公开(公告)号：US20050255408A1

公开(公告)日：2005-11-17

申请号：US10831870

申请日：2004-04-26

Applicant: Gary Grube ,  Gaetan Mathieu ,  Benjamin Eldridge ,  Chadwick Sofield

Inventor： Gary Grube ,  Gaetan Mathieu ,  Benjamin Eldridge ,  Chadwick Sofield

IPC: B32B9/00 ,  B32B15/04

CPC classification number: G01R3/00 ,  G01R1/06716 ,  G01R1/06744 ,  H01L24/80 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T156/10 ,  Y10T428/12347 ,  Y10T428/12375 ,  Y10T428/12535 ,  Y10T428/12542 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/31681 ,  H01L2924/00

Abstract: A robust mechanical structure is provided to prevent small foundation structures formed on a substrate from detaching from the substrate surface. The strengthened structure is formed by plating a foundation metal layer on a seed layer and then embedding the plated foundation structure in an adhesive polymer material, such as epoxy. Components, such as spring probes, can then be constructed on the plated foundation. The adhesive polymer material better assures the adhesion of the metal foundation structure to the substrate surface by counteracting forces applied to an element, such as a spring probe, attached to the plated foundation.

Abstract translation: 提供坚固的机械结构以防止形成在基板上的小基础结构从基板表面分离。 强化结构通过在种子层上电镀基础金属层，然后将镀覆的基础结构嵌入诸如环氧树脂的粘合剂聚合物材料中而形成。 然后可以在镀覆的基础上构造诸如弹簧探针的组件。 粘合剂聚合物材料通过抵抗附着在镀覆基底上的诸如弹簧探针的元件的抵抗力，更好地保证金属基础结构与基底表面的粘附。

公开(公告)号：US20050108876A1

公开(公告)日：2005-05-26

申请号：US10723269

申请日：2003-11-26

Applicant: Gaetan Mathieu ,  Igor Khandros ,  Carl Reynolds

Inventor： Gaetan Mathieu ,  Igor Khandros ,  Carl Reynolds

IPC: G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  H05K3/30 ,  H05K3/42 ,  H05K3/00 ,  H05K13/00

CPC classification number: H05K3/42 ,  G01R1/06711 ,  G01R1/07307 ,  G01R3/00 ,  H05K3/308 ,  H05K2201/09836 ,  H05K2203/0338 ,  Y10T29/49117 ,  Y10T29/49139 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49156 ,  Y10T29/49162 ,  Y10T29/49165 ,  Y10T29/49169 ,  Y10T29/49194

Abstract: Methods are provided for making plated through holes usable for inserting and attaching connector probes. In a first method, a curved plated through hole is formed by bonding curved etchable wires to a first substrate, plating the wires with a non-etchable conductive material, encasing the plated wires with a dielectric material to form a second substrate, planing the second substrate to expose the etchable wire, and etching the wires to leave plated through holes. In a second method, wires coated with a first etchable layer are initially bonded to a substrate, a second non-etchable plating layer is then applied over the first layer, and the first layer is etched away leaving plated through holes with wires disposed inside. In a third embodiment, a layer of masking material is initially deposited on a substrate and etched to form holes which are filled with a sacrificial fill material, the masking material is then removed, the fill material plated, grinding is performed to remove some plating to expose the fill material, and the fill material is then etched away leaving plated attachment wells. Probes may be attached to the plated through holes or attachment wells to create resilient spring contacts to form a wafer probe card assembly. A twisted tube plated through hole structure is formed by supporting twisted sacrificial wires coated with the plating material in a substrate, and later etching away the wires.

Abstract translation: 提供了用于制造用于插入和连接连接器探针的电镀通孔的方法。 在第一种方法中，通过将弯曲的可蚀刻线接合到第一衬底上形成弯曲的电镀通孔，用不可蚀刻的导电材料镀覆电线，用电介质材料包住电镀线以形成第二衬底， 衬底以暴露可蚀刻线，并蚀刻电线以留下镀通孔。 在第二种方法中，首先将涂覆有第一可蚀刻层的线接合到衬底上，然后将第二不可蚀刻镀层施加在第一层上，并且第一层被蚀刻掉，从而通过设置在内部的布线的孔通过电镀。 在第三实施例中，掩模材料层最初沉积在衬底上并被蚀刻以形成填充有牺牲填充材料的孔，然后去除掩模材料，电镀填充材料，进行研磨以除去一些电镀 露出填充材料，然后将填充材料蚀刻掉，留下电镀的连接孔。 探针可以附着到电镀通孔或连接孔，以产生弹性弹簧触点，以形成晶片探针卡组件。 通过将涂覆有电镀材料的扭转牺牲线支撑在基板中，并且随后蚀刻掉线来形成扭曲管镀通孔结构。

