公开(公告)号：US20240004431A1

公开(公告)日：2024-01-04

申请号：US18456065

申请日：2023-08-25

Applicant: Samsung Display Co., LTD.

Inventor： Jun NAMKUNG ,  Soonryong PARK ,  Chulwoo JEONG

IPC: G06F1/16 ,  G02F1/1333 ,  H05K1/02

CPC classification number: G06F1/1652 ,  G02F1/133305 ,  H05K1/028 ,  H05K2201/055 ,  H10K59/12 ,  H05K2201/09845 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/09036

Abstract: A flexible display device includes a flexible display panel and a first outer member having a groove pattern. The groove pattern includes a flat surface and inclined portions connected to the flat surface and symmetrical with each other.

公开(公告)号：US20230397327A1

公开(公告)日：2023-12-07

申请号：US18235937

申请日：2023-08-21

Applicant: Samsung Display Co., LTD.

Inventor： Seung Min SONG ,  Ki Nyeng KANG ,  Seon Beom JI ,  Tae Hoon YANG

IPC: H05K1/02 ,  H05K5/00 ,  H10K50/844 ,  H10K77/10

CPC classification number: H05K1/0277 ,  H05K5/0017 ,  H10K50/844 ,  H10K77/111 ,  H05K2201/055

Abstract: A display device includes: a display panel including a bending area; and a first passivation film and a second passivation film disposed on a first surface of the display panel to be spaced apart from each other. The second passivation film includes a first flat portion and a first stepped portion overlapping the bending area, and a thickness of the first stepped portion is less than a thickness of the first flat portion.

公开(公告)号：US11751328B1

公开(公告)日：2023-09-05

申请号：US18172781

申请日：2023-02-22

Applicant: CelLink Corporation

Inventor： Jean-Paul Ortiz ,  Malcom Parker Brown ,  Mark Terlaak ,  Will Findlay ,  Kevin Michael Coakley ,  Casey Anderson

IPC: H05K1/02 ,  H05K3/02

CPC classification number: H05K1/028 ,  H05K1/0296 ,  H05K3/02 ,  H05K2201/055

Abstract: Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.

公开(公告)号：US11729905B2

公开(公告)日：2023-08-15

申请号：US17221717

申请日：2021-04-02

Applicant: Industrial Technology Research Institute

Inventor： Yu-Lin Hsu ,  Hung-Hsien Ko ,  Ting-Yu Ke ,  Ting-Yu Wang

IPC: H05K1/02 ,  H01L27/32 ,  H05K3/00

CPC classification number: H05K1/0283 ,  H05K3/0005 ,  H05K2201/055

Abstract: A stretchable circuit is provided in the invention. The stretchable circuit comprises a plurality of segments. Each segment includes a plurality of sub-segments. Each sub-segment includes at least one main line, at least one secondary line, and rib lines, and in each sub-segment, the main lines and the secondary lines are electrically connected to the rib lines.

公开(公告)号：US11672079B2

公开(公告)日：2023-06-06

申请号：US17444364

申请日：2021-08-03

Applicant: AT&S (China) Co. Ltd.

Inventor： Nick Xin ,  Mikael Tuominen

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/03 ,  H05K1/18 ,  H05K1/14

CPC classification number: H05K1/028 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/181 ,  H05K1/0277 ,  H05K1/0278 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/118 ,  H05K1/148 ,  H05K2201/046 ,  H05K2201/05 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/058

Abstract: A component carrier, wherein the component carrier includes: i) a layer stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, ii) a bendable portion which forms at least a part of the layer stack, and iii) a metal layer which forms at least a part of the bendable portion. Hereby, the metal layer extends over at least 75% of the area of the bendable portion.

公开(公告)号：US20190239345A1

公开(公告)日：2019-08-01

申请号：US16378943

申请日：2019-04-09

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Young LIM ,  Woong Sik KIM ,  Hyung Kyu YOON ,  Min Hwan KIM

IPC: H05K1/02 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H05K1/14 ,  H05K3/18 ,  H05K3/28

CPC classification number: H05K1/0281 ,  H01L21/481 ,  H01L21/4821 ,  H01L21/4867 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/15153 ,  H05K1/0271 ,  H05K1/144 ,  H05K1/189 ,  H05K3/18 ,  H05K3/28 ,  H05K2201/055 ,  H05K2201/10128

Abstract: A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.

