公开(公告)号：US20090181488A1

公开(公告)日：2009-07-16

申请号：US12382142

申请日：2009-03-10

Applicant: Gregory A. Carlson ,  John S. Foster ,  Christopher S. Gudeman ,  Paul J. Rubel

Inventor： Gregory A. Carlson ,  John S. Foster ,  Christopher S. Gudeman ,  Paul J. Rubel

IPC: H01L21/306

CPC classification number: H01H1/0036 ,  H01H61/04 ,  H01H2001/0047 ,  H01H2001/0078 ,  H01H2061/006 ,  H01H2061/008

Abstract: A separated MEMS thermal actuator is disclosed which is largely insensitive to creep in the cantilevered beams of the thermal actuator. In the separated MEMS thermal actuator, a inlaid cantilevered drive beam formed in the same plane, but separated from a passive beam by a small gap. Because the inlaid cantilevered drive beam and the passive beam are not directly coupled, any changes in the quiescent position of the inlaid cantilevered drive beam may not be transmitted to the passive beam, if the magnitude of the changes are less than the size of the gap.

公开(公告)号：US20090053855A1

公开(公告)日：2009-02-26

申请号：US12285817

申请日：2008-10-15

Applicant: Jeffery F. Summers

Inventor： Jeffery F. Summers

IPC: H01L21/56 ,  H01L21/67

CPC classification number: H01L23/26 ,  B81B7/0038 ,  G01J5/045 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10T29/41 ,  H01L2924/00

Abstract: A method for providing improved gettering in a vacuum encapsulated device is described. The method includes forming a plurality of small indentation features in a device cavity formed in a lid wafer. The gettering material is then deposited over the indentation features. The indentation features increase the surface area of the getter material, thereby increasing the volume of gas that the getter material can absorb. This may improve the vacuum maintained within the vacuum cavity over the lifetime of the vacuum encapsulated device.

Abstract translation: 描述了一种在真空封装装置中提供改进吸气的方法。 该方法包括在形成在盖晶片中的器件空腔中形成多个小凹陷特征。 然后将吸气材料沉积在压痕特征上。 凹陷特征增加吸气材料的表面积，从而增加吸气剂材料可吸收的气体体积。 这可以在真空密封装置的寿命期内改善在真空腔内保持的真空。

公开(公告)号：US07462931B2

公开(公告)日：2008-12-09

申请号：US11433435

申请日：2006-05-15

Applicant: Jeffery F. Summers

Inventor： Jeffery F. Summers

IPC: H01L23/12 ,  H01L23/48

CPC classification number: H01L23/26 ,  B81B7/0038 ,  G01J5/045 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10T29/41 ,  H01L2924/00

Abstract: A method for providing improved gettering in a vacuum encapsulated device is described. The method includes forming a plurality of small indentation features in a device cavity formed in a lid wafer. The gettering material is then deposited over the indentation features. The indentation features increase the surface area of the getter material, thereby increasing the volume of gas that the getter material can absorb. This may improve the vacuum maintained within the vacuum cavity over the lifetime of the vacuum encapsulated device.

Abstract translation: 描述了一种在真空封装装置中提供改进吸气的方法。 该方法包括在形成在盖晶片中的器件空腔中形成多个小凹陷特征。 然后将吸气材料沉积在压痕特征上。 凹陷特征增加吸气材料的表面积，从而增加吸气剂材料可吸收的气体体积。 这可以在真空密封装置的寿命期内改善在真空腔内保持的真空。

公开(公告)号：US20080006850A1

公开(公告)日：2008-01-10

申请号：US11482944

申请日：2006-07-10

Applicant: Kimon Ribnicek ,  Gregory A. Carlson ,  Paulo Silveira da Motta ,  Jian Zhao

Inventor： Kimon Ribnicek ,  Gregory A. Carlson ,  Paulo Silveira da Motta ,  Jian Zhao

IPC: H01L29/76 ,  H01L21/20

CPC classification number: H01L21/76898 ,  B81B2203/0353 ,  B81C1/00087 ,  B81C2201/0181

Abstract: A method for forming through wafer vias in a substrate uses a Cr/Au seed layer to plate the bottom of a blind trench formed in the front side of a substrate. Thereafter, a reverse plating process uses a forward current to plate the bottom and sides of the blind hole, and a reverse current to de-plate material in or near the top. Using the reverse pulse plating technique, the plating proceeds generally from the bottom of the blind hole to the top. To form the through wafer via, the back side of the substrate is ground or etched away to remove material up to and including the dead-end wall of the blind hole.

