公开(公告)号：US08488299B2

公开(公告)日：2013-07-16

申请号：US12841456

申请日：2010-07-22

Applicant: Shih-Hsien Wu ,  Min-Lin Lee ,  Shinn-Juh Lai ,  Shur-Fen Liu ,  Meng-Hua Chen ,  Chin-Hsien Hung

Inventor： Shih-Hsien Wu ,  Min-Lin Lee ,  Shinn-Juh Lai ,  Shur-Fen Liu ,  Meng-Hua Chen ,  Chin-Hsien Hung

IPC: H01G4/005 ,  H01G5/06

CPC classification number: H01G4/005

Abstract: The disclosure provides a capacitor structure. A first dielectric layer is disposed over the first electrode layer. A second electrode layer is disposed over the first dielectric layer. At least one of the first electrode layer and the second electrode layer has a peak-valley like structure to create at least two different gap distances therebetween, thereby providing parallel combinations of at least two different capacitances.

Abstract translation: 本公开提供一种电容器结构。 第一电介质层设置在第一电极层上。 第二电极层设置在第一介电层上。 第一电极层和第二电极层中的至少一个具有峰谷状结构，以在它们之间产生至少两个不同的间隙距离，从而提供至少两个不同电容的并联组合。

公开(公告)号：US20120168839A1

公开(公告)日：2012-07-05

申请号：US13182469

申请日：2011-07-14

Applicant: Jiin-Shing Perng ,  Min-Lin Lee ,  Shinn-Juh Lai ,  Huey-Ru Chang

Inventor： Jiin-Shing Perng ,  Min-Lin Lee ,  Shinn-Juh Lai ,  Huey-Ru Chang

IPC: H01L27/06

CPC classification number: H01L25/165 ,  H01L23/3107 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The disclosure relates to a power device package structure. By employing the metal substrate of the power device package structure serve as a bottom electrode of a capacitor, the capacitor is integrated into the power device package structure. A dielectric material layer and a upper metal layer sequentially disposed on the metal substrate.

Abstract translation: 本公开涉及功率器件封装结构。 通过采用功率器件封装结构的金属衬底作为电容器的底部电极，将电容器集成到功率器件封装结构中。 依次设置在金属基板上的电介质材料层和上金属层。

公开(公告)号：US08094429B2

公开(公告)日：2012-01-10

申请号：US12488780

申请日：2009-06-22

Applicant: Chien-Min Hsu ,  Min-Lin Lee ,  Shinn-Juh Lai

Inventor： Chien-Min Hsu ,  Min-Lin Lee ,  Shinn-Juh Lai

IPC: H01G4/228

CPC classification number: H05K1/162 ,  H01G4/1209 ,  H01G4/232 ,  H01G4/30 ,  H01G4/35 ,  H01L28/86 ,  H05K3/429 ,  H05K2201/0187 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2201/09718 ,  Y10T29/43

Abstract: A capacitor device may include a first electrode, a second electrode, a third electrode, a first dielectric layer, and a second dielectric layer. The first electrode may be coupled with a first terminal of the capacitor device. The second electrode is under the first electrode and may be coupled with a second terminal of the capacitor device. The second electrode may be electrically isolated from the first electrode. The third electrode is under the first electrode and the second electrode and may be electrically isolated from the second electrode and electrically coupled with the first electrode. The first dielectric layer has a first dielectric constant and may be sandwiched between the first electrode and the second electrode. The second dielectric layer may have a second dielectric constant and may be sandwiched between the second electrode and the third electrode. In one embodiment, the second dielectric constant is at least five times larger than the first dielectric constant.

