开(公告)日：2015-04-30

申请号：US14396297

申请日：2013-04-05

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Arata Kishi ,  Hironori Munakata ,  Koji Motomura ,  Hiroki Maruo

IPC: H05K1/18 ,  H01L23/00

CPC classification number: H05K1/181 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/10156 ,  H01L2224/16238 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32052 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81052 ,  H01L2224/81191 ,  H01L2224/8159 ,  H01L2224/81609 ,  H01L2224/81611 ,  H01L2224/81613 ,  H01L2224/81639 ,  H01L2224/81647 ,  H01L2224/81815 ,  H01L2224/81935 ,  H01L2224/81951 ,  H01L2224/81986 ,  H01L2224/83104 ,  H01L2224/83192 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/384 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2201/2009 ,  H05K2201/2036 ,  H05K2201/2045 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A mounting structure includes a bonding material (106) that bonds second electrodes (104) of a circuit board (105) and bumps (103) of a semiconductor package (101), the bonding material (106) being surrounded by a first reinforcing resin (107). Moreover, a portion between the outer periphery of the semiconductor package (101) and the circuit board (105) is covered with a second reinforcing resin (108). Even if the bonding material (106) is a solder material having a lower melting point than a conventional bonding material, high drop resistance is obtained.

Abstract translation: 安装结构包括将电路板（105）的第二电极（104）和半导体封装（101）的凸块（103）接合的接合材料（106），所述接合材料（106）被第一增强树脂 （107）。 此外，半导体封装（101）的外周与电路基板（105）之间的部分被第二增强树脂（108）覆盖。 即使接合材料（106）是具有比常规接合材料低的熔点的焊料，也可获得高的耐滴落性。