MASK INSPECTION APPARATUS, SWITCHING METHOD, AND MASK INSPECTION METHOD

    公开(公告)号:US20200182803A1

    公开(公告)日:2020-06-11

    申请号:US16709630

    申请日:2019-12-10

    Abstract: A mask inspection apparatus according to the present disclosure includes: a field stop unit capable of switching between a field stop for an optical mask configured to emit an incident illumination light while maintaining the polarization state thereof and a field stop for an EUV mask configured to change the polarization state of a part of the incident illumination light and to cause an illumination light including an S-polarized light and a P-polarized light; a beam splitter unit capable of switching between a PBS for an optical mask and a non-polarized BS; an objective lens configured to collect an illumination light reflected in the beam splitter unit in a mask to be inspected and collect a reflected light obtained by reflecting an illumination light in the mask to be inspected; and a λ/4 plate that can be provided in an optical path of an illumination light and a reflected light.

    Inspection apparatus of EUV mask and its focus adjustment method

    公开(公告)号:US10319088B2

    公开(公告)日:2019-06-11

    申请号:US15441633

    申请日:2017-02-24

    Abstract: An inspection apparatus according to an aspect of the present invention includes an EUV light source 11, an illumination optical system 10 provided to apply the EUV light to an EUV mask 60, a concave mirror and a convex mirror 22 configured to reflect the EUV light reflected on the EUV mask 60, a camera 32 configured to detect EUV light reflected on the convex mirror 22 and thereby take an image of the EUV mask 60, an AF light source 16 configured to generate AF light having a wavelength of 450 nm to 650 nm, first and second detectors 27 and 30 configured to detect the AF light reflected on the EUV mask 60 through the concave mirror with the hole 21 and the convex mirror 22, and an processing device 31 configured to adjust a focus point of the EUV light on the EUV mask 60.

    Defect classifying method and optical inspection apparatus for silicon carbide substrate
    27.
    发明授权
    Defect classifying method and optical inspection apparatus for silicon carbide substrate 有权
    碳化硅基板缺陷分类方法和光学检测装置

    公开(公告)号:US09551672B2

    公开(公告)日:2017-01-24

    申请号:US14574641

    申请日:2014-12-18

    CPC classification number: G01N21/9501 G01N21/6489

    Abstract: Provided are a defect classifying method and an inspection apparatus which are capable of classifying a defect by distinguishing a basal plane dislocation, which is a killer defect in bipolar high-voltage elements, from other defects. The defect classifying method according to the present invention includes: projecting an illumination beam toward a silicon carbide substrate and forming a reflection image and a photoluminescence image; a first inspection step of detecting a defect image from the reflection image formed; a second inspection step of detecting a defect image from the photoluminescence image formed; and a defect classification step of classifying detected defects based on whether or not the defect image is detected and the shape of the detected defect image.

    Abstract translation: 提供了一种缺陷分类方法和检查装置,其能够通过将双极性高压元件中的杀伤性缺陷的基底位错区别于其他缺陷来对缺陷进行分类。 根据本发明的缺陷分类方法包括:向碳化硅衬底投射照明光束并形成反射图像和光致发光图像; 从形成的反射图像中检测缺陷图像的第一检查步骤; 从形成的光致发光图像检测缺陷图像的第二检查步骤; 以及基于检测到缺陷图像和检测到的缺陷图像的形状来分类检测到的缺陷的缺陷分类步骤。

    DEFECT CLASSIFYING METHOD AND INSPECTION APPARATUS
    28.
    发明申请
    DEFECT CLASSIFYING METHOD AND INSPECTION APPARATUS 有权
    缺陷分类方法和检查装置

    公开(公告)号:US20150168311A1

    公开(公告)日:2015-06-18

    申请号:US14574641

    申请日:2014-12-18

    CPC classification number: G01N21/9501 G01N21/6489

    Abstract: Provided are a defect classifying method and an inspection apparatus which are capable of classifying a defect by distinguishing a basal plane dislocation, which is a killer defect in bipolar high-voltage elements, from other defects. The defect classifying method according to the present invention includes: projecting an illumination beam toward a silicon carbide substrate and forming a reflection image and a photoluminescence image; a first inspection step of detecting a defect image from the reflection image formed; a second inspection step of detecting a defect image from the photoluminescence image formed; and a defect classification step of classifying detected defects based on whether or not the defect image is detected and the shape of the detected defect image.

    Abstract translation: 提供了一种缺陷分类方法和检查装置,其能够通过将双极性高压元件中的杀伤性缺陷的基底位错区别于其他缺陷来对缺陷进行分类。 根据本发明的缺陷分类方法包括:向碳化硅衬底投射照明光束并形成反射图像和光致发光图像; 从形成的反射图像中检测缺陷图像的第一检查步骤; 从形成的光致发光图像检测缺陷图像的第二检查步骤; 以及基于检测到缺陷图像和检测到的缺陷图像的形状来分类检测到的缺陷的缺陷分类步骤。

    INSPECTION METHOD AND INSPECTION APPARATUS
    29.
    发明申请
    INSPECTION METHOD AND INSPECTION APPARATUS 有权
    检验方法和检验装置

    公开(公告)号:US20140333921A1

    公开(公告)日:2014-11-13

    申请号:US14274919

    申请日:2014-05-12

    Abstract: The field of view of an objective lens is divided into two areas, and a transmission image of a photomask and a composite image obtained by optically synthesizing a transmission image and a reflection image of the photomask are picked up in parallel. A drop image generated at an edge portion of a pattern portion in the composite image is deleted by limiter processing or masking processing, or is deleted by using primary-differentiated signals of a composite image signal and a transmission image signal.

    Abstract translation: 将物镜的视野分为两个区域,并行地拾取光掩模的透射图像和通过光学合成透光图像和光掩模的反射图像而获得的合成图像。 在合成图像中的图案部分的边缘部分产生的下降图像通过限制器处理或掩蔽处理被删除,或者通过使用合成图像信号和透射图像信号的初级微分信号被删除。

    CHUCKING DEVICE AND CHUCKING METHOD
    30.
    发明申请
    CHUCKING DEVICE AND CHUCKING METHOD 有权
    切割装置和切割方法

    公开(公告)号:US20140189998A1

    公开(公告)日:2014-07-10

    申请号:US14148475

    申请日:2014-01-06

    CPC classification number: H01L21/6838 Y10T29/49998 Y10T279/11

    Abstract: Provided are a chucking device having low dusting characteristics and high detergent properties and capable of vacuum-sucking even a substrate having a large warpage, and a chucking method using the same. A chucking device according to an aspect of the present invention vacuum-sucks and holds a wafer. The chucking device includes: a perforated plate having a plurality of through-holes and being mounted with a wafer, the through-holes penetrating through both sides of the perforated plate; a porous plate that supports a surface other than a mounting surface of the perforated plate, on which the wafer is mounted, transmits a vacuum state to the wafer through the plurality of through-holes, and has a pore to limit a flow rate; and a vacuum pump that exhausts an air through the pore of the porous plate.

    Abstract translation: 提供一种具有低除尘特性和高洗涤性能的吸盘装置,并且即使是具有大翘曲的基板也能进行真空吸附,以及使用该夹紧装置的夹紧方法。 根据本发明的一个方面的夹持装置对晶片进行真空吸附和保持。 夹持装置包括:多孔板,具有多个通孔并且安装有晶片,所述通孔穿过多孔板的两侧; 支撑除了安装有晶片的多孔板的安装面以外的表面的多孔板通过多个通孔将真空状态传递到晶片,并且具有限制流量的孔; 以及通过多孔板的孔排出空气的真空泵。

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