Abstract translation: 电容器装置可以包括第一电极，第二电极，第三电极，第一电介质层和第二电介质层。 第一电极可以与电容器装置的第一端子耦合。 第二电极位于第一电极下方并且可以与电容器装置的第二端子耦合。 第二电极可以与第一电极电隔离。 第三电极在第一电极和第二电极之下，并且可以与第二电极电隔离并与第一电极电耦合。 第一电介质层具有第一介电常数并且可夹在第一电极和第二电极之间。 第二电介质层可以具有第二介电常数并且可以夹在第二电极和第三电极之间。 在一个实施例中，第二介电常数比第一介电常数大至少五倍。

公开(公告)号：US07893359B2

公开(公告)日：2011-02-22

申请号：US11470435

申请日：2006-09-06

Applicant: Shih-Hsien Wu ,  Min-Lin Lee ,  Shinn-Juh Lay ,  Chih-Hao Chang

Inventor： Shih-Hsien Wu ,  Min-Lin Lee ,  Shinn-Juh Lay ,  Chih-Hao Chang

IPC: H05K1/16 ,  H05K1/18

CPC classification number: H05K1/162 ,  H05K3/4611 ,  H05K2201/0209 ,  H05K2201/09309 ,  Y10T29/43 ,  Y10T29/49126

Abstract: An embedded capacitor core including a first set of capacitors, a second set of capacitors, and an inter-layer dielectric film between the first set of capacitors and the second set of capacitors. The first set of capacitors includes: a first conductive pattern comprising at least two conductive electrodes; a second conductive pattern comprising at least two conductive electrodes corresponding to the two conductive electrodes of the first conductive pattern; and a first dielectric film between the first conductive pattern and the second conductive pattern. The second set of capacitors includes: a third conductive pattern comprising at least two conductive electrodes; a fourth conductive pattern comprising at least two conductive electrodes corresponding to the two conductive electrodes of the third conductive pattern; and a second dielectric film between the third conductive pattern and the fourth conductive pattern.

Abstract translation: 一种嵌入式电容器芯，包括第一组电容器，第二组电容器和在第一组电容器和第二组电容器之间的层间电介质膜。 第一组电容器包括：包括至少两个导电电极的第一导电图案; 第二导电图案，包括对应于第一导电图案的两个导电电极的至少两个导电电极; 以及在第一导电图案和第二导电图案之间的第一电介质膜。 第二组电容器包括：包括至少两个导电电极的第三导电图案; 第四导电图案，包括对应于第三导电图案的两个导电电极的至少两个导电电极; 以及在第三导电图案和第四导电图案之间的第二电介质膜。

公开(公告)号：US20110019335A1

公开(公告)日：2011-01-27

申请号：US12841456

申请日：2010-07-22

Applicant: Shih-Hsien WU ,  Min-Lin LEE ,  Shinn-Juh LAI ,  Shur-Fen LIU ,  Meng-Hua CHEN ,  Chin-Hsien HUNG

Inventor： Shih-Hsien WU ,  Min-Lin LEE ,  Shinn-Juh LAI ,  Shur-Fen LIU ,  Meng-Hua CHEN ,  Chin-Hsien HUNG

IPC: H01G4/005

CPC classification number: H01G4/005

Abstract: The disclosure provides a capacitor structure. A first dielectric layer is disposed over the first electrode layer. A second electrode layer is disposed over the first dielectric layer. At least one of the first electrode layer and the second electrode layer has a peak-valley like structure to create at least two different gap distances therebetween, thereby providing parallel combinations of at least two different capacitances.

Abstract translation: 本公开提供一种电容器结构。 第一电介质层设置在第一电极层上。 第二电极层设置在第一介电层上。 第一电极层和第二电极层中的至少一个具有峰谷状结构，以在它们之间产生至少两个不同的间隙距离，从而提供至少两个不同电容的并联组合。

公开(公告)号：US07875808B2

公开(公告)日：2011-01-25

申请号：US11531337

申请日：2006-09-13

Applicant: Huey-Ru Chang ,  Min-Lin Lee ,  Shinn-Juh Lay ,  Chin Sun Shyu

Inventor： Huey-Ru Chang ,  Min-Lin Lee ,  Shinn-Juh Lay ,  Chin Sun Shyu

IPC: H05K1/16

CPC classification number: H01L23/50 ,  H01G4/38 ,  H01L23/49822 ,  H01L2224/16 ,  H01L2924/01079 ,  H05K1/0231 ,  H05K1/162 ,  H05K2201/09309 ,  H05K2201/10734