公开(公告)号：US06713374B2

公开(公告)日：2004-03-30

申请号：US09752640

申请日：2000-12-29

Applicant: Benjamin N. Eldridge ,  Gaetan Mathieu

Inventor： Benjamin N. Eldridge ,  Gaetan Mathieu

IPC: H01L2144

CPC classification number: H01L23/4822 ,  H01L24/01 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

Abstract: An interconnect assembly and methods for making and using the assembly. An exemplary embodiment of an aspect of the invention includes a contact element which includes a base portion adapted to be adhered to a substrate and a beam portion connected to and extending from the base portion. The beam portion is designed to have a geometry which substantially optimizes stress across the beam portion when deflected (e.g. it is triangular in shape) and is adapted to be freestanding. An exemplary embodiment of another aspect of the invention involves a method for forming a contact element. This method includes forming a base portion to adhere to a substrate of an electrical assembly and forming a beam portion connected to the base portion. The beam portion extends from the base portion and is designed to have a geometry which substantially evenly distributes stress across the beam portion when deflected and is adapted to be freestanding. It will be appreciated that in certain embodiments of the invention, a plurality of contact elements are used together to create an interconnect assembly. Various other assemblies and methods are also described below in conjunction with the following figures.

Abstract translation: 互连组件和用于制造和使用组件的方法。 本发明的一个方面的示例性实施例包括接触元件，其包括适于粘附到基底的基部和连接到基部并从基部延伸的梁部。 梁部分被设计成具有几何形状，当偏转（例如，其形状为三角形）时，几何形状基本上优化横梁部分上的应力，并且适于独立。 本发明的另一方面的示例性实施例涉及形成接触元件的方法。 该方法包括形成基部以粘附到电气组件的基板并形成连接到基部的梁部分。 梁部分从基部延伸并且被设计成具有几何形状，当几何形状偏转时基本上均匀地分布横梁部分的应力，并适于独立。 应当理解，在本发明的某些实施例中，多个接触元件一起用于产生互连组件。 下面结合以下附图描述各种其它组件和方法。

公开(公告)号：US5525545A

公开(公告)日：1996-06-11

申请号：US306208

申请日：1994-11-03

Applicant: Gary Grube ,  Igor Khandros ,  Gaetan Mathieu

Inventor： Gary Grube ,  Igor Khandros ,  Gaetan Mathieu

IPC: H01L23/48 ,  H01L21/60

CPC classification number: H01L24/72 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/351 ,  Y10T29/49004 ,  Y10T29/4913

Abstract: A semiconduct chip assembly includes a chip, terminals permanently electrically connected to the chip by flexible leads and a resilient element or elements for biasing the terminals away from the chip. The chip is permanently engaged with a substrate having contact pads so that the terminals are disposed between the chip and the substrate and the terminals engage the contact pads under the influence of the force applied by the resilient element. The terminals typically are provided on a flexible sheet-like dielectric interposer and the resilient element is disposed between the interposer and the chip. The assembly of the chip and the terminals can be tested prior to engagement with the substrate. Because engagement of this assembly with the substrate does not involve soldering or other complex bonding processes, it is reliable. The assembly can be extremely compact and may occupy an area only slightly larger than the area of the chip itself.

公开(公告)号：US20090035959A1

公开(公告)日：2009-02-05

申请号：US12251217

申请日：2008-10-14

Applicant: Benjamin N. Eldridge ,  Gaetan Mathieu

Inventor： Benjamin N. Eldridge ,  Gaetan Mathieu

IPC: H01R12/00

CPC classification number: G01R1/06727 ,  G01R1/07342 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/72 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/02335 ,  H01L2224/0235 ,  H01L2224/0239 ,  H01L2224/0345 ,  H01L2224/03472 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/0502 ,  H01L2224/05027 ,  H01L2224/05552 ,  H01L2224/05563 ,  H01L2224/056 ,  H01L2224/10122 ,  H01L2224/1145 ,  H01L2224/11452 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/11472 ,  H01L2224/13012 ,  H01L2224/13016 ,  H01L2224/13023 ,  H01L2224/13026 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13173 ,  H01L2224/1379 ,  H01L2224/138 ,  H01L2224/1412 ,  H01L2224/1413 ,  H01L2224/16057 ,  H01L2224/81007 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2224/819 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01R13/03 ,  H01L2924/01027 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Interconnect assemblies having resilient contact elements and methods for making these assemblies. In one aspect, the interconnect assembly includes a substrate and a resilient electrical contact element disposed on the substrate. A first portion of the resilient contact structure is disposed on the substrate and a second portion extends away from the substrate and is capable of moving from a first position to a second position under the application of a force. A stop structure is disposed on the surface of the substrate and on a surface of the first portion of the resilient contact structure. According to another aspect of the present invention, a beam portion of the resilient contact structure has a substantially triangular shape.

