公开(公告)号：US12069797B2

公开(公告)日：2024-08-20

申请号：US18275896

申请日：2022-01-17

Applicant: MEIDENSHA CORPORATION

Inventor： Shota Suzuki

IPC: H05K1/00 ,  H01G2/08 ,  H01G2/10 ,  H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0215 ,  H01G2/08 ,  H01G2/106 ,  H05K7/2039 ,  H05K2201/10409

Abstract: An electrical device according to the present invention has a case (1), a metallic heat sink plate (4) disposed an opening portion (OP) of the case and a circuit board (5) arranged on the heat sink plate. The heat sink plate (4) is interposed between a capacitor (2) and the circuit board (5) so that the circuit board (5) is separated from the capacitor (2) by not only the resinous case (1) but also the metallic heat sink plate (4). Thus, electromagnetic space noise generated from the capacitor (2) is shielded or reduced by the metallic heat sink plate (4) whereby a malfunction of the circuit board (5) is prevented from occurring due to electromagnetic space noise generated from the capacitor (2).

公开(公告)号：US12027444B2

公开(公告)日：2024-07-02

申请号：US17305951

申请日：2021-07-19

Applicant: LENOVO (SINGAPORE) PTE. LTD.

Inventor： Seiji Yamasaki ,  Masaaki Bandoh ,  Shigeru Yuzawa ,  Hua Wang

IPC: H01L23/40 ,  G06F1/20 ,  H05K1/18

CPC classification number: H01L23/4006 ,  G06F1/203 ,  H05K1/181 ,  H01L2023/4087 ,  H05K2201/10409 ,  H05K2201/10598

Abstract: An electronic device includes: a circuit board having a mounting face, on which an electronic component is mounted; a heat receiver including a heat receiving plate opposed to the electronic component; and a fastening mechanism that fixes the heat receiver to the circuit board. The fastening mechanism includes a receiver having a proximal end and a distal end, the receiver having a mounting hole penetrating from the proximal end to the distal end; and a fastener that is inserted into the mounting hole for fastening to the receiver to press the heat receiver. The receiver is surface-mounted on the mounting face by soldering with the proximal end facing the mounting face.

公开(公告)号：US12016122B2

公开(公告)日：2024-06-18

申请号：US17693498

申请日：2022-03-14

Applicant: Inventec (Pudong) Technology Corporation ,  INVENTEC CORPORATION

Inventor： Xun Wang ,  Sheng Guo

IPC: H05K1/14 ,  H05K1/11 ,  H05K5/03

CPC classification number: H05K1/14 ,  H05K1/11 ,  H05K5/03 ,  H05K2201/04 ,  H05K2201/10409

Abstract: A video transcoding card includes a first transcoding assembly and a second transcoding assembly. The first transcoding assembly includes a first circuit board, first transcoding boards, and a first main electrical connector. The first transcoding boards and the first main electrical connector are disposed on the first circuit board and are electrically connected to the first circuit board. The second transcoding assembly includes a second circuit board, second transcoding boards and a second main electrical connector. The second transcoding boards and the second main electrical connector are disposed on the second circuit board and are electrically connected to the second circuit board. The first main electrical connector and the second main electrical connector are connected to each other, and the second transcoding boards are electrically connected to the first circuit board via the second circuit board, the second main electrical connector, and the first main electrical connector.

公开(公告)号：US20240107687A1

公开(公告)日：2024-03-28

申请号：US18254328

申请日：2021-11-24

Applicant: LG INNOTEK CO., LTD.

Inventor： Kun Yong SONG ,  Dong Joon KIM

IPC: H05K5/00 ,  H05K1/02 ,  H05K1/14 ,  H05K5/02

CPC classification number: H05K5/003 ,  H05K1/0233 ,  H05K1/145 ,  H05K5/0247 ,  H05K2201/10303 ,  H05K2201/10409

Abstract: The electronic control device includes: a housing; a first plate disposed in the housing; a second plate disposed in the housing and having an inner surface facing the inner surface of the first plate; a first control module disposed in the housing; and a second control module disposed in the housing, wherein the first control module includes: a first printed circuit board having an inner surface coupled to one side of the first plate and one side of the second plate; a first power supply substrate disposed on an outer surface of the second plate; and a first EMI filter disposed between the first plate and the second plate, an inner surface of which is opposite to an inner surface of the first printed circuit board, and wherein the second control module includes: a second printed circuit board having an inner surface coupled to the other side surface of the first plate and the other side surface of the second plate; a second power supply substrate disposed on an outer surface of the first plate; and a second EMI filter disposed between the first plate and the second plate, an inner surface thereof faces an inner surface of the second printed circuit board.

公开(公告)号：US20240023226A1

公开(公告)日：2024-01-18

申请号：US18362742

申请日：2023-07-31

Applicant: CANON KABUSHIKI KAISHA

Inventor： Yo Kobayashi ,  Koji Hirai

IPC: H05K1/02

CPC classification number: H05K1/0219 ,  H05K1/0215 ,  H05K2201/0707 ,  H05K2201/10409

Abstract: A printed circuit board includes a front layer including frame ground regions on which connectors to be connected with external apparatuses or communication cables are mounted and which are connected with a ground, a signal ground region which is separated from the frame ground regions at the front layer, on which electronic devices configured to receive signals from the connectors are mounted, and which is connected with a ground, and a static electricity removal ground region separated from the frame ground regions and the signal ground region at the front layer, situated outside the frame ground regions, and connected with a ground.