Abstract: An embedded capacitor device within a circuit board having an integrated circuitry thereon is provided. The circuit board has a common coupling area under the integrated circuitry. The embedded capacitor device includes a first capacitor section providing at least one capacitor to a first terminal set of the integrated circuitry and a second capacitor section providing at least one capacitor to a second terminal set of the integrated circuitry. A portion of the first capacitor section is in the common coupling area and has its coupling to the first terminal set located in the common coupling area. Similarly, a portion of the second capacitor section is in the common coupling area and has its coupling to the second terminal set located in the common coupling area.

Abstract translation: 提供了具有集成电路的电路板内的嵌入式电容器件。 电路板在集成电路下具有公共耦合区域。 嵌入式电容器装置包括：向集成电路的第一端子组提供至少一个电容器的第一电容器部分和向集成电路的第二端子组提供至少一个电容器的第二电容器部分。 第一电容器部分的一部分在公共耦合区域中，并且其耦合到位于公共耦合区域中的第一端子组。 类似地，第二电容器部分的一部分在公共耦合区域中，并且其耦合到位于公共耦合区域中的第二端子组。

公开(公告)号：US20100321862A1

公开(公告)日：2010-12-23

申请号：US12805886

申请日：2010-08-23

Applicant: Shih-Hsien Wu ,  Shinn-Juh Lai ,  Min-Lin Lee ,  Shur-Fen Liu

Inventor： Shih-Hsien Wu ,  Shinn-Juh Lai ,  Min-Lin Lee ,  Shur-Fen Liu

IPC: H01G4/06

CPC classification number: H01G4/06 ,  H01G4/12 ,  H01G4/1227 ,  H01G4/14 ,  H01G4/20 ,  H01G4/206 ,  H05K1/162 ,  H05K3/4611 ,  H05K2201/0187 ,  H05K2201/0195 ,  H05K2201/09672 ,  H05K2201/2036 ,  Y10T29/417

Abstract: A capacitor device with a capacitance is introduced. The capacitor device includes at least one capacitive element. The at least capacitive element comprises a pair of first conductive layers being opposed to each other, at least one first dielectric layer formed on a surface of at least one of the first conductive layers, and a second dielectric layer being sandwiched between the first conductive layers. The first dielectric layer has a first dielectric constant and the second dielectric layer has a second dielectric constant. The capacitance of the capacitor device depends on dielectric parameters of the first dielectric layer and the second dielectric layer. The dielectric parameters comprise the first dielectric constant and thickness of the at least one first dielectric layer and the second dielectric constant and thickness of the second dielectric layer.

Abstract translation: 引入具有电容的电容器件。 电容器装置包括至少一个电容元件。 所述至少电容元件包括彼此相对的一对第一导电层，至少一个形成在所述第一导电层中的至少一个的表面上的第一电介质层，以及夹在所述第一导电层 。 第一介电层具有第一介电常数，第二介电层具有第二介电常数。 电容器器件的电容取决于第一介电层和第二介电层的介电参数。 介电参数包括第一介电常数和至少一个第一介电层的厚度和第二介电常数和第二介电层的厚度。

公开(公告)号：US20100163296A1

公开(公告)日：2010-07-01

申请号：US12468058

申请日：2009-05-19

Applicant: Cheng-Ta Ko ,  Min-Lin Lee ,  Wei-Chung Lo ,  Shur-Fen Liu ,  Jinn-Shing King ,  Shinn-Juh Lai ,  Yu-Hua Chen

Inventor： Cheng-Ta Ko ,  Min-Lin Lee ,  Wei-Chung Lo ,  Shur-Fen Liu ,  Jinn-Shing King ,  Shinn-Juh Lai ,  Yu-Hua Chen

IPC: H05K1/11 ,  B44C1/22

CPC classification number: H05K1/0222 ,  H05K3/429 ,  H05K2201/09636 ,  H05K2201/09645 ,  H05K2201/09809

Abstract: A plurality of coaxial leads is made within a single via in a circuit substrate to enhance the density of vertical interconnection so as to match the demand for higher density multi-layers circuit interconnection between top circuit layer and bottom circuit layer of the substrate. Coaxial leads provide electromagnetic interference shielding among the plurality of coaxial leads in a single via.

