公开(公告)号：US6133633A

公开(公告)日：2000-10-17

申请号：US169249

申请日：1998-10-09

Applicant: Daniel George Berger ,  Guy Paul Brouillette ,  David Hirsch Danovitch ,  Peter Alfred Gruber ,  Rajesh Shankerlal Patel ,  Stephen Roux ,  Carlos Juan Sambucetti ,  James Louis Speidell

Inventor： Daniel George Berger ,  Guy Paul Brouillette ,  David Hirsch Danovitch ,  Peter Alfred Gruber ,  Rajesh Shankerlal Patel ,  Stephen Roux ,  Carlos Juan Sambucetti ,  James Louis Speidell

IPC: H01L21/60 ,  H01L21/68 ,  H01L23/485 ,  H05K3/34 ,  H01L23/48

CPC classification number: H05K3/3468 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128

Abstract: A method for forming solder bumps on an electronic structure including the steps of first providing a mold made by a sheet of a mold material having a thickness greater than that of the solder bumps to be formed, the mold material has sufficient optical transparency so as to allow the inspection of a solder material subsequently filled into the mold cavities that are formed in the mold material, and a coefficient of thermal expansion that is substantially similar to the substrate which the mold will be mated to, forming a multiplicity of mold cavities in the sheet of mold material, filling the multiplicity of mold cavities with a solder material, cooling the mold to a temperature that is sufficient to solidify the solder material in the multiplicity of mold cavities, positioning the mold intimately with the electronic structure such that the cavities facing the structure, and heating the mold and the structure together to a temperature sufficiently high such that the solder material transfers onto the electronic structure.

公开(公告)号：US5775569A

公开(公告)日：1998-07-07

申请号：US741453

申请日：1996-10-31

Applicant: Daniel George Berger ,  Guy Paul Brouillette ,  David Hirsch Danovitch ,  Peter Alfred Gruber ,  Rajesh Shankerlal Patel ,  Stephen Roux ,  Carlos Juan Sambucetti ,  James Louis Speidell

Inventor： Daniel George Berger ,  Guy Paul Brouillette ,  David Hirsch Danovitch ,  Peter Alfred Gruber ,  Rajesh Shankerlal Patel ,  Stephen Roux ,  Carlos Juan Sambucetti ,  James Louis Speidell

IPC: H01L21/60 ,  H01L21/68 ,  H01L23/485 ,  H05K3/34

CPC classification number: H05K3/3468 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128

Abstract: A method for forming solder bumps on an electronic structure including the steps of first providing a mold made by a sheet of a mold material having a thickness greater than that of the solder bumps to be formed, the mold material has sufficient optical transparency so as to allow the inspection of a solder material subsequently filled into the mold cavities that are formed in the mold material, and a coefficient of thermal expansion that is substantially similar to the substrate which the mold will be mated to, forming a multiplicity of mold cavities in the sheet of mold material, filling the multiplicity of mold cavities with a solder material, cooling the mold to a temperature that is sufficient to solidify the solder material in the multiplicity of mold cavities, positioning the mold intimately with the electronic structure such that the cavities facing the structure, and heating the mold and the structure together to a temperature sufficiently high such that the solder material transfers onto the electronic structure.

公开(公告)号：US5673846A

公开(公告)日：1997-10-07

申请号：US518736

申请日：1995-08-24

Applicant: Peter Alfred Gruber

Inventor： Peter Alfred Gruber

IPC: B23K35/02 ,  H01L21/48 ,  H01L21/60 ,  H05K3/34 ,  B23K35/14

CPC classification number: B23K35/0222 ,  H01L21/4853 ,  H01L24/11 ,  H05K3/3436 ,  H05K3/3468 ,  H01L2224/11003 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128 ,  Y02P70/613

Abstract: A solder decal is produced by a method wherein a decal strip having a plurality of anchor holes is aligned with a mold having a plurality of cells. Liquid solder is injected into the anchor holes and mold cells, and is then allowed to cool to solidify therein. The mold may be separated from the decal strip to form the solder decal containing solder beads each having a stem mechanically joined to the strip at respective ones of the anchor holes. Various forms of the solder decal are used for transferring the solder beads to a substrate or chip, or effecting temporary connections for conducting burn-in and testing, or accommodating thermal mismatch for example.

