公开(公告)号：US20240334593A1

公开(公告)日：2024-10-03

申请号：US18591917

申请日：2024-02-29

Applicant: Rolls-Royce Deutschland Ltd & Co KG

Inventor： Gergely László HEGEDÜS-FUCHS ,  Daniel FARKAS ,  Tamás Attila FODOR

IPC: H05K1/02

CPC classification number: H05K1/0271 ,  H05K2201/10409 ,  H05K2201/10424

Abstract: A holding down construction for a printed circuit board includes a grid structure having first ribs and second ribs arranged in a crossed manner, wherein the first ribs and the second ribs form intersections, and wherein the grid structure has an upper side and a lower side. The holding down construction further includes screwing posts attached to the grid structure and configured to be screwed against a printed circuit board and/or another component, and contact structures attached to the lower side of the grid structure and configured to lie against and exert a force against the printed circuit board.

公开(公告)号：US20230413444A1

公开(公告)日：2023-12-21

申请号：US17807754

申请日：2022-06-20

Applicant: Sumitomo Wiring Systems, Ltd.

Inventor： Cody Hicks ,  Brian Carnick

IPC: H05K1/18

CPC classification number: H05K1/18 ,  H05K2201/10424

Abstract: A circuit board assembly includes a circuit board having a pair of slots spaced apart from each other and a terminal opening disposed between the pair of slots; and a tuning fork. The tuning fork includes a pair of terminals; a pair of shoulders, the pair of terminals attached to the pair of shoulders, each of the pair of shoulders extending orthogonal from a bottom of the pair of terminals; and a pair of supports extending upwardly from a corresponding one of the pair of shoulders, the pair of terminals disposed between the pair of support portions, the pair of support portions configured to engage a corresponding one of the pair of slots so as to place the pair of terminals within the terminal opening of the circuit board.

公开(公告)号：US11711909B2

公开(公告)日：2023-07-25

申请号：US17398725

申请日：2021-08-10

Applicant: KIOXIA CORPORATION

Inventor： Akitoshi Suzuki

IPC: H05K7/20 ,  H05K5/00 ,  H05K1/02 ,  H05K1/18 ,  H05K1/14

CPC classification number: H05K7/20436 ,  H05K1/0203 ,  H05K5/006 ,  H05K5/0008 ,  H05K7/20136 ,  H05K7/20472 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/042 ,  H05K2201/10015 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/10424 ,  H05K2201/10522

Abstract: An electronic device includes a top plate having a first surface and a second surface that is positioned at an elevation that is lower than an elevation of the first surface, the second surface extending from a first end part of the top plate to a second end part of the top plate, a bottom plate provided under the top plate, and a circuit board placed between the top plate and the bottom plate and mounted with an electronic component. The top plate has opposing first and second edges and opposing third and fourth edges that are perpendicular to the first and the second edges, the first end part being formed at the first edge and the second end part being formed at the second edge.

公开(公告)号：US20190221491A1

公开(公告)日：2019-07-18

申请号：US16247593

申请日：2019-01-15

Applicant: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD. ,  FOXCONN INTERCONNECT TECHNOLOGY LIMITED

Inventor： HENG-KANG WU ,  FU-JIN PENG

IPC: H01L23/32 ,  H01R12/70 ,  H01R13/22 ,  H01R13/635

CPC classification number: H01L23/32 ,  H01R12/7058 ,  H01R12/7076 ,  H01R13/22 ,  H01R13/635 ,  H05K2201/10393 ,  H05K2201/10424

Abstract: An electrical connector includes an insulative housing retaining a plurality of contacts therein and surrounded by a metallic seat. A clip includes a frame with corresponding four walls to commonly form a receiving cavity to receive the electronic package therein, and each wall forms a pressing section to downwardly press an upward surface of the electronic package. A pair of latches are formed on a lower side of the frame to cooperate with the pressing sections of the walls to retain electronic package within the receiving cavity to be wholly a sub-assembly for being commonly received within the electrical connector. The clip includes a releasing handle to actuate the corresponding latch, and the releasing handle is positioned in an opening of the seat and intimately above the printed circuit board to function as a foolproof mechanism for loading the electronic package in a right orientation.

公开(公告)号：US20180356585A1

公开(公告)日：2018-12-13

申请号：US15828593

申请日：2017-12-01

Applicant: Samsung Display Co., Ltd.

Inventor： Young-min PARK ,  Dohun KIM ,  Taek-sun SHIN

IPC: F21V8/00 ,  H05K1/14

CPC classification number: G02B6/0083 ,  G02B6/009 ,  G02F1/133615 ,  G02F2001/133325 ,  H05K1/147 ,  H05K1/148 ,  H05K2201/09027 ,  H05K2201/10106 ,  H05K2201/10136 ,  H05K2201/10189 ,  H05K2201/10424

Abstract: A display apparatus includes a display panel and a backlight unit. The backlight unit includes a light source, a first substrate on which the light source is mounted, a driving substrate which supplies driving power to the light source, a second substrate connecting the first substrate to the driving substrate, a connector mounted on the driving substrate and coupled to the second substrate, and a dam mounted on the driving substrate and facing the connector with the second substrate interposed therebetween. The dam restricts movement of the second substrate in a direction away from the connector.

