公开(公告)号：US12004288B2

公开(公告)日：2024-06-04

申请号：US17184793

申请日：2021-02-25

Applicant: Teradyne, Inc.

Inventor： Andrew Westwood

IPC: G01R31/00 ,  G01R1/04 ,  G01R31/28 ,  H01P3/08 ,  H05K1/02

CPC classification number: H05K1/0222 ,  G01R1/0433 ,  G01R1/0466 ,  G01R1/0483 ,  G01R31/2886 ,  H01P3/08 ,  H05K1/0251 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/14 ,  H05K2201/09609 ,  H05K2201/09754 ,  H05K2201/09809

Abstract: An example printed circuit board (PCB) includes a substrate having layers of a dielectric material, where the layers of dielectric material include a first layer and a second layer; a conductive trace that is between the first layer and the second layer and that is parallel to the first layer and the second layer along at least part of a length of the conductive trace; and a conductive via that extends at least part-way through the layers of dielectric material and that connects electrically to the conductive trace, where the conductive via is configured also to connect electrically to a signal input to receive or to transmit a signal that has a center frequency span.

公开(公告)号：US20230340862A1

公开(公告)日：2023-10-26

申请号：US18342022

申请日：2023-06-27

Applicant: GEODYNAMICS, INC.

Inventor： Phillip Phelps ,  Brad Perry ,  Rick Wallace

IPC: E21B43/1185 ,  H01R12/71 ,  H05K1/11 ,  F42D1/05 ,  F42D1/055

CPC classification number: E21B43/1185 ,  H01R12/714 ,  H05K1/119 ,  F42D1/05 ,  F42D1/055 ,  H05K2201/09445 ,  H05K2201/09027 ,  H05K2201/09809 ,  H01R13/08

Abstract: A switch assembly, which is part of a chain of switch assemblies, includes a communication unit (CU) configured to receive, from an external controller, a fire command to activate a detonator and a computing core (CC) configured to locally make a decision whether or not to activate the detonator, after receiving the fire command to activate the detonator.

公开(公告)号：US20230262890A1

公开(公告)日：2023-08-17

申请号：US17938977

申请日：2022-09-07

Applicant: Unimicron Technology Corp.

Inventor： Chih-Chiang Lu ,  Chi-Min Chang ,  Ming-Hao Wu ,  Yi-Pin Lin ,  Tung-Chang Lin ,  Jun-Rui Huang

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K1/115 ,  H05K1/0222 ,  H05K2201/0195 ,  H05K2201/09536 ,  H05K2201/09809

Abstract: A circuit board structure includes a substrate, a first build-up structure layer, first and second external circuit layers, at least one first conductive via, and second conductive vias. The first build-up structure layer is disposed on a first circuit layer of the substrate. The first external circuit layer is disposed on the first build-up structure layer. The second external circuit layer is disposed on a second circuit layer and a portion of a third dielectric layer of the substrate. The first conductive via is electrically connected to the first external circuit layer and the second external circuit layer to define a signal path. The second conductive vias surround the first conductive via, and the first external circuit layer, the second conductive vias, the first circuit layer, the outer conductive layer, and the second external circuit layer define a first ground path. The first ground path surrounds the signal path.

公开(公告)号：US10008849B2

公开(公告)日：2018-06-26

申请号：US15689337

申请日：2017-08-29

Applicant: John Mezzalingua Associates, LLC

Inventor： Werner Wild

IPC: H02H9/04 ,  H01R24/48 ,  H01T4/12 ,  H05K1/02

CPC classification number: H02H9/041 ,  H01R24/48 ,  H01T4/12 ,  H05K1/0257 ,  H05K2201/09809

Abstract: A surge protection device includes, in one embodiment, a surge responder operative to engage an inner conductor engager during a protection mode and disengage the inner conductor engager during a normal mode. The surge responder returns to the normal mode from the protection mode without operating intervention to replace or re-engage the surge responder.

公开(公告)号：US10002818B2

公开(公告)日：2018-06-19

申请号：US14695298

申请日：2015-04-24

Applicant: Nuvotronics, LLC

Inventor： Jean-Marc Rollin ,  David W. Sherrer

IPC: H01L29/40 ,  H01L23/373 ,  H01P3/06 ,  H01P11/00 ,  H05K1/02 ,  H01L23/58 ,  H01L23/528 ,  H01L23/552 ,  H01L23/00 ,  H01L23/66 ,  H05K3/40 ,  H05K3/46

CPC classification number: H01L23/373 ,  H01L23/5286 ,  H01L23/552 ,  H01L23/562 ,  H01L23/58 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2224/48091 ,  H01L2224/85444 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/1423 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01P3/06 ,  H01P11/005 ,  H05K1/0221 ,  H05K1/0224 ,  H05K1/0272 ,  H05K3/4092 ,  H05K3/4661 ,  H05K2201/09809 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/0733 ,  H05K2203/308 ,  Y02P70/611 ,  Y10T29/49002 ,  Y10T29/49018 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated electronic components. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.

