公开(公告)号：US08359758B2

公开(公告)日：2013-01-29

申请号：US12672997

申请日：2008-04-15

Applicant: Sung Sik Lee ,  Myung Lae Lee ,  Chang Han Je ,  Gunn Hwang ,  Chang Auck Choi

Inventor： Sung Sik Lee ,  Myung Lae Lee ,  Chang Han Je ,  Gunn Hwang ,  Chang Auck Choi

IPC: G01C9/00

CPC classification number: G01C9/00 ,  G01C9/06

Abstract: A three-dimensional inclination angle calculation circuit is provided. The three-dimensional inclination angle calculation circuit includes: X-axis, Y-axis, and Z-axis vibration sensors which change X-axis, Y-axis, and Z-axis electrostatic capacitances according to three-dimensional positions of a measured plane with respect to a reference plane, respectively; X-axis, Y-axis, and Z-axis position value acquisition units which acquire X-axis, Y-axis, and Z-axis position values corresponding to the X-axis, Y-axis, and Z-axis electrostatic capacitances, respectively; and an inclination angle calculation unit which calculates an inclination angle of the measured plane with respect to the reference plane based on the X-axis, Y-axis, and Z-axis position values. Accordingly, it is possible to very easily calculate an inclination angle according to a three-dimensional position of a to-be-measured apparatus by using an existing vibration sensor.

Abstract translation: 提供三维倾斜角计算电路。 三维倾斜角计算电路包括：根据测量平面的三维位置改变X轴，Y轴和Z轴静电电容的X轴，Y轴和Z轴振动传感器 分别相对于参考平面; 获取对应于X轴，Y轴和Z轴静电电容的X轴，Y轴和Z轴位置值的X轴，Y轴和Z轴位置值获取单元， 分别; 以及倾斜角计算单元，其基于X轴，Y轴和Z轴位置值计算测量平面相对于参考平面的倾斜角度。 因此，通过使用现有的振动传感器，可以非常容易地计算出被测量装置的三维位置的倾斜角度。

公开(公告)号：US20120139066A1

公开(公告)日：2012-06-07

申请号：US13252733

申请日：2011-10-04

Applicant: Chang Han JE ,  Jaewoo Lee ,  Woo Seok Yang ,  Jongdae Kim

Inventor： Chang Han JE ,  Jaewoo Lee ,  Woo Seok Yang ,  Jongdae Kim

IPC: H01L29/84

CPC classification number: H04R19/005 ,  H04R1/222 ,  H04R19/04 ,  H04R31/00

Abstract: Disclosed is a micro electro mechanical system (MEMS) microphone including: a substrate; an acoustic chamber formed by processing the substrate; a lower electrode formed on the acoustic chamber and fixed to the substrate; a diaphragm formed over the lower electrode so as to be spaced apart from the lower electrode by a predetermined interval; and a diaphragm discharge hole formed at a central portion of the diaphragm. According to an exemplary embodiment of the present disclosure, attenuation generated by an air layer between the diaphragm and the lower electrode in a MEMS microphone may be effectively reduced, thereby making it possible to obtain high sensitivity characteristics and reduce a time and a cost required for removing a sacrificial layer between the diaphragm and the lower electrode.

Abstract translation: 公开了一种微机电系统（MEMS）麦克风，包括：基板; 通过处理衬底形成的声学室; 形成在所述声室上并固定到所述基板的下电极; 隔膜，形成在所述下电极上，以与所述下电极隔开预定间隔; 以及形成在隔膜的中心部分处的隔膜排出孔。 根据本公开的示例性实施例，可以有效地减少由MEMS麦克风中的隔膜和下电极之间的空气层产生的衰减，从而使得可以获得高灵敏度特性并减少所需的时间和成本 去除隔膜和下电极之间的牺牲层。

公开(公告)号：US08113054B2

公开(公告)日：2012-02-14

申请号：US12517068

申请日：2007-12-05

Applicant: Chang-Han Je ,  Gunn Hwang ,  Sung-Hae Jung ,  Myung-Lae Lee ,  Chang-Auck Choi