Abstract translation: 具有弹性接触元件的互连组件和用于制造这些组件的方法。 在一个方面，互连组件包括衬底和设置在衬底上的弹性电接触元件。 弹性接触结构的第一部分设置在基底上，第二部分远离基底延伸并且能够在施加力的情况下从第一位置移动到第二位置。 止动结构设置在基板的表面上和弹性接触结构的第一部分的表面上。 根据本发明的另一方面，弹性接触结构的梁部分具有基本上三角形的形状。

公开(公告)号：US07435108B1

公开(公告)日：2008-10-14

申请号：US09364788

申请日：1999-07-30

Applicant: Benjamin N. Eldridge ,  Gaetan Mathieu

Inventor： Benjamin N. Eldridge ,  Gaetan Mathieu

IPC: H05K1/00

CPC classification number: G01R1/06727 ,  G01R1/07342 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/72 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/02335 ,  H01L2224/0235 ,  H01L2224/0239 ,  H01L2224/0345 ,  H01L2224/03472 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/0502 ,  H01L2224/05027 ,  H01L2224/05552 ,  H01L2224/05563 ,  H01L2224/056 ,  H01L2224/10122 ,  H01L2224/1145 ,  H01L2224/11452 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/11472 ,  H01L2224/13012 ,  H01L2224/13016 ,  H01L2224/13023 ,  H01L2224/13026 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13173 ,  H01L2224/1379 ,  H01L2224/138 ,  H01L2224/1412 ,  H01L2224/1413 ,  H01L2224/16057 ,  H01L2224/81007 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2224/819 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01R13/03 ,  H01L2924/01027 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Interconnect assemblies having resilient contact elements and methods for making these assemblies. In one aspect, the interconnect assembly includes a substrate and a resilient electrical contact element disposed on the substrate. A first portion of the resilient contact structure is disposed on the substrate and a second portion extends away from the substrate and is capable of moving from a first position to a second position under the application of a force. A stop structure is disposed on the surface of the substrate and on a surface of the first portion of the resilient contact structure. According to another aspect of the present invention, a beam portion of the resilient contact structure has a substantially triangular shape.

Abstract translation: 具有弹性接触元件的互连组件和用于制造这些组件的方法。 在一个方面，互连组件包括衬底和设置在衬底上的弹性电接触元件。 弹性接触结构的第一部分设置在基底上，第二部分远离基底延伸并且能够在施加力的情况下从第一位置移动到第二位置。 止动结构设置在基板的表面上和弹性接触结构的第一部分的表面上。 根据本发明的另一方面，弹性接触结构的梁部分具有基本上三角形的形状。

公开(公告)号：US20070270041A1

公开(公告)日：2007-11-22

申请号：US11228966

申请日：2005-09-16

Applicant: Gary Grube ,  Gaetan Mathieu ,  Alec Madsen

Inventor： Gary Grube ,  Gaetan Mathieu ,  Alec Madsen

IPC: H01R24/00

CPC classification number: G01R1/06733 ,  G01R1/06716 ,  G01R1/0675 ,  G01R1/07314 ,  G01R3/00

Abstract: An elongate, columnar micro-mechanical structure disposed along a central longitudinal axis; the structure is made up of laminated structural layers, each comprised of a structural material. The layers define a substantially rigid base portion at a proximal end of the structure, a resilient intermediate portion extending from the base portion along the central axis, and a contact tip extending from the resilient portion at a distal end of the structure. The resilient portion of the contact structure is comprised of resilient arms defined in the layers. Opposite ends of the resilient arms may be angularly offset with respect to one another around the central axis. Accordingly, when the contact structure is compressed in an axial direction, the contact tip will rotate around the central axis, while the base remains fixed, providing beneficial wiping action to the contact tip.

Abstract translation: 沿着中心纵向轴线设置的细长柱状微机械结构; 该结构由层压结构层组成，每层由结构材料构成。 这些层在结构的近端处限定基本上刚性的基部，从基部延伸的弹性中间部分沿着中心轴线，以及在结构的远端处从弹性部分延伸的接触尖端。 接触结构的弹性部分由限定在层中的弹性臂组成。 弹性臂的相对端部可以相对于中心轴线彼此成角度地偏移。 因此，当接触结构沿轴向压缩时，接触尖端将围绕中心轴线旋转，同时基座保持固定，为接触尖端提供有益的擦拭作用。

公开(公告)号：US20070247176A1

公开(公告)日：2007-10-25

申请号：US11692035

申请日：2007-03-27

Applicant: Gary Grube ,  Igor Khandros ,  Benjamin Eldridge ,  Gaetan Mathieu ,  Poya Lotfizadeh ,  Chih-Chiang Tseng

Inventor： Gary Grube ,  Igor Khandros ,  Benjamin Eldridge ,  Gaetan Mathieu ,  Poya Lotfizadeh ,  Chih-Chiang Tseng

IPC: G01R31/26 ,  G01R31/04

CPC classification number: G01R31/2886 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07378 ,  G01R3/00 ,  Y10T29/49126

Abstract: A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.

