公开(公告)号：US08820950B2

公开(公告)日：2014-09-02

申请号：US13045787

申请日：2011-03-11

Applicant: Shuhei Matsuda ,  Soichi Shibusawa ,  Nobuhiko Betsuda ,  Kiyoshi Nishimura

Inventor： Shuhei Matsuda ,  Soichi Shibusawa ,  Nobuhiko Betsuda ,  Kiyoshi Nishimura

IPC: F21V9/16

CPC classification number: H05B33/0872 ,  F21K9/00 ,  F21K9/232 ,  F21S8/026 ,  F21Y2105/10 ,  F21Y2105/12 ,  F21Y2113/13 ,  F21Y2115/10 ,  G09G3/3413 ,  G09G2320/041 ,  G09G2320/06 ,  H01L25/0753 ,  H01L33/48 ,  H01L33/50 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H05B33/086 ,  H01L2924/00014 ,  H01L2924/00

Abstract: According to one embodiment, a light emitting device which is attached to an illumination apparatus and radiates light having a correlated color temperature of 2900 to 3600K is provided. The light emitting device includes a substrate, blue light emitting LED elements and red light emitting LED elements mounted on the substrate, and a wavelength converting unit. The red light emitting LED elements have a luminous intensity of 0.2 to 2.5 times as large as that of the blue light emitting LED elements at normal use temperature in a state where the light emitting device is attached to the illumination apparatus. The wavelength converting unit is excited by light emitted from the blue light emitting LED elements and converts the light to light having a peak wavelength within a range of 500 to 600 nm.

Abstract translation: 根据一个实施例，提供了附接到照明装置并发射相关色温为2900至3600K的光的发光装置。 发光装置包括基板，蓝色发光LED元件和安装在基板上的红色发光LED元件以及波长转换单元。 在发光装置安装在照明装置的状态下，红色发光LED元件的发光强度为正常使用温度下蓝色发光LED元件的发光强度的0.2〜2.5倍。 波长转换单元被从蓝色发光LED元件发射的光激发，并将该光转换成具有500-600nm范围内的峰值波长的光。

公开(公告)号：US08770795B2

公开(公告)日：2014-07-08

申请号：US13236672

申请日：2011-09-20

Applicant: Kozo Uemura ,  Soichi Shibusawa ,  Shuhei Matsuda ,  Nobuhiko Betsuda ,  Kiyoshi Nishimura ,  Masatoshi Kumagai

Inventor： Kozo Uemura ,  Soichi Shibusawa ,  Shuhei Matsuda ,  Nobuhiko Betsuda ,  Kiyoshi Nishimura ,  Masatoshi Kumagai

IPC: F21V21/00

CPC classification number: H01L25/0753 ,  F21K9/27 ,  F21S8/031 ,  F21V23/023 ,  F21Y2103/10 ,  F21Y2105/10 ,  F21Y2113/00 ,  F21Y2115/10 ,  H01L33/54 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light-emitting device includes a substrate, and a plurality of light-emitting elements mounted on the substrate. The light-emitting elements are placed to meet conditions that the number B of light-emitting elements per unit area (cm2) of a mounting part is not less than 0.4 and a mean mounting density D is not less than 58 to not greater than 334, when a relationship of formula “D=A×B” is established, assuming D as a mean mounting density of light-emitting elements on a substrate, A as a current (mA) flowing through one light-emitting element, and B as the number of light-emitting elements per unit area (cm2) of a substantial mounting part for light-emitting elements.

Abstract translation: 发光装置包括基板和安装在基板上的多个发光元件。 放置发光元件以满足以下条件：安装部件的每单位面积（cm2）的发光元件的数量B不小于0.4，平均安装密度D不小于58至不大于334 当建立公式“D = A×B”的关系时，假设D作为基板上的发光元件的平均安装密度，A作为流过一个发光元件的电流（mA），B作为 用于发光元件的基本安装部件的每单位面积的发光元件的数量（cm2）。

公开(公告)号：US08690392B2

公开(公告)日：2014-04-08

申请号：US13470593

申请日：2012-05-14

Applicant: Kozo Ogawa ,  Kiyoshi Nishimura ,  Nobuhiko Betsuda ,  Hiroki Tamai ,  Akiko Saito