Inventor： Chang-Han Je ,  Gunn Hwang ,  Sung-Hae Jung ,  Myung-Lae Lee ,  Chang-Auck Choi

IPC: G01P15/125

CPC classification number: G01P15/125 ,  G01P15/0802

Abstract: A conventional capacitive accelerometer has a limitation in reducing a distance between a sensing electrode and a reference electrode, and requires a complex process and a separate method of correcting a clearance difference caused by a process error. However, the capacitive accelerometer of the present invention has high sensitivity, can be simply manufactured by maintaining a very narrow distance between a reference electrode and a sensing electrode, and can make it unnecessary to individually correct each manufactured accelerometer by removing or drastically reducing a functional difference due to a process error.

Abstract translation: 常规的电容加速度计在减小感测电极和参考电极之间的距离方面具有局限性，并且需要一种复杂的过程和用于校正由过程误差引起的间隙差异的单独方法。 然而，本发明的电容加速度计具有高的灵敏度，可以通过在参考电极和感测电极之间保持非常窄的距离来简单地制造，并且可以使得不需要通过去除或大幅度地减少功能性来单独校正每个制造的加速度计 差异由于过程错误。

公开(公告)号：US08035176B2

公开(公告)日：2011-10-11

申请号：US12517557

申请日：2007-07-25

Applicant: Sung-Hae Jung ,  Myung-Lae Lee ,  Gunn Hwang ,  Chang-Kyu Kim ,  Chang-Han Je ,  Chang-Auck Choi

Inventor： Sung-Hae Jung ,  Myung-Lae Lee ,  Gunn Hwang ,  Chang-Kyu Kim ,  Chang-Han Je ,  Chang-Auck Choi

IPC: H01L29/84 ,  H01L21/00

CPC classification number: B81C1/0023 ,  B81B2207/012 ,  B81B2207/096 ,  B81C2203/0118 ,  H01L2224/13

Abstract: Provided are a Micro Electro-Mechanical System (MEMS) package and a method of packaging the MEMS package. The MEMS package includes: a MEMS device including MEMS structures formed on a substrate, first pad electrodes driving the MEMS structures, first sealing parts formed at an edge of the substrate, and connectors formed on the first pad electrodes and the first sealing parts; and a MEMS driving electronic device including second pad electrodes and second sealing parts respectively corresponding to the first pad electrodes and the first sealing parts to be sealed with and bonded to the MEMS device through the connectors to form an air gap having a predetermined width.

Abstract translation: 提供了微机电系统（MEMS）封装以及封装MEMS封装的方法。 MEMS封装包括：包括形成在衬底上的MEMS结构的MEMS器件，驱动MEMS结构的第一焊盘电极，形成在衬底边缘的第一密封部分和形成在第一焊盘电极和第一密封部分上的连接器; 以及MEMS驱动电子器件，其包括分别对应于第一焊盘电极和第一密封部分的第二焊盘电极和第二密封部分，以通过连接器密封并结合到MEMS器件，以形成具有预定宽度的气隙。

公开(公告)号：US20090320595A1

公开(公告)日：2009-12-31

申请号：US12111841

申请日：2008-04-29

Applicant: Myung Lae LEE ,  Chang Han JE ,  Sung Sik LEE ,  Sung Hae JUNG ,  Chang Auck CHOI ,  Gunn HWANG

Inventor： Myung Lae LEE ,  Chang Han JE ,  Sung Sik LEE ,  Sung Hae JUNG ,  Chang Auck CHOI ,  Gunn HWANG

IPC: G01P15/10

CPC classification number: G01H11/02

Abstract: There is provided a micromachined sensor for measuring a vibration, based on silicone micromachining technology, in which a conductor having elasticity is connected to masses moving due to a force generated by the vibration and the vibration is measured by using induced electromotive force generated due to the conductor moving in a magnetic field.