Abstract translation: 通过一种方法产生焊锡贴花，其中具有多个锚定孔的贴花带与具有多个电池的模具对准。 将液体焊料注入锚定孔和模具细胞中，然后使其冷却固化。 模具可以与贴花带分离以形成含有焊料珠的焊料贴花，每个焊料珠都具有在相应的锚定孔处机械连接到带材的茎。 使用各种形式的焊锡贴花将焊料珠转移到基板或芯片，或者实现用于进行老化和测试的临时连接，或者例如适应热失配。

公开(公告)号：US08703274B2

公开(公告)日：2014-04-22

申请号：US12244067

申请日：2008-10-02

Applicant: Russell A. Budd ,  Bing Dang ,  William S. Graham ,  Peter Alfred Gruber ,  Richard Levine ,  Da-Yuan Shih

Inventor： Russell A. Budd ,  Bing Dang ,  William S. Graham ,  Peter Alfred Gruber ,  Richard Levine ,  Da-Yuan Shih

IPC: B32B3/00

CPC classification number: B23K1/0016 ,  B23K1/20 ,  B23K26/364 ,  B23K2101/40 ,  H05K1/111 ,  H05K3/3457 ,  H05K2201/09381 ,  H05K2201/0969 ,  H05K2201/09745 ,  H05K2203/043 ,  Y02P70/611 ,  Y10T428/24479

Abstract: A microcavity structure is provided. The structure comprises a cavity layout that enables centering of reflowed solder at each of one or more interconnect locations and protrusion of the reflowed solder sufficiently from the cavity to facilitate wetting. Techniques are also provided for producing a microcavity structure, for using injection molded solder (IMS) for micro bumping, as well as for using injection molded solder (IMS) for three-dimensional (3D) packaging.

Abstract translation: 提供微腔结构。 该结构包括空腔布局，其能够使一个或多个互连位置中的每一个处的回流焊料居中并且使回流焊料从空腔充分突出以促进润湿。 还提供了用于制造微腔结构的技术，用于使用用于微型凸起的注射成型焊料（IMS）以及用于三维（3D）封装的注射成型焊料（IMS）。

公开(公告)号：US08408448B1

公开(公告)日：2013-04-02

申请号：US13371431

申请日：2012-02-11

Applicant: Claudius Feger ,  Peter Alfred Gruber ,  Mark Harrison McLeod ,  Jae-Woong Nah

Inventor： Claudius Feger ,  Peter Alfred Gruber ,  Mark Harrison McLeod ,  Jae-Woong Nah

IPC: B23K31/02

CPC classification number: B23K3/0623 ,  B23K3/08 ,  B23K35/0244

Abstract: A process and tools for forming spherical metal balls is described incorporating molds, injection molded solder, a liquid or gaseous environment to reduce or remove metal oxides and an unconstrained reflow of metal in a heated liquid or gas and solidification of molten metal in a cooler liquid or gas.

Abstract translation: 描述了用于形成球形金属球的工艺和工具，其包括模具，注射成型焊料，液体或气体环境以减少或去除金属氧化物和金属在加热的液体或气体中的无约束回流以及熔融金属在较冷液体中的固化 或气体。

公开(公告)号：US06425518B1

公开(公告)日：2002-07-30

申请号：US09912845

申请日：2001-07-25

Applicant: Peter Alfred Gruber ,  Chon Cheong Lei

Inventor： Peter Alfred Gruber ,  Chon Cheong Lei

IPC: B23K3102

CPC classification number: B23K3/0638 ,  B23K2101/42 ,  H05K3/3468 ,  H05K2201/10424 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/043 ,  H05K2203/128

Abstract: There is provided a method for applying solder to an element on a surface of a substrate. The method comprises the steps of (a) placing a mold over the surface, where the mold includes a conduit that contains the solder, and (b) heating the solder to a molten state so that the solder flows from the conduit onto the element. The conduit enjoys two degrees of horizontal freedom with respect to the surface such that the conduit becomes substantially aligned with the element when the solder is in the molten state. There is also provided a system for applying solder to an element on a surface of a substrate.