Inventor： Kozo Ogawa ,  Kiyoshi Nishimura ,  Nobuhiko Betsuda ,  Hiroki Tamai ,  Akiko Saito

IPC: F21V29/00

CPC classification number: F21K9/00 ,  F21S2/005 ,  F21V17/12 ,  F21V19/0035 ,  F21V19/0055 ,  F21V23/005 ,  F21V29/505 ,  F21V29/507 ,  F21V29/713 ,  F21V29/74 ,  F21Y2105/10 ,  F21Y2113/00 ,  F21Y2115/10 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The light source unit is provided with a substrate and a decorative cover having thermal conductivity. The substrate includes a circuit pattern area, in which a plurality of LED chips are disposed, at the middle part thereof, has thermal conductivity, and transmits heat from the circuit pattern area to an area in the outer circumferential direction thereof. The decorative cover encloses the substrate, is electrically insulated from the circuit pattern area, and is thermally coupled to the surface side of the substrate at the periphery of the circuit pattern area by being face-contacted thereto. Heat of the substrate can be radiated by the decorative cover while securing an electric insulation property with respect to the circuit pattern area.

Abstract translation: 光源单元设置有基板和具有导热性的装饰盖。 基板包括在其中间部分设置有多个LED芯片的电路图形区域，具有导热性，并且将热量从电路图案区域传递到其外周方向的区域。 装饰盖包围基板，与电路图形区域电绝缘，并且通过与电路图形区域的周边面接触而与基板的表面侧热耦合。 可以通过装饰盖辐射基板的热量，同时确保相对于电路图案区域的电绝缘性能。

公开(公告)号：US08643047B2

公开(公告)日：2014-02-04

申请号：US13414458

申请日：2012-03-07

Applicant: Kozo Uemura ,  Soichi Shibusawa ,  Yumiko Hayashida ,  Kiyoshi Nishimura ,  Seiko Kawashima ,  Tsuyoshi Oyaizu ,  Masahiro Ogata ,  Shuhei Matsuda ,  Hiroki Tamai

Inventor： Kozo Uemura ,  Soichi Shibusawa ,  Yumiko Hayashida ,  Kiyoshi Nishimura ,  Seiko Kawashima ,  Tsuyoshi Oyaizu ,  Masahiro Ogata ,  Shuhei Matsuda ,  Hiroki Tamai

IPC: H01L33/00

CPC classification number: H05K3/284 ,  F21S8/04 ,  F21V19/0055 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0209 ,  H05K3/244 ,  H05K2201/0162 ,  H05K2201/099 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light-emitting device includes a substrate, a reflecting layer formed on the substrate, a light-emitting element placed on the reflecting layer, and a sealing resin layer that covers the reflecting layer and the light-emitting element. The oxygen permeability of the sealing resin layer is equal to or lower than 1200 cm3/(m2·day·atm), and the ratio of the area of the reflecting layer covered by the sealing resin layer to the entire area on the resin substrate covered by the sealing resin layer is between 30% and 75% inclusive.

Abstract translation: 发光装置包括基板，形成在基板上的反射层，放置在反射层上的发光元件和覆盖反射层和发光元件的密封树脂层。 密封树脂层的透氧度等于或低于1200cm3 /（m2·day·atm），并且覆盖在树脂基板上的密封树脂层覆盖的反射层的面积与覆盖的整个面积的比率 通过密封树脂层在30％和75％之间。

公开(公告)号：US20130250576A1

公开(公告)日：2013-09-26

申请号：US13533715

申请日：2012-06-26

Applicant: Nobuhiko BETSUDA ,  Hirotaka TANAKA ,  Takuya HONMA ,  Miho WATANABE ,  Kiyoshi NISHIMURA

Inventor： Nobuhiko BETSUDA ,  Hirotaka TANAKA ,  Takuya HONMA ,  Miho WATANABE ,  Kiyoshi NISHIMURA

IPC: F21V29/00 ,  H05K3/30 ,  H05K3/10 ,  H05K1/00 ,  F21V21/00

CPC classification number: H05K1/0209 ,  H01L2224/32225 ,  H05K1/0306 ,  H05K3/108 ,  H05K2201/10106 ,  Y10T29/4913

Abstract: According to one embodiment, a wiring board device includes a ceramic board including a first surface and a second surface. A first electrode layer is formed on the first surface of the ceramic board, and a second electrode layer is formed on the second surface of the ceramic board. The first electrode layer and the second electrode layer are not electrically connected to each other. A first copper plated layer as a wiring pattern is formed on the first electrode layer, and a second copper plated layer is formed on the second electrode layer. The first copper plated layer and the second copper plated layer are not electrically connected to each other. A heat spreader is thermally connected to the second copper plated layer.