Abstract translation: 提供了一种用于测量振动的微机械传感器，其基于有机硅微加工技术，其中具有弹性的导体由于由振动产生的力连接到质量移动，并且通过使用由于振动产生的感应电动势来测量振动 导体在磁场中移动。

公开(公告)号：US07585113B2

公开(公告)日：2009-09-08

申请号：US11440863

申请日：2006-05-24

Applicant: Jae Woo Lee ,  Chang Han Je ,  Sung Weon Kang

Inventor： Jae Woo Lee ,  Chang Han Je ,  Sung Weon Kang

IPC: G02B6/00

CPC classification number: H01H59/0009 ,  B81B3/0013 ,  B81B3/0072 ,  B81B2201/016

Abstract: A MEMS switch and a method of manufacturing the same are disclosed. The MEMS switch includes: a substrate including a trench, a ground line and a signal line having an opened portion; a moving plate separated from the substrate at a predetermined space and including a contact member for connecting an electrode plate and the opened portion and having a deep corrugate to insert the trench; and a supporting member for supporting the moving plate. Such a MEMS switch prevents the thermal expansion and the stiction problem.

Abstract translation: 公开了一种MEMS开关及其制造方法。 MEMS开关包括：包括沟槽，接地线和具有开口部分的信号线的衬底; 移动板在预定的空间处与基板分离，并且包括用于连接电极板和开口部分并具有深波纹以便插入沟槽的接触部件; 以及用于支撑移动板的支撑构件。 这样的MEMS开关可防止热膨胀和静电问题。

公开(公告)号：US20130094675A1

公开(公告)日：2013-04-18

申请号：US13601896

申请日：2012-08-31

Applicant: Chang Han Je ,  Jaewoo Lee ,  Woo Seok Yang ,  Jongdae Kim

Inventor： Chang Han Je ,  Jaewoo Lee ,  Woo Seok Yang ,  Jongdae Kim

IPC: H04R1/00 ,  H04R31/00

CPC classification number: H04R1/00 ,  B81B3/007 ,  B81B2201/0257 ,  H04R1/2807 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  H04R31/006 ,  H04R2201/003

Abstract: Disclosed are a MEMS microphone and a method of manufacturing the same. The MEMS microphone includes: a substrate; a rear acoustic chamber formed inside a front surface of the substrate; a vibrating plate formed on the substrate and having an exhaust hole; a fixed electrode formed on the vibrating plate; and a fixed electrode support supported by a bottom of the rear acoustic chamber and connected to the fixed electrode through the exhaust hole.

Abstract translation: 公开了一种MEMS麦克风及其制造方法。 MEMS麦克风包括：基板; 形成在所述基板的前表面内的后声室; 形成在所述基板上并具有排气孔的振动板; 形成在振动板上的固定电极; 以及由后声室的底部支撑并通过排气孔连接到固定电极的固定电极支撑件。

公开(公告)号：US08319397B2

公开(公告)日：2012-11-27

申请号：US12862577

申请日：2010-08-24

Applicant: Sang Choon Ko ,  Chang Han Je ,  Ho Jun Ryu ,  Sung Sik Lee ,  Chi Hoon Jun

Inventor： Sang Choon Ko ,  Chang Han Je ,  Ho Jun Ryu ,  Sung Sik Lee ,  Chi Hoon Jun

IPC: H01L41/08

CPC classification number: H01L41/1138 ,  B60C23/0411 ,  H01L41/1136 ,  H02N2/186

Abstract: Provided is a small piezoelectric power generator applied to a wireless sensor network system of a tire pressure monitoring system (TPMS) for monitoring an internal environment of a tire such as variation in air pressure in the tire. In particular, when the system, in which air pressure, temperature and acceleration sensors are mounted, installed in the tire is operated in the TPMS for an automobile, a small piezoelectric power generator for the TPMS can be used as a power source in place of a conventional battery. The piezoelectric power generator includes a substrate having an electrode for transmitting power to the exterior, a metal plate formed on the substrate, and a piezoelectric body disposed on the metal plate and transmitting the power generated by a piezoelectric material to the electrode.