公开(公告)号：US20180338395A1

公开(公告)日：2018-11-22

申请号：US15540247

申请日：2016-11-28

Applicant: Gan CHEN

Inventor： Gan CHEN

IPC: H05K9/00

CPC classification number: H05K9/0032 ,  H05K1/181 ,  H05K2201/10371 ,  H05K2201/10424

Abstract: Disclosed is a shielding case frame. The shielding case frame comprises a frame main body and a suction structure connected with the frame main body through at least one precut structure, wherein the precut structure comprises extension parts arranged on the suction structure, a pressing part connected with the extension parts, and a precut part; the pressing part is connected with the frame main body through the precut part, and the bottom surface or/and the top surface of the precut part is provided with a precut groove. The suction structure can be removed rapidly and conveniently by pressing the pressing parts with fingers without a special tool; the structure is simple, machining is convenient, and production cost is low; the shielding case frame is high in overall strength and not prone to deformation.

公开(公告)号：US20180183161A1

公开(公告)日：2018-06-28

申请号：US15821861

申请日：2017-11-24

Applicant: FUJI ELECTRIC CO., LTD.

Inventor： Shin SOYANO

IPC: H01R12/58 ,  H05K1/14 ,  H01R4/70 ,  H01R43/20 ,  H01R43/18

CPC classification number: H01R12/585 ,  H01L23/49811 ,  H01L23/5383 ,  H01L25/072 ,  H01L25/115 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01R4/70 ,  H01R12/58 ,  H01R13/41 ,  H01R43/18 ,  H01R43/205 ,  H05K1/142 ,  H05K3/0014 ,  H05K3/28 ,  H05K3/4015 ,  H05K2201/09118 ,  H05K2201/10166 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/10522 ,  H05K2203/1327

Abstract: A semiconductor device is provided, in order to prevent tilt of a terminal pin in the semiconductor device with a printed board in which the terminal pin is pressed, the semiconductor device comprising a printed board, a plurality of pins pressed in the printed board, a resin block in which a plurality of through holes are formed, the plurality of pins respectively pressed in the plurality of through holes, and a resin case covering at least a part of the printed board and the resin block.

公开(公告)号：US20180160540A1

公开(公告)日：2018-06-07

申请号：US15575300

申请日：2016-04-20

Applicant: EPCOS AG

Inventor： Florian VELDEN ,  Guenter FEIST

IPC: H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H05K1/11

CPC classification number: H05K1/184 ,  H05K1/11 ,  H05K3/301 ,  H05K3/306 ,  H05K3/3447 ,  H05K2201/1003 ,  H05K2201/10424 ,  H05K2201/10568 ,  H05K2201/10878

Abstract: A device for orienting contact terminals on an electrical component such that they fit to a circuit board of an electric circuit is disclosed. In an embodiment the device includes a carrier element configured to receive the electrical component and a plurality of bending elements, wherein the carrier element has a plurality of holes, each hole penetrating the carrier element from an upper side to an underside, wherein a respective section of the bending elements is secured to the carrier element and a respective end of the bending elements projects into a respective hole of the carrier element, and wherein the bending elements are configured such that the respective end of the bending elements, upon insertion of a respective contact terminal of the electrical component into the respective hole from the upper side of the carrier element, is bent within the hole and clamps the respective contact terminal.

公开(公告)号：US20170202092A1

公开(公告)日：2017-07-13

申请号：US15326635

申请日：2014-08-12

Applicant: Advanced Bionics AG

Inventor： Lin Li ,  Jian Xie ,  Jeryle Walter

IPC: H05K3/32 ,  A61N1/375 ,  A61N1/36 ,  H05K1/09 ,  H05K1/11

CPC classification number: H05K3/328 ,  A61N1/36036 ,  A61N1/3754 ,  H05K1/09 ,  H05K1/115 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/10795 ,  H05K2201/10909 ,  H05K2201/10916 ,  H05K2203/0169 ,  H05K2203/0195 ,  Y10T29/49183

Abstract: Methods of connecting wires (126) to feedthrough pins (104) and apparatus including wires connected to feedthrough pins.

公开(公告)号：US20170187131A1

公开(公告)日：2017-06-29

申请号：US15458582

申请日：2017-03-14

Applicant: CONTINENTAL AUTOMOTIVE GMBH

Inventor： Michael Decker ,  Thomas Riepl ,  Holger Schlotter

IPC: H01R12/58 ,  H05K1/11

CPC classification number: H01R12/58 ,  H05K1/02 ,  H05K1/115 ,  H05K3/306 ,  H05K2201/0116 ,  H05K2201/0769 ,  H05K2201/10303 ,  H05K2201/10424

Abstract: An arrangement for an electronic device is disclosed. A plurality of electrically conductive pins is positioned in respective vias of the circuit carrier, the pins extend from a first face of the circuit carrier to a contact end in order to electrically contact one or more components. The arrangement is equipped with an electrically insulating layer on a circuit carrier face, which is the first or a second face, in the region of the pin, the insulating layer having a prefabricated element which is positioned on the face of the circuit carrier. A portion of each pin, the portion being arranged adjacently to the respective via on the face, is surrounded by the material of the insulating layer in a continuously lateral manner.