Abstract translation: 根据一个实施例，布线板装置包括包括第一表面和第二表面的陶瓷板。 第一电极层形成在陶瓷板的第一表面上，第二电极层形成在陶瓷板的第二表面上。 第一电极层和第二电极层彼此不电连接。 在第一电极层上形成作为布线图案的第一镀铜层，在第二电极层上形成第二镀铜层。 第一镀铜层和第二镀铜层彼此不电连接。 散热器热连接到第二镀铜层。

公开(公告)号：US20120307493A1

公开(公告)日：2012-12-06

申请号：US13496749

申请日：2011-02-17

Applicant: Nobuhiko Betsuda ,  Kiyoshi Nishimura ,  Nobuo Shibano ,  Masao Segawa ,  Shuhei Matsuda ,  Soichi Shibusawa

Inventor： Nobuhiko Betsuda ,  Kiyoshi Nishimura ,  Nobuo Shibano ,  Masao Segawa ,  Shuhei Matsuda ,  Soichi Shibusawa

IPC: F21V29/00 ,  F21V7/00 ,  F21V19/00

CPC classification number: F21V3/00 ,  F21K9/23 ,  F21K9/232 ,  F21V23/002 ,  F21V29/677 ,  F21V29/713 ,  F21V29/77 ,  F21Y2107/40 ,  F21Y2115/10 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A lamp with ferrule 10 includes a substrate 12 in which a solid light-emitting device 11 is implemented on one surface side thereof; a thermal radiation member 14 which is fixed to the other surface side of the substrate 12 by a fluid fixing member 13 having thermal conductivity; a light-emitting portion 15 constituted by the substrate 12 and the thermal radiation member 14; a thermally conductive support member 17 which constitutes a three-dimensional light source body 16 using a plurality of light-emitting portions 15; a thermally conductive main body 18 which is provided with the support member 17 so as to project the three-dimensional light source body 16 to the one end portion side; and a ferrule member 19 that is provided on the other end portion side of the main body 18.

Abstract translation: 具有套圈10的灯具具有在其表面侧设置有固体发光元件11的基板12; 热辐射部件14，其通过具有导热性的流体固定部件13固定到基板12的另一个表面侧; 由基板12和热辐射部件14构成的发光部15; 构成使用多个发光部15的三维光源体16的导热性支撑构件17; 导热主体18，其设置有支撑部件17，以将三维光源体16突出到一个端部侧; 以及设置在主体18的另一端部侧的套圈构件19。

公开(公告)号：USD663443S1

公开(公告)日：2012-07-10

申请号：US29387857

申请日：2011-03-18

Applicant: Nobuhiko Betsuda ,  Kiyoshi Nishimura ,  Kozo Uemura ,  Shuhei Matsuda ,  Soichi Shibusawa

Designer： Nobuhiko Betsuda ,  Kiyoshi Nishimura ,  Kozo Uemura ,  Shuhei Matsuda ,  Soichi Shibusawa

公开(公告)号：US20110222264A1

公开(公告)日：2011-09-15

申请号：US13045787

申请日：2011-03-11

Applicant: Shuhei Matsuda ,  Soichi Shibusawa ,  Nobuhiko Betsuda ,  Kiyoshi Nishimura

Inventor： Shuhei Matsuda ,  Soichi Shibusawa ,  Nobuhiko Betsuda ,  Kiyoshi Nishimura

IPC: F21V9/16 ,  H01L33/08

CPC classification number: H05B33/0872 ,  F21K9/00 ,  F21K9/232 ,  F21S8/026 ,  F21Y2105/10 ,  F21Y2105/12 ,  F21Y2113/13 ,  F21Y2115/10 ,  G09G3/3413 ,  G09G2320/041 ,  G09G2320/06 ,  H01L25/0753 ,  H01L33/48 ,  H01L33/50 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H05B33/086 ,  H01L2924/00014 ,  H01L2924/00