Abstract translation: 一种设计和制造探针卡组件的方法包括将探针卡组件的一个或多个元件预制成一个或多个预定的设计。 此后，接收关于新设计的半导体器件的设计数据以及描述用于测试半导体器件的测试器和测试算法的数据。 使用接收到的数据，选择一个或多个预制元素。 再次使用接收的数据，定制一个或多个所选择的预制元素。 然后使用选定和定制的元件构建探针卡组件。

公开(公告)号：US20060237856A1

公开(公告)日：2006-10-26

申请号：US11456568

申请日：2006-07-11

Applicant: Benjamin Eldridge ,  Gary Grube ,  Igor Khandros ,  Gaetan Mathieu

Inventor： Benjamin Eldridge ,  Gary Grube ,  Igor Khandros ,  Gaetan Mathieu

IPC: H01L23/52

CPC classification number: G01R3/00 ,  B23K2101/38 ,  G01R1/06727 ,  G01R1/06744 ,  H01L21/6835 ,  H01L23/4951 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/57 ,  H05K3/4092 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204 ,  H01L2924/00

Abstract: Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined on a sacrificial substrate. The openings may be within the surface of the substrate, or in one or more layers deposited on the surface of the sacrificial substrate. Each spring contact element has a base end portion, a contact end portion, and a central body portion. The contact end portion is offset in the z-axis (at a different height) than the central body portion. The base end portion is preferably offset in an opposite direction along the z-axis from the central body portion. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the sacrificial substrate. The spring contact elements are suitably mounted by their base end portions to corresponding terminals on an electronic component, such as a space transformer or a semiconductor device, whereupon the sacrificial substrate is removed so that the contact ends of the spring contact elements extend above the surface of the electronic component. In an exemplary use, the spring contact elements are thereby disposed on a space transformer component of a probe card assembly so that their contact ends effect pressure connections to corresponding terminals on another electronic component, for the purpose of probing the electronic component.

Abstract translation: 通过将至少一层金属材料沉积到限定在牺牲衬底上的开口中来制造弹簧接触元件。 开口可以在衬底的表面内，或者在沉积在牺牲衬底的表面上的一个或多个层中。 每个弹簧接触元件具有基端部分，接触端部分和中心体部分。 接触端部在与中心体部分相同的z轴（不同高度）偏移。 基端部优选地沿着与中心主体部分的z轴相反的方向偏移。 以这种方式，在牺牲基板上以规定的空间关系制造多个弹簧接触元件。 弹簧接触元件通过它们的基端部适当地安装在诸如空间变压器或半导体器件的电子部件上的对应端子上，从而去除牺牲基板，使得弹簧接触元件的接触端部在表面上方延伸 的电子元件。 在示例性用途中，弹簧接触元件因此被布置在探针卡组件的空间变换器部件上，使得它们的接触端在另一电子部件上实现与相应端子的压力连接，以便探测电子部件。

公开(公告)号：US20060211278A1

公开(公告)日：2006-09-21

申请号：US11440145

申请日：2006-05-23

Applicant: Gaetan Mathieu ,  Benjamin Eldridge

Inventor： Gaetan Mathieu ,  Benjamin Eldridge

IPC: H01R12/00

CPC classification number: G01R3/00 ,  G01R1/06727 ,  G01R1/06761 ,  H01L21/4853 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/71 ,  H01L24/72 ,  H01L2224/05001 ,  H01L2224/05568 ,  H01L2224/11002 ,  H01L2224/11003 ,  H01L2224/13099 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01061 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/3011 ,  H01R12/57 ,  H01R12/718 ,  H01R13/03 ,  H01R13/24 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0311 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49204 ,  Y10T29/49222 ,  Y10T29/49224 ,  H01L2924/00

Abstract: An interconnection element and a method of forming an interconnection element. In one embodiment, the interconnection element includes a first structure and a second structure coupled to the first structure. The second structure coupled with the first material has a spring constant greater than the spring constant of the first structure alone. In one embodiment, the interconnection element is adapted to be coupled to an electronic component tracked as a conductive path from the electronic component. In one embodiment, the method includes forming a first (interconnection) structure coupled to a substrate to define a shape suitable as an interconnection in an integrated circuit environment and then coupling, such as by coating, a second (interconnection) structure to the first (interconnection) structure to form an interconnection element. Collectively, the first (interconnection) structure and the second (interconnection) structure have a spring constant greater than a spring constant of the first (interconnection) structure.