Abstract:
An actuator including at least one moving body, at least one fixed body and a connecting member is provided. The moving body is suitable for moving along a direction, and includes at least one coil. In addition, the fixed body includes a permanent magnet and a yoke, wherein the coil is disposed between the permanent magnet and the yoke, and the polarity direction of the permanent magnet is parallel to the moving direction of the moving body. Furthermore, the connecting member is used for connecting the moving body and the fixed body. The actuator meets the requirements of miniaturization, low power consumption and low cost.
Abstract:
An optical device. A drive moving assembly includes a lens module and a drive coil. The drive coil surrounds the lens module and provides a central axis parallel to an optical axis of the lens module. A drive stator includes a housing, a magnetic member, and a yoke. The lens module is movably disposed in the housing. The magnetic member surrounds the drive coil and includes an opening. The yoke interacts with the magnetic member, generating a magnetic field. The magnetic member, yoke, and drive coil interact to move the drive moving assembly parallel to the optical axis. A brake coil is disposed in the opening. A braking resilient member is connected between the drive stator and the brake coil and disposed in the opening. The brake coil interacts with the magnetic member, yoke, and braking resilient member and detachably abuts the drive moving assembly.
Abstract:
The present invention discloses a modification of portable computer. The bottom of the lower seat of a notebook computer is provided with supporting pieces which can retrieve within and protrude over the bottom and which can render the aforementioned bottom to maintain a slanting angle and a gap with respect to the residing surface.
Abstract:
An optical recording/playback apparatus and a method for adjusting playback parameters of the optical recording/playback apparatus are disclosed. The method includes loading an optical disc, determining whether there is data recorded on a data zone of the optical disc, recording test data on an optimal power control (OPC) zone on a playback parameter adjustment area of the optical disc at a reference power when there is no data recorded in the data zone, and adjusting a playback parameter while reading the playback parameter adjustment area, and recording data in the data zone after the adjustment.
Abstract:
An apparatus for controlling an erasing power level, which is capable of optimally setting a power level applied to a disc when erasing a test period in an OPC (Optimum Power Control) area of the disc, and a method using the apparatus. The apparatus includes: a pickup unit irradiating light corresponding to the erasing power level to a test period and receiving reflected light; an RF processing unit outputting an indication signal indicating a writing state of the test period according to an output of the pickup unit; and a control unit temporarily setting a plurality of erasing power levels, erasing the test period by applying the plurality of erasing power levels, and then setting any one of the plurality of erasing power levels to an optimum erasing power level on the basis of the indication signal.
Abstract:
An optical disc apparatus is provided with optimum power control (OPC) to determine an optimum laser power needed for recording data on an optical disc. Such an apparatus comprises a controller to determine optimum writing power in such a way of re-establishing a new test zone when an erasing error is detected on an initially established test zone in order to perform the OPC. When the erasing error is detected on a test zone of an OPC zone, a new test zone is re-established, so that OPC is performed rapidly while reducing an error frequency occurring when optimum writing power is not determined.
Abstract:
Disclosed herein is a method of bonding solder pads of a flip-chip package. This invention relates to a method of bonding solder pads having different sizes to each other, when a bonding operation is executed between a chip and a PCB, between chips, or between PCBs. On a side having a larger solder pad, a general solder ball is used. Conversely, on a side having a smaller solder pad, a solder ball having a core is used. The core serves to maintain a predetermined interval between the chip and the PCB or between the chips, after the bonding operation has been completed. The solder bonded parts are aligned with each other so as to perform a final bonding operation. In a conventional flip-chip package, solder pads provided on a bonded part must have the same or similar size. According to this invention, even if the size difference between the solder pads is large, bonding is possible, thus ensuring electrical and mechanical reliability.
Abstract:
A method and system for providing virtual access to product/service information distributed across heterogeneous catalog systems is disclosed. The method and system include subscribing a first catalog server to at least a portion of the information stored on one or more remote catalog systems, thereby creating a subscribing catalog server. Thereafter, a replication process is performed to synchronize information on the subscribing catalog server with the subscribed information on the remote catalog systems. A user may then use the subscribing catalog server to search and browse the synchronized information, thereby providing one site for viewing information from multiple catalog servers.
Abstract:
Disclosed is a fabrication method of UBM for flip chip interconnections of a semiconductor device, consisting of dipping a patterned wafer into a plating solution containing materials supplying nickel and copper ions, forming a copper layer at a predetermined current density for connection between a chip pad and a solder bump and for residual stress-buffering, and forming a nickel-copper alloy layer at an increased current density for prevention of diffusion between the solder and the pad. The method is advantageous in terms of low fabrication cost due to not requiring an etching process, while meeting the conditions of wettability, diffusion-barrier function and small residual stress required to form UBM on the patterned wafer.
Abstract:
The present invention relates to a film-type micro-supercapacitor and a manufacturing method thereof including a method for manufacturing an electrode film by using graphene or graphene oxide, a method for forming a two-dimensional electrode by separating a graphene or graphene oxide electrode film into two independent electrodes through patterning, a method for forming an in-plane structure of the two-dimensional electrode, a method for forming a current collector on an electrode, and a method for manufacturing a supercapacitor with a micrometer thickness by supplying an electrolyte to the two-dimensional electrode.