Abstract translation: 提供了将焊料施加到基板表面上的元件的方法。 该方法包括以下步骤：（a）将模具放置在表面上，其中模具包括含有焊料的导管，和（b）将焊料加热至熔融状态，使得焊料从导管流到元件上。 导管相对于表面具有两度的水平自由度，使得当焊料处于熔融状态时，导管变得基本上与元件对齐。 还提供了一种用于将焊料施加到衬底表面上的元件的系统。

公开(公告)号：US6105852A

公开(公告)日：2000-08-22

申请号：US19396

申请日：1998-02-05

Applicant: Steven A. Cordes ,  Peter Alfred Gruber ,  Egon Max Kummer ,  Stephen Roux ,  Carlos Juan Sambucetti ,  James Louis Speidell

Inventor： Steven A. Cordes ,  Peter Alfred Gruber ,  Egon Max Kummer ,  Stephen Roux ,  Carlos Juan Sambucetti ,  James Louis Speidell

IPC: B23K35/12 ,  H01L21/60 ,  H05K3/00 ,  H05K3/34 ,  H01L29/40 ,  H01L2/44

CPC classification number: H01L24/11 ,  H05K3/3468 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128 ,  H05K3/002

Abstract: A precise volume, precisely registerable carrier is provided for use with injection molding for producing integrated circuit bump contacts in the "flip chip" technology. A hemispherical cavity is produced by etching through and undercutting a registered opening into a transparent carrier. The hemispherical cavity has related specific volume and visible peripheral shape that permits simple optical quality control when the injection molding operation has filled the cavity and simple optical registration for fusing to the pads on the integrated circuit.

Abstract translation: 提供精确的体积，精确对准的载体，用于注射成型，用于在“倒装芯片”技术中制造集成电路凸块触点。 通过将注册的开口蚀刻穿透并切割成透明载体来制造半球形腔。 半球形腔体具有相关的体积和可见的周边形状，当注射成型操作已经填充空腔时，允许简单的光学质量控制，并且简单的光学配准用于熔合到集成电路上的焊盘。

公开(公告)号：US6029882A

公开(公告)日：2000-02-29

申请号：US67904

申请日：1998-04-27

Applicant: Lannie R. Bolde ,  Peter Alfred Gruber ,  Chon Cheong Lei

Inventor： Lannie R. Bolde ,  Peter Alfred Gruber ,  Chon Cheong Lei

IPC: B23K3/06 ,  H01L21/48 ,  H05K3/34

CPC classification number: B23K3/0638 ,  H01L21/4853 ,  H05K3/3468 ,  B23K2201/40 ,  H01L2224/11003 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01322 ,  H01L2924/10253 ,  H05K2201/10424 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128

Abstract: Disclosed is a solder injection mold apparatus and method for providing solder balls to a printed circuit board substrate using the solder injection mold apparatus in the plastic ball grid array (PBGA). The solder mold through holes are chamfered at entry and at exit ends to assist in receipt of molten solder and the formation and transfer of solder balls to lands on the substrate. A blind recess is provided in the second major surface of the mold, i.e. the side facing the substrate, in order to accommodate electronic components mounted thereon. Solder balls are delivered and metallurgically affixed to the lands in a process that requires only one reflow, leaving the through holes clean of solder and the mold ready for reuse. The material of which the substrate, mold and base plate are comprised is selected to be non-wettable by solder and mutually compatible with respect to CTE when exposed to temperatures of molten solder.