公开(公告)号：US10004139B2

公开(公告)日：2018-06-19

申请号：US15238651

申请日：2016-08-16

Applicant: Chicony Electronics Co., Ltd.

Inventor： Liang-Chun Yeh

IPC: H05K1/02 ,  F21V19/00 ,  H05K1/18 ,  H01H13/83

CPC classification number: H05K1/028 ,  F21V19/001 ,  H01H13/83 ,  H01H2219/04 ,  H01H2229/038 ,  H05K1/0274 ,  H05K1/189 ,  H05K2201/052 ,  H05K2201/055 ,  H05K2201/10106

Abstract: A flexible printed circuit board of a light guide module and a cut-out structure thereof. The flexible printed circuit board is made by cutting an FPC material and is formed after folding and unfolding. The flexible printed circuit board includes two light emitting plates and an extension strip. The two light emitting plates each has a connection portion. The extension strip is integrally connected between the two connection portions. Two ends of the two light emitting plates and the extension strip have two fold lines respectively, so that the extension strip is disposed between the two light emitting plates along an extension direction to separate the two light emitting plates away from each other.

公开(公告)号：US09930773B2

公开(公告)日：2018-03-27

申请号：US15188453

申请日：2016-06-21

Applicant: Microsoft Technology Licensing, LLC

Inventor： James David Holbery ,  Siyuan Ma ,  Michael David Dickey

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K3/10 ,  H05K3/46 ,  G06F1/16

CPC classification number: H05K1/0272 ,  G06F1/1613 ,  H01R12/59 ,  H01R12/77 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/03 ,  H05K1/092 ,  H05K1/148 ,  H05K3/10 ,  H05K3/1275 ,  H05K3/361 ,  H05K3/4644 ,  H05K2201/032 ,  H05K2201/0338 ,  H05K2201/0391 ,  H05K2201/055 ,  H05K2201/09009 ,  H05K2201/09736 ,  H05K2203/0776

Abstract: Examples are provided for a flexible circuit element including a flexible insulating support structure, a solid metal trace extending at least partially between a first connector and a second connector on the flexible insulating support structure, and a liquid metal conductor disposed in contact with the solid metal trace in a region of the trace configured to repeatedly flex when installed in a device.

公开(公告)号：US20180063942A1

公开(公告)日：2018-03-01

申请号：US15677505

申请日：2017-08-15

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Byoung Yong KIM ,  Jeong Ho HWANG

IPC: H05K1/02 ,  H05K1/14 ,  G02F1/1333 ,  H01L23/31 ,  H01L51/00

CPC classification number: H05K1/028 ,  G02F1/133305 ,  G06F1/1637 ,  G06F1/1652 ,  H01L23/3171 ,  H01L51/0097 ,  H01L2251/5338 ,  H05K1/147 ,  H05K3/4691 ,  H05K2201/055 ,  Y02E10/549

Abstract: A display device includes a display panel with a first area having pixels on a first surface of a substrate, a second area having pads on the first surface of the substrate, and a third area part of the second area and having the second surface of the substrate bent toward the first surface, and a flexible PCB with a first bent portion in the second area and contacting and electrically connected to the pads, the first bent portion being bent from inside of the display panel toward an external side of the display panel to wrap around an edge of the display panel, and a second bent portion extending from the first bent portion and wrapping an external side of the second area and bent toward the inside of the display panel from the external side of the display panel to contact the second surface of the substrate.

公开(公告)号：US20180022013A1

公开(公告)日：2018-01-25

申请号：US15649124

申请日：2017-07-13

Applicant: Samsung Display Co., Ltd.

Inventor： Myung Gil CHOI ,  Jung Min LEE ,  Sang Moo LEE ,  Sae Sam JANG

IPC: B29C53/36 ,  B32B37/14 ,  H05K1/02 ,  B32B37/12

CPC classification number: B29C53/36 ,  B29L2031/3425 ,  B29L2031/3437 ,  B29L2031/3475 ,  B32B37/12 ,  B32B37/14 ,  B32B37/18 ,  B32B38/1866 ,  B32B2457/08 ,  H05K1/028 ,  H05K1/189 ,  H05K3/323 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/10128

Abstract: A method of manufacturing a display device includes bending a first film member of a processing object such that a part of one side of the first film member surrounds a part of an outer side of a bending area of a second film member of the processing object while the first film member is laminated on the second film member.