公开(公告)号：US09980370B2

公开(公告)日：2018-05-22

申请号：US14912677

申请日：2014-09-11

Applicant: NEC Corporation

Inventor： Kazuhiro Kashiwakura

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/40 ,  H01P1/04 ,  H01P5/08

CPC classification number: H05K1/0222 ,  H01P1/045 ,  H01P5/085 ,  H05K1/0213 ,  H05K1/0251 ,  H05K1/113 ,  H05K1/116 ,  H05K3/0047 ,  H05K3/40 ,  H05K2201/09063 ,  H05K2201/09609 ,  H05K2201/09809

Abstract: To provide a printed board that solves the problem of transmission characteristics deterioration, the disclosed printed board includes a substrate, a circular signal pad that is provided on the substrate, a doughnut-shaped ground pad, which sandwiches the substrate that surrounds, in a doughnut shape, the signal pad, and which surrounds the outer circumference of the substrate, and one or more recessed sections that are disposed on the substrate that surrounds, in the doughnut shape, the signal pad.

公开(公告)号：US20170365985A1

公开(公告)日：2017-12-21

申请号：US15689337

申请日：2017-08-29

Applicant: John Mezzalingua Associates, LLC

Inventor： Werner Wild

IPC: H01T4/12 ,  H01R24/48 ,  H02H9/04 ,  H05K1/02

CPC classification number: H02H9/041 ,  H01R24/48 ,  H01T4/12 ,  H05K1/0257 ,  H05K2201/09809

Abstract: A surge protection device includes, in one embodiment, a surge responder operative to engage an inner conductor engager during a protection mode and disengage the inner conductor engager during a normal mode. The surge responder returns to the normal mode from the protection mode without operating intervention to replace or re-engage the surge responder.

公开(公告)号：US09827629B2

公开(公告)日：2017-11-28

申请号：US14073607

申请日：2013-11-06

Applicant: Micron Technology, Inc.

Inventor： Thomas Kinsley

IPC: H05K3/34 ,  B23K1/00 ,  G01R31/04 ,  H05K1/02 ,  H05K1/11

CPC classification number: B23K1/0016 ,  G01R31/048 ,  H05K1/0268 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/09663 ,  H05K2201/09809 ,  H05K2201/10734 ,  H05K2203/163 ,  H05K2203/175 ,  Y02P70/611 ,  Y10T29/49004 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: Some embodiments of the present invention are generally directed to testing connections of a memory device to a circuit board or other device. In one embodiment, a memory device that is configured to facilitate continuity testing between the device and a printed circuit board or other device is disclosed. The memory device includes a substrate and two connection pads that are electrically coupled to one another via a test path. A system and method for testing the connections between a memory device and a circuit board or other device are also disclosed, as are additional techniques for detecting excess temperature and enabling special functionalities using multi-stage connection pads.

公开(公告)号：US09763331B2

公开(公告)日：2017-09-12

申请号：US15066244

申请日：2016-03-10

Applicant: FUJITSU LIMITED

Inventor： Yoshiyuki Hiroshima ,  Naoki Nakamura ,  Akiko Matsui ,  Mitsuhiko Sugane ,  Takahide Mukoyama ,  Tetsuro Yamada ,  Kohei Choraku

IPC: H05K1/14 ,  H05K1/18 ,  H05K3/30 ,  H05K3/46

CPC classification number: H05K1/185 ,  H05K1/0216 ,  H05K1/115 ,  H05K1/162 ,  H05K3/306 ,  H05K3/4623 ,  H05K3/4644 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09627 ,  H05K2201/09809 ,  H05K2201/10015 ,  H05K2201/10287 ,  H05K2201/10295

Abstract: A printed circuit board includes: a first electrode made of a tubular electric conductor formed on an inner wall of a first hole formed in the printed circuit board; a dielectric body disposed inside the first electrode; and a second electrode made of a tubular electric conductor formed on an inner wall of a second hole extending through the dielectric body, the second electrode having a center axis concentric with the first electrode.

公开(公告)号：US09723709B2

公开(公告)日：2017-08-01

申请号：US12256467

申请日：2008-10-22

Applicant: Todd Steigerwald ,  Tom Bentley ,  Jerry Mayfield ,  Brad Vier

Inventor： Todd Steigerwald ,  Tom Bentley ,  Jerry Mayfield ,  Brad Vier

IPC: H04B1/44 ,  H05K1/02 ,  H05K1/03 ,  H05K1/18

CPC classification number: H05K1/0219 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/189 ,  H05K2201/09618 ,  H05K2201/09709 ,  H05K2201/09809 ,  H05K2201/09981 ,  H05K2201/10189

Abstract: The present invention is a mobile device capable of transmitting or receiving wireless signals and incorporating an FPC shielded RF signal conductor for connecting transmitter and/or receiver circuitry to an associated RF antenna or antennas. In some embodiments FCP may incorporate the antenna in an unshielded section of the FPC. In some embodiments a single FPC may provide for multiple RF carrier conductors each with their own associated shielding.