Metal-jacketed lead manufacturing process using resist layers
    21.
    发明授权
    Metal-jacketed lead manufacturing process using resist layers 有权
    使用抗蚀剂层的金属外壳铅制造工艺

    公开(公告)号:US06248656B1

    公开(公告)日:2001-06-19

    申请号:US09374394

    申请日:1999-08-13

    CPC classification number: H01L21/4857 H01L21/486

    Abstract: Metal leads are formed on a copper conductive layer by applying a first resist and a main resist over the first resist, and forming aligned openings in these resist. A bottom layer of cover metal such as gold is plated onto the copper conductive layer in these openings, followed by a principal metal such as copper. The main resist is then removed so as to expose edges of the principal metal layer. A jacket of cover metal is plated onto the exposed edges and surfaces of the principal metal layer. During this stage, the first resist prevents deposition of the cover metal except on the leads. The jacket merges with the bottom layer of cover material, so as to form a continuous coating extending around the perimeters of the leads. The first resist is removed, and the conductive layer is etched away. The cover metal protects the principal metal during the etching stage.

    Abstract translation: 通过在第一抗蚀剂上施加第一抗蚀剂和主抗蚀剂,在铜导电层上形成金属引线,并在这些抗蚀剂中形成对准的开口。 覆盖金属如金的底层被镀在这些开口中的铜导电层上,随后是诸如铜的主要金属。 然后去除主抗蚀剂以暴露主金属层的边缘。 将覆盖金属的护套电镀在主金属层的暴露的边缘和表面上。 在这个阶段,第一个抗蚀剂防止除了引线之外的覆盖金属的沉积。 护套与覆盖材料的底层合并,以形成围绕引线周边延伸的连续涂层。 去除第一抗蚀剂,并且蚀刻掉导电层。 覆盖金属在蚀刻阶段保护主要金属。

    Particle Arrays and Methods of Making and Using
    25.
    发明申请
    Particle Arrays and Methods of Making and Using 审中-公开
    粒子阵列及其制作和使用方法

    公开(公告)号:US20110201523A1

    公开(公告)日:2011-08-18

    申请号:US13027336

    申请日:2011-02-15

    Abstract: The invention provides particle compositions having applications in nucleic acid analysis. Nucleic acid polymer particles of the invention allow polynucleotides to be attached throughout their volumes for higher loading capacities than those achievable solely with surface attachment. In one aspect, nucleic acid polymer particles of the invention comprise polyacrylamide particles with uniform size distributions having low coefficients of variations, which result in reduced particle-to-particle variation in analytical assays. Such particle compositions are used in various amplification reactions to make amplicon libraries from nucleic acid fragment libraries.

    Abstract translation: 本发明提供了在核酸分析中具有应用的颗粒组合物。 本发明的核酸聚合物颗粒允许多核苷酸在其整个体积中被连接,以便比仅通过表面附着可实现的更高的负载能力。 在一个方面,本发明的核酸聚合物颗粒包含具有低变异系数的具有均匀尺寸分布的聚丙烯酰胺颗粒,这导致分析测定中颗粒对颗粒的变化减少。 这种颗粒组合物用于各种扩增反应以制备来自核酸片段文库的扩增子文库。

    Methods of Using Porous Particles
    26.
    发明申请
    Methods of Using Porous Particles 审中-公开
    使用多孔颗粒的方法

    公开(公告)号:US20110201508A1

    公开(公告)日:2011-08-18

    申请号:US13029566

    申请日:2011-02-17

    Abstract: The invention provides particle compositions having applications in nucleic acid analysis. Nucleic acid polymer particles of the invention allow polynucleotides to be attached throughout their volumes for higher loading capacities than those achievable solely with surface attachment. In one aspect, nucleic acid polymer particles of the invention comprise polyacrylamide particles with uniform size distributions having low coefficients of variations, which result in reduced particle-to-particle variation in analytical assays. Such particle compositions are used in various amplification reactions to make amplicon libraries from nucleic acid fragment libraries.