Abstract translation: 公开了一种使用塑料球栅阵列（PBGA）中的焊料注射模具装置向印刷电路板基板提供焊球的焊料注射模具装置和方法。 焊接模具通孔在入口处和出口端被倒角，以帮助接收熔融焊料，并且将焊球形成和转移到衬底上的焊盘上。 在模具的第二主表面，即面向衬底的一侧设置盲孔，以容纳安装在其上的电子部件。 焊球在仅需要一个回流的过程中输送和冶金地附着在焊盘上，留下通孔清洁焊料并且模具准备好重新使用。 选择基材，模具和基板的材料，当暴露于熔融焊料的温度时，被选择为不被焊料润湿并且相对于CTE相互兼容。

公开(公告)号：US20100072263A1

公开(公告)日：2010-03-25

申请号：US12627249

申请日：2009-11-30

Applicant: Peter Alfred Gruber ,  Paul Alfred Lauro ,  Jae-Woong Nah

Inventor： Peter Alfred Gruber ,  Paul Alfred Lauro ,  Jae-Woong Nah

IPC: B23K1/20 ,  B23K31/02

CPC classification number: B23K1/0016 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1183 ,  H01L2224/1184 ,  H01L2224/11848 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  Y10T428/24612 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method for forming alloy deposits at selected areas on a receiving substrate includes the steps of: providing an alloy carrier including at least a first decal including a first plurality of openings and a second decal including a second plurality of openings, the first and second decals being arranged such that each of the first plurality of openings is in alignment with a corresponding one of the second plurality of openings; filling the first and second plurality of openings with molten alloy; cooling the molten alloy to thereby form at least first and second plugs, the first plug having a first surface and a second surface substantially parallel to one another, the second plug having a third surface and a fourth surface substantially parallel to one another; removing at least one of the first and second decals to at least partially expose the first and second plugs; aligning the alloy carrier with the receiving substrate so that the first and second plugs correspond to the selected areas on the receiving substrate; and transferring the first plug to a first of the selected areas and the second plug to a second of the selected areas.

Abstract translation: 一种用于在接收基板上的选定区域形成合金沉积物的方法，包括以下步骤：提供合金载体，该合金载体包括至少包括第一多个开口的第一贴花和包括第二多个开口的第二贴花，第一和第二贴花 被布置成使得所述第一多个开口中的每一个与所述第二多个开口中的对应的一个开口对准; 用熔融合金填充第一和第二多个开口; 冷却所述熔融合金，从而形成至少第一和第二塞子，所述第一塞子具有基本上彼此平行的第一表面和第二表面，所述第二塞子具有基本上彼此平行的第三表面和第四表面; 去除所述第一和第二贴花中的至少一个以至少部分地暴露所述第一和第二插塞; 将合金载体与接收基板对准，使得第一和第二插塞对应于接收基板上的选定区域; 以及将所述第一插头转移到所选择的区域中的第一个，并且将所述第二插头转移到所选择的区域中的第二个。

公开(公告)号：US20100028612A1

公开(公告)日：2010-02-04

申请号：US12181852

申请日：2008-07-29

Applicant: Peter Alfred Gruber ,  Paul Alfred Lauro ,  Jae-Woong Nah

Inventor： Peter Alfred Gruber ,  Paul Alfred Lauro ,  Jae-Woong Nah

IPC: B32B3/02 ,  B23K31/02

CPC classification number: B23K1/0016 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1183 ,  H01L2224/1184 ,  H01L2224/11848 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  Y10T428/24612 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method for forming alloy deposits at selected areas on a receiving substrate includes the steps of: providing an alloy carrier including at least a first decal including a first plurality of openings and a second decal including a second plurality of openings, the first and second decals being arranged such that each of the first plurality of openings is in alignment with a corresponding one of the second plurality of openings; filling the first and second plurality of openings with molten alloy; cooling the molten alloy to thereby form at least first and second plugs, the first plug having a first surface and a second surface substantially parallel to one another, the second plug having a third surface and a fourth surface substantially parallel to one another; removing at least one of the first and second decals to at least partially expose the first and second plugs; aligning the alloy carrier with the receiving substrate so that the first and second plugs correspond to the selected areas on the receiving substrate; and transferring the first plug to a first of the selected areas and the second plug to a second of the selected areas.