Abstract:
The present application is directed to an assembly comprising an electronic device; and a multilayer film. The multilayer film comprises a barrier stack adjacent the electronic device, and a weatherable sheet adjacent the barrier stack opposite the electronic device. The assembly additionally comprises an opaque protective layer adjacent the barrier stack opposite the electronic device.
Abstract:
An assembly including a pressure sensitive adhesive layer at least 0.25 mm in thickness disposed on a barrier assembly, wherein the barrier assembly comprises a polymeric film substrate and a barrier film. The assembly is flexible and transmissive to visible and infrared light. A pressure sensitive adhesive in the form of a film at least 0.25 mm thick is also provided, the pressure sensitive adhesive including a polyisobutylene having a weight average molecular weight less than 300,000 grams per mole; and a hydrogenated hydrocarbon tackifier. Methods of making and using the assembly and the pressure sensitive adhesive are also included.
Abstract:
Curable epoxy resin compositions, preferably solvent-free, wherein a fluorene amine curative is partially melt dissolved and partially dispersed as a solid in at least one aromatic polyepoxide. The compositions provide prepregs which exhibit tack with surprisingly good shelf life properties. Cured composites comprising the prepregs are also provided. The cured composites exhibit little resin migration and glass transition temperatures that are comparable to those of cured neat resins.
Abstract:
Adhesive beads comprise a core comprising a pressure sensitive adhesive material and an essentially discontinuous organic polymer disposed about the core. The beads are free-flowing at room temperature. Upon application of heat and/or pressure the core is activated and blends with the coating to provide a pressure sensitive adhesive.
Abstract:
The present application is directed to an assembly comprising an electronic device, and a multilayer film. The multilayer film comprises a substrate adjacent the electronic device, a barrier stack adjacent the substrate opposite the electronic device, and a weatherable sheet adjacent the barrier stack opposite the substrate. The multilayer film is transparent and flexible and the barrier stack and the substrate are insulated from the environment.
Abstract:
The present application is directed to an assembly comprising an electronic device, and a multilayer film. The multilayer film comprises a substrate adjacent the electronic device, a barrier stack adjacent the substrate opposite the electronic device, and a weatherable sheet adjacent the barrier stack opposite the substrate. The multilayer film has been fused.
Abstract:
The present application is directed to an assembly comprising an electronic device, and a multilayer film. The multilayer film comprises a barrier stack adjacent the electronic device; and a weatherable sheet adjacent the barrier stack opposite the electronic device. The assembly additionally comprises a protective layer in contact with the electronic device and the weatherable sheet. The present application allows for the combination of any of the disclosed elements.
Abstract:
The present invention provides pressure-sensitive adhesive beads that comprise a tacky pressure-sensitive adhesive core and a non-tacky shell material that surrounds the area wherein the beads are capable of being positioned via magnetic means. The present invention also provides method(s) of preparing adhesive coated substrates using pressure-sensitive adhesive bead(s) that are magnetically responsive, electrostatically responsive, or both by using magnetic forces, electrostatic forces or both.
Abstract:
Curable epoxy resin compositions, preferably solvent-free, wherein a fluorene amine curative is partially melt dissolved and partially dispersed as a solid in at least one aromatic polyepoxide. The compositions provide prepregs which exhibit tack with surprisingly good shelf life properties. Cured composites comprising the prepregs are also provided. The cured composites exhibit little resin migration and glass transition temperatures that are comparable to those of cured neat resins.
Abstract:
Curable epoxy resin compositions, preferably solvent-free, wherein a fluorene amine curative is partially melt dissolved and partially dispersed as a solid in at least one aromatic polyepoxide. The compositions provide prepregs which exhibit tack with surprisingly good shelf life properties. Cured composites comprising the prepregs are also provided. The cured composites exhibit little resin migration and glass transition temperatures that are comparable to those of cured neat resins.