    Abstract translation: 本发明提供了在核酸分析中具有应用的颗粒组合物。 本发明的核酸聚合物颗粒允许多核苷酸在其整个体积中被连接,以便比仅通过表面附着可实现的更高的负载能力。 在一个方面,本发明的核酸聚合物颗粒包含具有低变异系数的具有均匀尺寸分布的聚丙烯酰胺颗粒,这导致分析测定中粒子与粒子变化的减少。 这种颗粒组合物用于各种扩增反应以制备来自核酸片段文库的扩增子文库。

    Scaffolded Nucleic Acid Polymer Particles and Methods of Making and Using
    27.
    发明申请
    Scaffolded Nucleic Acid Polymer Particles and Methods of Making and Using 审中-公开
    脚手架核酸聚合物颗粒及其制备和使用方法

    公开(公告)号:US20110195252A1

    公开(公告)日:2011-08-11

    申请号:US13026707

    申请日:2011-02-14

    Abstract: The invention provides particle compositions having applications in nucleic acid analysis. Nucleic acid polymer particles of the invention allow polynucleotides to be attached throughout their volumes for higher loading capacities than those achievable solely with surface attachment. In one aspect, nucleic acid polymer particles of the invention comprise polyacrylamide particles with uniform size distributions having low coefficients of variations, which result in reduced particle-to-particle variation in analytical assays. Such particle compositions are used in various amplification reactions to make amplicon libraries from nucleic acid fragment libraries.

    Abstract translation: 本发明提供了在核酸分析中具有应用的颗粒组合物。 本发明的核酸聚合物颗粒允许多核苷酸在其整个体积中被连接,以便比仅通过表面附着可实现的更高的负载能力。 在一个方面,本发明的核酸聚合物颗粒包含具有低变异系数的具有均匀尺寸分布的聚丙烯酰胺颗粒,这导致分析测定中粒子与粒子变化的减少。 这种颗粒组合物用于各种扩增反应以制备来自核酸片段文库的扩增子文库。

    Polynucleotides encoding anticoagulant antibodies
    28.
    发明授权
    Polynucleotides encoding anticoagulant antibodies 失效
    编码抗凝血抗体的多核苷酸

    公开(公告)号:US07960532B2

    公开(公告)日:2011-06-14

    申请号:US12503893

    申请日:2009-07-16

    Abstract: This invention relates to novel antibodies that bind with greater affinity to the factor VIIa/tissue factor (FVIIa/TF) complex than to tissue factor (TF) alone, do not compete for binding to TF with FVII and FX, an inhibit FX activation. The antibodies bind at the site of injury and prevent the initiation of thrombosis. The antibodies can be used to treat a variety of thrombotic conditions including but not limited to deep vein thrombosis, disseminated intravascular coagulation, and acute coronary syndrome.

    Abstract translation: 本发明涉及与单独的组织因子(TF)相比,与因子VIIa /组织因子(FVIIa / TF)复合物具有更高亲和力结合的新型抗体,不竞争与FVII和FX的结合,抑制FX激活。 抗体在损伤部位结合并防止血栓形成的发生。 抗体可用于治疗各种血栓形成病症,包括但不限于深静脉血栓形成,弥散性血管内凝血和急性冠状动脉综合征。

    Layered metal structure for interconnect element
    30.
    发明授权
    Layered metal structure for interconnect element 有权
    用于互连元件的分层金属结构

    公开(公告)号:US07696439B2

    公开(公告)日:2010-04-13

    申请号:US11801336

    申请日:2007-05-09

    Applicant: David Light

    Inventor: David Light

    Abstract: A layered metal structure is provided in accordance with an aspect of the invention. The structure can be used, for example, to fabricate a conductive interconnect element for conductively interconnecting one or more microelectronic elements. The layered structure includes first and second metal layers each of which may include one or more of copper or aluminum, for example. An intervening layer, may include for example, chromium between the first and second metal layers, chromium being resistant to an etchant usable to pattern the first and second metal layers selectively to the intervening layer. An etchant such as cupric chloride, ferric chloride (FeCl3), a peroxysulfuric composition, or a persulfate composition may be used to pattern the first and second metal layers in such case.

    Abstract translation: 根据本发明的一个方面提供了层状金属结构。 该结构可以用于例如制造导电互连一个或多个微电子元件的导电互连元件。 层状结构包括例如可以包括铜或铝中的一种或多种的第一和第二金属层。 中间层可以包括例如在第一和第二金属层之间的铬,铬耐腐蚀剂可以选择性地将第一和第二金属层图案化成中间层。 在这种情况下,可以使用诸如氯化铜,氯化铁(FeCl 3),过氧化硫组合物或过硫酸盐组合物的蚀刻剂来图案化第一和第二金属层。

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