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公开(公告)号：US10306799B2
公开(公告)日：2019-05-28
申请号：US15773143
申请日：2015-11-16
Applicant: ExaScaler Inc.
Inventor： Motoaki Saito
Abstract: An electronic device, immersed in a coolant filled in a cooling apparatus, and directly cooled, is configured to be housed in housing parts of the cooling apparatus, and includes a metal board held with board retainers disposed in the housing part, and substrate groups attached to a first surface of the metal board and a second surface opposite the first surface. The substrate group includes first circuit boards, each including sockets for mounting processors and main memories on one surface of a substrate, and a component for interconnecting the processors, a second circuit board including a mother board component which includes a chipset for controlling the main memory, and a flow channel formed in a gap between a surface opposite the one surface of the first circuit boards, and one surface of the second circuit board, which faces the surface opposite the one surface of the first circuit boards.
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公开(公告)号：US20180376615A1
公开(公告)日：2018-12-27
申请号：US15773150
申请日：2015-11-16
Applicant: ExaScaler Inc.
Inventor： Motoaki SAITO
CPC classification number: H05K7/20236 , G06F1/20 , G06F2200/201 , H05K7/20781
Abstract: An electronic device is immersed in a coolant in a cooling apparatus, and directly cooled. The electronic device is configured to be housed in housing parts of the cooling apparatus, and includes a metal board held with a pair of board retainers disposed in the housing part, storage units attached to a first surface of the metal board and a second surface opposite the first surface, and a backplane including connectors for electrically connecting the respective storage units, attached orthogonally to the first surface of the metal board, and the second surface opposite the first surface. The metal board includes a primary member including cuts in a width direction for fixing support plates that support the storage units to the primary member, and a secondary member includes pawls inserted into slits in the backplane, and fixed to the primary member. The support plates include holes for passage of the coolant.
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公开(公告)号：US10123453B2
公开(公告)日：2018-11-06
申请号：US15533348
申请日：2014-12-05
Applicant: EXASCALER INC.
Inventor： Motoaki Saito
Abstract: Provided is a cooling system capable of improving the cooling performances of a plurality of electronic apparatuses, of making stabilization by eliminating the variance in the cooling performances and of being improved in the handling and maintainability of the electronic apparatuses. A plurality of inner partitioning walls are provided in a cooling tank having an open space defined by a bottom wall and side walls to divide the open space, and a plurality of arrayed storage sections are defined. An electronic apparatus is stored in each of the storage sections. Each of the storage sections is formed with an inflow opening and an outflow opening for the cooling liquid. The inflow opening is formed at a bottom portion or a side surface of each storage section, and the outflow opening is formed in the vicinity of the liquid level of the cooling liquid flowing through each storage section.
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公开(公告)号：US20180070477A1
公开(公告)日：2018-03-08
申请号：US15563461
申请日：2015-03-30
Applicant: ExaScaler Inc.
Inventor： Motoaki SAITO
CPC classification number: H05K7/20818 , F28D15/02 , G06F1/20 , G06F2200/201 , H01L23/473 , H05K7/20
Abstract: Provided is a cooling system improved in cooling performance of an electronic device and being simple and efficient. The cooling system 10 has a cooling tank 12, and the cooling tank 12 contains in its open space a first cooling liquid 13 having a boiling point T1. An electronic device 100 mounting processors 110, 112 on a board 120 is stored within the open space of the cooling tank 12 and is immersed in the first cooling liquid 13. A first heat exchanger 22 is immersed in a surface layer portion of the first cooling liquid in the cooling tank 12. The first heat exchanger 22 encloses therein a second refrigerant having a boiling point T2 (provided T1=T2 or T1>T2).
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公开(公告)号：US20170332514A1
公开(公告)日：2017-11-16
申请号：US15526477
申请日：2014-11-14
Applicant: ExaScaler Inc.
Inventor： Motoaki SAITO
IPC: H05K7/20 , F28D15/02 , H01L23/427 , G06F1/20 , F25D9/00
CPC classification number: H05K7/20236 , F25D9/00 , F28D1/0213 , F28D15/02 , F28D15/0275 , F28D21/0017 , G06F1/20 , G06F2200/201 , H01L23/427 , H01L23/44 , H01L2924/0002 , H05K7/20254 , H05K7/20281 , H05K7/20772 , H01L2924/00
Abstract: There are provided a cooling system and a cooling method that are simple and efficient and improve cooling performances for an electronic device. A cooling system (10) includes a cooling bath (12). In the open space of the cooling bath (12), a second coolant (13) with a boiling point (T2) is contained. In the open space of the cooling bath (12), an electronic device (100) is housed. The electronic device (100) is mounted with a processor (110) as a heat generating component on a board (120). The electronic device (100) is immersed in the second coolant 13. A boiling cooling device (200) is a cooling device thermally connected to the processor (110), and encloses a first coolant 11 with a boiling point (T1) (where T2>T1).
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Patent Agency Ranking
26.发明授权公开(公告)号：US11023021B2
公开(公告)日：2021-06-01
申请号：US16097168
申请日：2016-04-28
Applicant: ExaScaler Inc.