Abstract translation: 用于在衬底中形成晶片通孔的方法使用Cr / Au种子层来平坦化形成在衬底前侧的盲沟的底部。 此后，反向电镀工艺使用正向电流来平板盲孔的底部和侧面，以及在顶部中或附近的去镀材料的反向电流。 使用反向脉冲电镀技术，电镀通常从盲孔的底部到顶部。 为了形成贯通晶片通孔，将衬底的背面研磨或蚀刻掉以去除直到并包括盲孔的死端壁的材料。

公开(公告)号：US20070238262A1

公开(公告)日：2007-10-11

申请号：US11390085

申请日：2006-03-28

Applicant: Jeffery Summers

Inventor： Jeffery Summers

IPC: H01L21/46

CPC classification number: H01L23/10 ,  B81C1/00269 ,  B81C2203/0109 ,  B81C2203/019 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/00

Abstract: A material for bonding a lid wafer to a device wafer, which includes an adhesive substance with rigid particles embedded in the adhesive substance. The rigid particles may be particles or spheres of alumina, silica, or diamond, for example. The adhesive substance may be glass frit, epoxy, glue, cement or solder, for example. When the adhesive is applied and melted, and pressure is applied between the lid wafer and the device wafer, the lid wafer approaches the device wafer until a minimum separation is reached, which is defined by the rigid particles.

Abstract translation: 用于将盖晶片接合到器件晶片的材料，其包括具有嵌入粘合物质中的刚性粒子的粘合物质。 刚性颗粒可以是例如氧化铝，二氧化硅或金刚石的颗粒或球体。 粘合剂物质可以是例如玻璃料，环氧树脂，胶水，水泥或焊料。 当粘合剂被施加和熔化并且在盖晶片和器件晶片之间施加压力时，盖晶片接近器件晶片，直到达到由刚性粒子限定的最小间隔。

公开(公告)号：US20070236313A1

公开(公告)日：2007-10-11

申请号：US11211623

申请日：2005-08-26

Applicant: Andrew Wallis ,  John Foster ,  Paul Rubel ,  Kimon Rybnicek ,  Michael Shillinger ,  Jeffery Summers

Inventor： Andrew Wallis ,  John Foster ,  Paul Rubel ,  Kimon Rybnicek ,  Michael Shillinger ,  Jeffery Summers

IPC: H01F7/08

CPC classification number: H01H59/0009

Abstract: Systems and methods for forming an electrostatic MEMS switch include forming a cantilevered beam on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. The hermetic seal may be a gold/indium alloy, formed by heating a layer of indium plated over a layer of gold. Electrical access to the electrostatic MEMS switch may be made by forming vias through the thickness of the second substrate.

Abstract translation: 用于形成静电MEMS开关的系统和方法包括在第一基板上形成悬臂梁，在第二基板上形成电触头，并且使用气密密封来连接两个基板。 气密密封可以是金/铟合金，通过加热镀在一层金上的铟层而形成。 可以通过形成穿过第二基板的厚度的通孔来进行对静电MEMS开关的电接入。

公开(公告)号：US07276991B2

公开(公告)日：2007-10-02

申请号：US11221745

申请日：2005-09-09

Applicant: Paul J. Rubel

Inventor： Paul J. Rubel

IPC: H01P1/10

CPC classification number: H01H59/0009 ,  H01H9/38 ,  H01H9/42

Abstract: A multiple switch MEMS structure has a higher resistance, higher durability switch arranged in parallel with a lower resistance, less durable switch. By closing the higher resistance, high durability switch before the lower resistance, less durable switch, the lower resistance, less durable switch is protected from voltage transients and arcing which may otherwise damage the lower resistance, less durable switch. By appropriate selection of dimensions and materials, the high resistance, high durability switch may be assured to close first, as well as open first, thereby also protecting the lower resistance, less durable switch from voltage transients upon opening as well as upon closing.