Abstract: According to one embodiment, a light emitting device which is attached to an illumination apparatus and radiates light having a correlated color temperature of 2900 to 3600K is provided. The light emitting device includes a substrate, blue light emitting LED elements and red light emitting LED elements mounted on the substrate, and a wavelength converting unit. The red light emitting LED elements have a luminous intensity of 0.2 to 2.5 times as large as that of the blue light emitting LED elements at normal use temperature in a state where the light emitting device is attached to the illumination apparatus. The wavelength converting unit is excited by light emitted from the blue light emitting LED elements and converts the light to light having a peak wavelength within a range of 500 to 600 nm.

Abstract translation: 根据一个实施例，提供了附接到照明装置并发射相关色温为2900至3600K的光的发光装置。 发光装置包括基板，蓝色发光LED元件和安装在基板上的红色发光LED元件以及波长转换单元。 在发光装置安装在照明装置的状态下，红色发光LED元件的发光强度为正常使用温度下蓝色发光LED元件的发光强度的0.2〜2.5倍。 波长转换单元被从蓝色发光LED元件发射的光激发，并将该光转换成具有500-600nm范围内的峰值波长的光。

公开(公告)号：US20110175548A1

公开(公告)日：2011-07-21

申请号：US13005591

申请日：2011-01-13

Applicant: Kiyoshi NISHIMURA ,  Kozo Ogawa ,  Soichi Shibusawa

Inventor： Kiyoshi NISHIMURA ,  Kozo Ogawa ,  Soichi Shibusawa

IPC: H05B37/02

CPC classification number: H05K1/0216 ,  F21K9/00 ,  F21V19/0055 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2924/3011 ,  H05B33/0803 ,  H05K1/162 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2201/10409 ,  H01L2924/00014 ,  H01L2924/00

Abstract: According to one embodiment, a lighting apparatus includes a conductive main body at a ground potential, a light-emitting device in the main body, including an insulative substrate, a plurality of light-emitting elements mounted on a front side of the substrate, a power feeding wiring electrically connecting the light-emitting elements, and a conductor layer on a backside of the substrate, electrically connected to the power feeding wiring at a potential higher than a ground potential, and a lighting control device configured to supply power to the light-emitting device.

Abstract translation: 根据一个实施例，照明装置包括接地电位的导电主体，主体中的发光装置，包括绝缘基板，安装在基板的前侧的多个发光元件， 电连接发光元件的馈电布线以及与基底电位相比电连接到馈电布线的衬底背面的导体层;以及照明控制装置，被配置为向光提供电力 设备。

公开(公告)号：US20100301731A1

公开(公告)日：2010-12-02

申请号：US12790395

申请日：2010-05-28

Applicant: KAZUTO MORIKAWA ,  Masahiro Izumi ,  Kiyoshi Nishimura ,  Tomohiro Sanpei ,  Erika Takenaka ,  Shuhei Matsuda

Inventor： KAZUTO MORIKAWA ,  Masahiro Izumi ,  Kiyoshi Nishimura ,  Tomohiro Sanpei ,  Erika Takenaka ,  Shuhei Matsuda

IPC: H01K1/28

CPC classification number: H05K1/0274 ,  F21K9/23 ,  F21K9/232 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H05K3/284 ,  H05K2201/0108 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014

Abstract: According to one embodiment, a light-emitting module includes a module substrate, a reflective layer, conductive layers, a light-emitting element, and a sealing member. A reflective layer is provided on a surface of an insulating layer of the module substrate, and the conductive layers are provided in the vicinity of the reflective layer. Further, the light-emitting element is provided on the reflective layer. Moreover, the translucent sealing member has translucency and bury the reflective layer, the conductive layers, and the light-emitting element. The ratio of the area occupied by the reflective layer and the conductive layers to the sealed region sealed by the sealing member is equal to or greater than 80%.

Abstract translation: 根据一个实施例，发光模块包括模块衬底，反射层，导电层，发光元件和密封构件。 在模块基板的绝缘层的表面上设置反射层，并且在反射层附近设置导电层。 此外，发光元件设置在反射层上。 此外，半透明密封构件具有半透明性并且掩埋反射层，导电层和发光元件。 反射层和导电层占据密封部件密封的密封区域的面积的比例等于或大于80％。