Abstract translation: 提供了一种应用于轮胎压力监测系统（TPMS）的无线传感器网络系统的小型压电发电机，用于监测轮胎的内部环境，例如轮胎中的空气压力的变化。 特别地，当安装在轮胎中的气压，温度和加速度传感器的系统在用于汽车的TPMS中运行时，用于TPMS的小压电发电机可以用作电源来代替 常规电池。 压电发电机包括具有用于向外部传输电力的电极的基板，形成在基板上的金属板，以及设置在金属板上并将由压电材料产生的电力传递到电极的压电体。

公开(公告)号：US07997137B2

公开(公告)日：2011-08-16

申请号：US12168025

申请日：2008-07-03

Applicant: Sung Sik Lee ,  Ji Man Park ,  Myung Lae Lee ,  Sung Hae Jung ,  Chang Han Je ,  Gunn Hwang ,  Chang Auck Choi

Inventor： Sung Sik Lee ,  Ji Man Park ,  Myung Lae Lee ,  Sung Hae Jung ,  Chang Han Je ,  Gunn Hwang ,  Chang Auck Choi

IPC: G01P15/08

CPC classification number: G01P15/125 ,  G01P13/04

Abstract: There is provided a bidirectional readout circuit for detecting direction and amplitude of an oscillation sensed at a capacitive microelectromechanical system (MEMS) accelerometer, the bidirectional readout circuit converting capacitance changes of the capacitive MEMS accelerometer into a time change amount by using high resolution capacitance-to-time conversion technology and outputting the time change amount as the direction and the amplitude of the oscillation by using time-to-digital conversion (TDC) technology, thereby detecting not only the amplitude of the oscillation but also the direction thereof, which is capable of being applied to various MEMS sensors.

Abstract translation: 提供了一种用于检测在电容式微机电系统（MEMS）加速度计处感测的振荡的方向和振幅的双向读出电路，双向读出电路通过使用高分辨率电容 - 电容将电容式MEMS加速度计的电容变化转换为时变量 时间转换技术，并且通过使用时间 - 数字转换（TDC）技术输出时间变化量作为振荡的方向和振幅，从而不仅检测振荡的振幅，而且检测其方向，这是能够 被应用于各种MEMS传感器。

公开(公告)号：US20110192040A1

公开(公告)日：2011-08-11

申请号：US12672997

申请日：2008-04-15

Applicant: Sung Sik Lee ,  Myung Lae Lee ,  Chang Han Je ,  Gunn Hwang ,  Chang Auck Choi

Inventor： Sung Sik Lee ,  Myung Lae Lee ,  Chang Han Je ,  Gunn Hwang ,  Chang Auck Choi

IPC: G01C9/06

CPC classification number: G01C9/00 ,  G01C9/06

Abstract: A three-dimensional inclination angle calculation circuit is provided. The three-dimensional inclination angle calculation circuit includes: X-axis, Y-axis, and Z-axis vibration sensors which change X-axis, Y-axis, and Z-axis electrostatic capacitances according to three-dimensional positions of a measured plane with respect to a reference plane, respectively; X-axis, Y-axis, and Z-axis position value acquisition units which acquire X-axis, Y-axis, and Z-axis position values corresponding to the X-axis, Y-axis, and Z-axis electrostatic capacitances, respectively; and an inclination angle calculation unit which calculates an inclination angle of the measured plane with respect to the reference plane based on the X-axis, Y-axis, and Z-axis position values. Accordingly, it is possible to very easily calculate an inclination angle according to a three-dimensional position of a to-be-measured apparatus by using an existing vibration sensor.

Abstract translation: 提供三维倾斜角计算电路。 三维倾斜角计算电路包括：根据测量平面的三维位置改变X轴，Y轴和Z轴静电电容的X轴，Y轴和Z轴振动传感器 分别相对于参考平面; 获取对应于X轴，Y轴和Z轴静电电容的X轴，Y轴和Z轴位置值的X轴，Y轴和Z轴位置值获取单元， 分别; 以及倾斜角计算单元，其基于X轴，Y轴和Z轴位置值计算测量平面相对于参考平面的倾斜角度。 因此，通过使用现有的振动传感器，可以非常容易地计算出被测量装置的三维位置的倾斜角度。