公开(公告)号：US20240365048A1

公开(公告)日：2024-10-31

申请号：US18766577

申请日：2024-07-08

Applicant: xMEMS Labs, Inc.

Inventor： Chao-Yu Chen ,  Wen-Chien Chen ,  Chiung C. Lo ,  Hai-Hung Wen

IPC: H04R1/28 ,  B81B7/00 ,  H04R1/02 ,  H04R19/02

CPC classification number: H04R1/2811 ,  B81B7/0061 ,  H04R1/023 ,  H04R1/025 ,  H04R19/02 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0307 ,  H04R2201/003

Abstract: A sound producing package includes a substrate, a covering structure and a sound producing component. The covering structure is disposed on the substrate, wherein the covering structure has a plurality of first openings. The sound producing component is disposed between the substrate and the covering structure, wherein the sound producing component includes a membrane and an actuator, and the sound producing component is configured to generate an acoustic wave.

公开(公告)号：US12133049B2

公开(公告)日：2024-10-29

申请号：US18371488

申请日：2023-09-22

Applicant: InvenSense, Inc.

Inventor： Roberto Brioschi ,  Kazunori Hayata ,  Jr-Cheng Yeh ,  Dinesh Kumar Solanki

IPC: H04R19/04 ,  B81B7/00 ,  B81C1/00 ,  H04R1/04 ,  H04R3/00

CPC classification number: H04R19/04 ,  B81B7/0064 ,  B81C1/00333 ,  H04R1/04 ,  H04R3/00 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0271 ,  B81B2201/0292 ,  B81B2203/0127 ,  B81B2207/015 ,  B81C2203/0109 ,  H04R2201/003

Abstract: A MEMS sensor includes a through hole to allow communication with an external environment, such as to send or receive acoustic signals or to be exposed to the ambient environment. In addition to the information that is being measured, light energy may also enter the environment of the sensor via the through hole, causing short-term or long-term effects on measurements or system components. A light mitigating structure is formed on or attached to a lid of the MEMS die to absorb or selectively reflect the received light in a manner that limits effects on the measurements or interest and system components.

公开(公告)号：US20240343557A1

公开(公告)日：2024-10-17

申请号：US18614036

申请日：2024-03-22

Applicant: Robert Bosch GmbH

Inventor： Jochen Reinmuth ,  Christoph Schelling ,  Thomas Buck

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/007 ,  B81C1/00158 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0163 ,  B81B2203/0315 ,  B81B2203/0361 ,  B81B2203/04 ,  B81C2201/0105 ,  B81C2201/056

Abstract: A micromechanical diaphragm system including a first diaphragm and a second diaphragm and spacer elements which are arranged between the first diaphragm and the second diaphragm. At least one spacer element has a first supporting element and a second supporting element. The first supporting element faces the first diaphragm. The second supporting element faces the second diaphragm. The first supporting element and the second supporting element are connected via a spring element.

公开(公告)号：US20240327202A1

公开(公告)日：2024-10-03

申请号：US18399722

申请日：2023-12-29

Applicant: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.

Inventor： Jinyang Li ,  Tao Fang ,  Rui Zhang

IPC: B81B7/00 ,  A24F40/40 ,  A24F40/51 ,  H05K7/14

CPC classification number: B81B7/0061 ,  A24F40/40 ,  A24F40/51 ,  H05K7/1427 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2207/012

Abstract: An electronic cigarette includes a cigarette body housing and a MEMS sensor located in the cigarette body housing. The MEMS sensor includes a shell with a receiving cavity, a MEMS Die with a back cavity received in the receiving cavity, an ASIC Die located in the receiving cavity and electrically connected to the MEMS Die, a first waterproof breathable membrane fixed to the shell and completely covering the first acoustic hole, and a second waterproof breathable membrane fixed to the shell and completely covering the second acoustic hole. The shell includes a first acoustic hole and a second acoustic hole penetrating the shell and communicating with the receiving cavity and an outside. Compared with the related art, the MEMS sensor disclosed by the present disclosure provides a MEMS Die with good performance.

公开(公告)号：US12071341B2

公开(公告)日：2024-08-27

申请号：US17642449

申请日：2020-09-01

Applicant: ams International AG

Inventor： Peter Heeb ,  Michelle Müller ,  Goran Stojanovic

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81C1/00158 ,  B81B3/0072 ,  B81B2201/0257 ,  B81B2201/047 ,  B81B2203/0127

Abstract: A microstructure for use in a micro electro-mechanical device comprises a substrate having a top surface and a rear surface and a thin-film structure arranged at the top surface of the substrate. The thin-film structure comprises a raised portion spaced from the substrate, a lower portion of the thin-film structure, which is in mechanical contact with the substrate, at least one protruding portion, the protruding portion being hollow and having at least one sidewall and a bottom part and the protruding portion mechanically connecting the raised portion to the substrate via the bottom part, and at least one further sidewall of the thin-film structure at a distance to the at least one protruding portion, wherein the further sidewall mechanically connects the lower portion with the raised portion of the thin-film structure.