公开(公告)号：US20070222004A1

公开(公告)日：2007-09-27

申请号：US11386733

申请日：2006-03-23

Applicant: Gregory Carlson ,  John Foster ,  Donald Liu ,  Douglas Thompson

Inventor： Gregory Carlson ,  John Foster ,  Donald Liu ,  Douglas Thompson

IPC: H01L29/82

CPC classification number: H01H1/0036 ,  C23C28/021 ,  C23C28/023 ,  C25D3/562 ,  C25D5/022 ,  C25D5/54 ,  H01H2001/0047 ,  H01H2061/006

Abstract: A material for forming a conductive structure for a MEMS device is described, which is an alloy containing about 0.01% manganese and the remainder nickel. Data shows that the alloy possesses advantageous mechanical and electrical properties. In particular, the sheet resistance of the alloy is actually lower than the sheet resistance of the pure metal. In addition, the alloy may have superior creep and higher recrystallization temperature than the pure metal. It is hypothesized that these advantageous material properties are a result of the larger grain structure existing in the NiMn alloy film compared to the pure nickel metal film. These properties may make the alloy appropriate for applications such as MEMS thermal electrical switches for telecommunications applications.

Abstract translation: 描述了一种用于形成用于MEMS器件的导电结构的材料，其是含有约0.01％锰及其余镍的合金。 数据显示，该合金具有有利的机械和电学性能。 特别地，合金的薄层电阻实际上低于纯金属的薄层电阻。 此外，与纯金属相比，合金具有优异的蠕变和更高的再结晶温度。 假设这些有利的材料性质是与纯镍金属膜相比NiMn合金膜中存在较大的晶粒结构的结果。 这些性能可以使合金适用于诸如用于电信应用的MEMS热电开关的应用。

公开(公告)号：US07264972B2

公开(公告)日：2007-09-04

申请号：US10978947

申请日：2004-11-01

Applicant: John Stuart Foster

Inventor： John Stuart Foster

IPC: G01N1/10 ,  G01N21/64

CPC classification number: B01L3/502761 ,  B01L2200/0647 ,  B01L2300/0816 ,  B01L2300/0864 ,  B01L2300/0874 ,  B01L2400/0487 ,  B01L2400/0622 ,  B01L2400/0633 ,  B07C5/3425 ,  G01N2015/0288 ,  G01N2021/6482 ,  Y10T436/11 ,  Y10T436/112499 ,  Y10T436/25375 ,  Y10T436/2575

Abstract: A micromechanical actuator for sorting hematopoietic stem cells for use in cancer therapies. The actuator operates by diverting cells into one of a number of possible pathways fabricated in the fabrication substrate of the micromechanical actuator, when fluorescence is detected emanating from the cells. The fluorescence results from irradiating the cells with laser light, which excites a fluorescent tag attached to the cell. The micromechanical actuator thereby sorts the cells individually, with an operation rate of 3.3 kHz, however with the massively parallel 1024-fold device described herein, a throughput of 3.3 million events/second is achievable.

Abstract translation: 用于分选用于癌症治疗的造血干细胞的微机械致动器。 当从细胞发出荧光时，致动器通过将细胞转移到在微机械致动器的制造衬底中制造的许多可能通路中的一个中。 用激光照射细胞产生荧光，激发附着于细胞的荧光标记物。 因此，微机械致动器以3.3kHz的操作速率单独地对单元进行排序，然而通过本文描述的大规模平行的1024倍设备，可实现330万次/秒的吞吐量。

公开(公告)号：US07210352B2

公开(公告)日：2007-05-01

申请号：US11151442

申请日：2005-06-14

Applicant: John S. Foster ,  Paul J. Rubel

Inventor： John S. Foster ,  Paul J. Rubel

IPC: G01P15/125

CPC classification number: G01P15/125 ,  G01P15/18 ,  G01P2015/0831

Abstract: A teeter-totter apparatus uses a curved beam to generate a differential output which may be indicative of an acceleration applied to the apparatus. The curved-beam teeter-totter apparatus can be combined with an x-axis and y-axis accelerometer, to produce a tri-axis accelerometer which is sensitive to an acceleration applied in any direction. Damping plates may be added to the accelerometers to reduce unwanted motion.

Abstract translation: 跷跷板装置使用弯曲光束来产生差分输出，其可以指示施加到装置的加速度。 弯梁式跷跷板装置可以与x轴和y轴加速度计组合，以产生对任何方向施加的加速度敏感的三轴加速度计。 可以将阻尼板加到加速度计上以减少不必要的运动。