Inventor： Motoaki Saito , Sunao Torii
Abstract: Provided is a cooling system capable of effectively avoiding generation of bubbles in the flow passage including the piping unit that climbs over the barrier upon start of the pump that has been in the stopped state. The cooling system 100 includes a cooling tank 11 filled with a coolant C, flow passages 15, 16 through which the coolant discharged from an outlet of the cooling tank 11 returns to an inlet of the cooling tank 11, an inverted U-like piping unit 16a disposed in the middle of the flow passage 16, a main pump 31, an auxiliary pump 33 disposed opposite the main pump 31 while interposing the inverted U-like piping unit 16a with the main pump 31, and a controller 35 which controls driving operations of the main pump 31 and the auxiliary pump 33. The controller 35 drives the auxiliary pump 33 for a predetermined time period before starting the main pump 31. The predetermined time period for driving the auxiliary pump 33 may be arbitrarily set so long as the preliminary flow of the coolant C is generated. As the auxiliary pump 33 may be driven for only a short time period, silence in the room is hardly deteriorated even in the case that the pump is disposed inside the building.
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公开(公告)号：US11013143B2
公开(公告)日：2021-05-18
申请号：US16347782
申请日：2016-11-12
Applicant: ExaScaler Inc.
Inventor： Motoaki Saito
Abstract: Provided is a power supply unit which is immersed and directly cooled in a coolant filled in a cooling apparatus. The power supply unit includes a unit substrate, and a voltage step-down device mounted on the unit substrate. The unit substrate includes a voltage input terminal for supplying an external power supply voltage, and a voltage output terminal. The voltage output terminal is electrically connected to a voltage input terminal of an electronic device. The power supply unit is mounted on a bottom of a cooling tank of the cooling apparatus so that the electronic device is positioned at an upper part of the power supply unit upon electrical connection between the electronic device and the power supply unit, and cooled by the coolant flowing from the bottom, or flowing from another section of the cooling tank. The unit substrate may be disposed apart from the bottom so as to form a flow channel which allows passage of the coolant between one surface of the unit substrate and the bottom. The voltage step-down device may be configured to include a converter module which steps down the external high voltage DC voltage from 200V to 420V to the DC voltage from 24V to 52V.
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公开(公告)号：US20200370845A1
公开(公告)日：2020-11-26
申请号：US16987784
申请日：2020-08-07
Applicant: ExaScaler Inc.
Inventor： Motoaki SAITO
Abstract: A cooling system 100 for directly cooling an electronic device immersed in a coolant includes a cooling tank 11 containing the coolant C, a leakage receiving portion 21 disposed between the cooling tank 11 and a floor surface so as to receive the coolant L leaked from the cooling tank 11, an additional leakage receiving portion 22 disposed to receive the coolant L overflown from the leakage receiving portion 21 which stores the leaked coolant by a volume in excess of a predetermined volume, and a passage 25 that connects the leakage receiving portions 21 and 23 for passing the overflown coolant L by the volume in excess of the predetermined volume. The system facilitates collection of the accidentally leaked coolant, and ensures to keep the low height of the device for temporarily accumulating the leaked coolant L until it is collected.
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公开(公告)号：US10809775B2
公开(公告)日：2020-10-20
申请号：US16347759
申请日：2016-11-12
Applicant: ExaScaler Inc.
Inventor： Motoaki Saito
Abstract: Provided are an electronic device and a power supply unit, both of which are immersed and directly cooled in a coolant filled in a cooling apparatus. The electronic device includes a carrier substrate having a voltage input terminal for supplying a DC voltage for the electronic device, a plurality of module connectors arranged on one surface of the carrier substrate, a plurality of module substrates, a plurality of supporting plates for holding both ends of the respective module substrates, and a supporting member for supporting the carrier substrate. The voltage input terminal is electrically connected to a voltage output terminal of the power supply unit. Each of the module substrates includes a module connector plug electrically coupled to each of the module connectors. The supporting member supports the carrier substrate so as to be positioned at the upper part of the power supply unit mounted on the bottom of the cooling tank of the cooling apparatus upon electrical connection between the electronic device and the power supply unit. The power supply unit includes a unit substrate, a voltage step-down device mounted on the unit substrate, and a stage to which the unit substrate is fixed.
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公开(公告)号：US20190294221A1
公开(公告)日：2019-09-26
申请号：US16302596
申请日：2016-05-16
Applicant: ExaScaler Inc.
Inventor： Motoaki SAITO
Abstract: An electronic device, immersed in a coolant filled in a cooling apparatus, and directly cooled, is configured to be housed in a housing part of the cooling apparatus, and includes a pair of substrate groups that includes a first circuit board having at least one processor and main memories mounted onto one surface of the board, coprocessors, each having a housing with a rectangular cross-section, and an electric connection terminal, and a connector for electric connection between the first circuit board and the coprocessors. When each of the electric connection terminals of the coprocessors is inserted into the connector, a distance between the one surface of the first circuit board and a housing bottom surface of each of the coprocessors is longer than a height of the processor and each height of the main memories. The pair of substrate groups is combined while having the first circuit boards arranged at a rear surface side in a direction for reducing a distance between the one surface of the first circuit board of one of the substrate groups and a housing upper surface of each of the coprocessors of the other of the substrate groups.
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