公开(公告)号：US20240279049A1

公开(公告)日：2024-08-22

申请号：US18570858

申请日：2022-06-17

Applicant: HAHN-SCHICKARD-GESELLSCHAFT FÜR ANGEWANDTE FORSCHUNG E. V.

Inventor： Achim BITTNER ,  Alfons DEHÉ

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0051 ,  B81C1/00158 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81C2203/035

Abstract: In a first aspect, the invention relates to a system comprising a MEMS microphone comprising a sound inlet opening, a vibratable microphone membrane and an electronic circuit, wherein when the microphone membrane is excited by sound waves entering through the sound inlet opening, an electrical signal that is dependent on the sound waves is generated by vibrations of the microphone membrane. A damping element for reducing the sound pressure level of the sound waves acting on the microphone membrane is mounted in front of the sound inlet opening, wherein the damping element comprises an elastic and vibratable damping membrane and wherein, in addition to the microphone membrane, the damping element is induced into vibrations by the sound waves such that the sound energy of the sound waves is divided between the damping membrane and the microphone membrane. This makes it possible in particular to extend the measuring range of the MEMS microphone without distortion to high sound pressure levels that could not previously be measured with the MEMS microphones known in the prior art.
In a further aspect, the invention relates to the use of the system according to the invention for aeroacoustic measurements, preferably for measuring sound pressure waves on surfaces of a vehicle component.

公开(公告)号：US12069430B2

公开(公告)日：2024-08-20

申请号：US17412238

申请日：2021-08-25

Applicant: INVENSENSE, INC.

Inventor： Stefano Valle ,  Igor Mucha ,  Alessandro Magnani

IPC: H04R19/04 ,  B81B7/00 ,  H04R19/00

CPC classification number: H04R19/04 ,  B81B7/008 ,  H04R19/005 ,  B81B2201/0257 ,  H04R2201/003

Abstract: Disclosed embodiments provide flexible performance, high dynamic range, microelectromechanical (MEMS) multipath digital microphones, which allow seamless, low latency transitions between audio signal paths without audible artifacts over interruptions in the audio output signal. Disclosed embodiments facilitate performance and power saving mode transitions maintaining high dynamic range capability.

公开(公告)号：US20240270567A1

公开(公告)日：2024-08-15

申请号：US18632485

申请日：2024-04-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hiroshi MATSUBARA ,  Shinsuke IKEUCHI ,  Ryosuke NIWA ,  Takahiro ASADA

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00309 ,  B81B7/0061 ,  B81B2201/0257 ,  B81B2203/0353 ,  B81B2203/04 ,  B81B2207/096 ,  B81C2203/035

Abstract: An acoustic device includes a substrate including a first surface and a second surface facing a side opposite to the first surface, an opening, an acoustic MEMS element fixed to the first surface to cover the opening, an annular electrode surrounding the opening on the second surface, and a solder resist layer covering the second surface adjacently to the annular electrode on an outer side and an inner side of the annular electrode The solder resist layer includes a first cutaway portion to connect a first portion and a second portion to each other, the first portion being any portion in an edge of the annular electrode the second portion being any portion in an edge of the substrate.

公开(公告)号：US20240253978A1

公开(公告)日：2024-08-01

申请号：US18565918

申请日：2022-06-22

Applicant: KYOCERA Corporation

Inventor： Koutarou NAKAMOTO

IPC: B81C1/00 ,  B81B7/00 ,  H01L21/52 ,  H01L21/56

CPC classification number: B81C1/00269 ,  H01L21/52 ,  H01L21/561 ,  B81B7/0061 ,  B81B2201/0257 ,  B81C2203/0109

Abstract: The present disclosure provides a wiring board assembly, a lid assembly, and a package set including the wiring board assembly and the lid assembly, which do not require singulation by cutting an electronic component after sealing. The wiring board assembly includes a frame body, a sheet closing the frame body, and a plurality of wiring boards adhered to one surface of the sheet.

公开(公告)号：US12043537B2

公开(公告)日：2024-07-23

申请号：US16990106

申请日：2020-08-11

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shih-Wei Lin ,  Chang-Ming Wu ,  Ting-Jung Chen

IPC: H04R31/00 ,  B81B1/00 ,  B81B3/00 ,  B81C1/00

CPC classification number: B81B3/001 ,  B81B1/004 ,  B81B3/0021 ,  B81C1/00158 ,  B81C1/00531 ,  B81C1/00571 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/053

Abstract: The present disclosure provides a method of manufacturing a MEMS device. In some embodiments, a first interlayer dielectric layer is formed over a substrate, and a diaphragm is formed over the first interlayer dielectric layer. Then, a second interlayer dielectric layer is formed over the diaphragm. A first etch is performed to form an opening through the second interlayer dielectric layer and the diaphragm and reaching into an upper portion of the first interlayer dielectric layer. A second etch is performed to the first interlayer dielectric layer and the second interlayer dielectric layer to form recesses above and below the diaphragm and to respectively expose a portion of a top surface and a portion of a bottom surface of the diaphragm. A sidewall stopper is formed along a sidewall of the diaphragm into the recesses of the first interlayer dielectric layer and the second interlayer dielectric layer.