Abstract translation: 多个同轴引线在电路基板中的单个通孔内形成，以增强垂直互连的密度，以便匹配在衬底的顶层电路层和底层电路层之间的较高密度多层电路互连的需求。 同轴引线在单个通孔中的多个同轴引线之间提供电磁干扰屏蔽。

公开(公告)号：US20090180236A1

公开(公告)日：2009-07-16

申请号：US12410466

申请日：2009-03-25

Applicant: Min-Lin Lee ,  Shih-Hsien Wu ,  Shinn-Juh Lai ,  Shur-Fen Liu

Inventor： Min-Lin Lee ,  Shih-Hsien Wu ,  Shinn-Juh Lai ,  Shur-Fen Liu

IPC: H01G4/30 ,  H01L21/34

CPC classification number: H01G4/30 ,  H01G4/012 ,  H01G4/232 ,  H01L23/50 ,  H01L23/642 ,  H01L28/40 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01L2924/3011

Abstract: A stepwise capacitor structure includes at least one stepwise conductive layer. The stepwise capacitor represents a feature of multiple capacitors. When currents flow through the stepwise capacitor, different current paths are presented in between an upper conductor and a bottom conductor of the stepwise capacitor in response to different current frequency; different inductor is induced in each path and decoupled by a stepwise capacitor structure as disclosed herein.

Abstract translation: 逐步电容器结构包括至少一个逐步导电层。 逐步电容器表示多个电容器的特征。 当电流流过逐级电容器时，响应于不同的电流频率，在逐层电容器的上导体和底导体之间存在不同的电流路径; 在每个路径中感应不同的电感器，并通过如本文所公开的逐步电容器结构去耦合。

公开(公告)号：US07561410B1

公开(公告)日：2009-07-14

申请号：US12050188

申请日：2008-03-18

Applicant: Min-Lin Lee ,  Li-Duan Tsai ,  Shur-Fen Liu ,  Bang-Hao Wu ,  Cheng-Liang Cheng

Inventor： Min-Lin Lee ,  Li-Duan Tsai ,  Shur-Fen Liu ,  Bang-Hao Wu ,  Cheng-Liang Cheng

IPC: H01G9/025

CPC classification number: H01G9/15 ,  H01G9/0029 ,  H01G9/012 ,  H01L23/642 ,  H01L28/40 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/19015 ,  H01L2924/3011 ,  H01L2924/00

Abstract: A hybrid capacitor is provided which includes a substrate, at least one plate capacitor and at least one through hole capacitor. The substrate has through holes and the plate capacitors are on the substrate. At least one through hole capacitor and at least one plate capacitor are in parallel. The through hole capacitor at least includes an anode layer, a first dielectric layer, a first cathode layer and a second cathode layer. The anode layer is disposed on an inner surface of at least one through hole, and a surface of the anode layer is a porous structure. The first dielectric layer is disposed on the porous structure of the anode layer and covered with the first cathode layer. The first cathode layer is covered with the second cathode layer. A conductivity of the second cathode layer is larger than a conductivity of the first cathode layer.

Abstract translation: 提供了一种混合电容器，其包括基板，至少一个平板电容器和至少一个通孔电容器。 衬底具有通孔，并且板电容器在衬底上。 至少一个通孔电容器和至少一个平板电容器是并联的。 通孔电容器至少包括阳极层，第一电介质层，第一阴极层和第二阴极层。 阳极层设置在至少一个通孔的内表面上，阳极层的表面是多孔结构。 第一介电层设置在阳极层的多孔结构上并被第一阴极层覆盖。 第一阴极层被第二阴极层覆盖。 第二阴极层的导电率大于第一阴极层的导电率。