公开(公告)号：USRE49723E1

公开(公告)日：2023-11-07

申请号：US17338794

申请日：2021-09-21

Applicant: Sevcon Limited

Inventor： Peter Barrass ,  Matt Jackson

IPC: H05K1/02 ,  H05K1/05 ,  H05K1/14 ,  H05K1/18 ,  H05K3/32 ,  H05K3/36 ,  H05K3/00

CPC classification number: H05K1/0204 ,  H05K1/056 ,  H05K1/144 ,  H05K1/18 ,  H05K3/32 ,  H05K3/368 ,  H05K1/0209 ,  H05K3/0061 ,  H05K2201/042 ,  H05K2201/066 ,  H05K2201/10409 ,  H05K2201/10598 ,  H05K2201/2036

Abstract: A power electronics assembly for an electric motor controller. The power electronics assembly comprises an insulated metal substrate, a composite material substrate, and a bolt having a bolt head and a bolt shaft for mechanically coupling the composite material substrate to the insulated metal substrate. The power electronics assembly also includes an electrically conductive sleeve configured to be held between a first electrical contact carried by the insulated metal substrate and a second electrical contact carried by the composite material substrate and the bolt is configured to clamp the composite material substrate to the insulated metal substrate to force the electrically conductive sleeve against the first electrical contact and the second electrical contact.

公开(公告)号：US20230142725A1

公开(公告)日：2023-05-11

申请号：US18054946

申请日：2022-11-14

Applicant: IDENERGIE INC

Inventor： Handy FORTIN-BLANCHETTE ,  Pierre BLANCHET

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/181 ,  H05K1/11 ,  H05K1/0204 ,  H05K2201/10409 ,  H05K2201/10166 ,  H05K2201/066

Abstract: A printed circuit board comprises N power switching cells operating in parallel and respectively comprising a transistor leg, at least one decoupling capacitor and a gate driver circuit. Each transistor leg comprises respective first and second transistors in series, a drain of the first transistor being connected to a positive DC line, a source of the second transistor being connected to a negative DC line, a source of the first transistor being connected to a drain of the second through a connection middle-point connected to an output terminal. Each gate driver circuit controls respective switching ON and OFF of the corresponding first and second transistors. The N transistor legs of the corresponding N power switching cells are positioned to substantially form a convex polygon having N edges of substantially the same length, each one of the N transistor legs being positioned along one of the edges of the convex polygon.

公开(公告)号：US20190235588A1

公开(公告)日：2019-08-01

申请号：US16260729

申请日：2019-01-29

Applicant: Fujitsu Technology Solutions Intellectual Property GmbH

Inventor： Diana Langner ,  Bernhard Kannler ,  Martin Schmutzer ,  Andreas Maier ,  Georg Ahn

IPC: G06F1/18 ,  H05K1/18 ,  H05K5/00 ,  H05K1/02

CPC classification number: G06F1/184 ,  G06F1/16 ,  H05K1/0203 ,  H05K1/181 ,  H05K5/0026 ,  H05K2201/10409 ,  H05K2201/2072

Abstract: An electrical device includes a housing, a circuit board including at least one fastening means, at least one fastening element configured to fix the circuit board on the housing by the at least one fastening means, and a microcontroller arranged on the circuit board, wherein an electrical contact electrically connected to the microcontroller is arranged on the circuit board to be spaced apart from the fastening means by a specified spacing, the fastening element has a housing-specific diameter at an end facing the circuit board, and the microcontroller is configured to determine a type of the housing on the basis of whether the fastening element contacts the at least one electrical contact.

公开(公告)号：US20190189532A1

公开(公告)日：2019-06-20

申请号：US16209347

申请日：2018-12-04

Applicant: Nokia Technologies Oy

Inventor： Jari HUTTUNEN ,  Matti AVIST

IPC: H01L23/367 ,  H01L23/40 ,  H01L23/498 ,  H01L23/50

CPC classification number: H01L23/3677 ,  H01L23/4006 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/50 ,  H01L2023/4037 ,  H01L2023/405 ,  H01L2023/4087 ,  H05K1/0209 ,  H05K2201/066 ,  H05K2201/10409 ,  H05K2201/10734

Abstract: An apparatus is disclosed comprising an integrated circuit package, wherein the integrated circuit package comprises a case containing at least one integrated circuit and a fastener configured to fasten the case to a heat sink. A system comprising the apparatus and a heat sink, and a method comprising providing the apparatus and fastening a heat sink to the case of the apparatus are also disclosed.

公开(公告)号：US20190104607A1

公开(公告)日：2019-04-04

申请号：US15723098

申请日：2017-10-02

Applicant: Juniper Networks, Inc.

Inventor： Peng Su ,  Gautam Ganguly ,  Marc D. Hartranft

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K3/22

CPC classification number: H05K1/0203 ,  H01L23/36 ,  H01L23/40 ,  H05K1/111 ,  H05K1/18 ,  H05K3/22 ,  H05K2201/066 ,  H05K2201/10159 ,  H05K2201/10409 ,  H05K2201/1059 ,  H05K2201/10606 ,  H05K2201/2036 ,  H05K2203/167

Abstract: The disclosed apparatus may include (1) at least one alignment pin that (A) is placed proximate to a component on a circuit board and (B) is secured proximate to the component on the circuit board and (2) at least one heatsink that (A) is placed atop the component after completion of a reflow process in which the component is soldered to the circuit board, (B) is aligned by the alignment pin such that the heatsink resides in a specific position atop the component, and (C) absorbs heat dissipated by the component when the component is operational. Various other apparatuses, systems, and methods are also disclosed.