公开(公告)号：US20080095663A1

公开(公告)日：2008-04-24

申请号：US11552080

申请日：2006-10-23

Applicant: Achyut Kumar Dutta ,  Rabi Sengupta

Inventor： Achyut Kumar Dutta ,  Rabi Sengupta

IPC: G01N21/00

CPC classification number: G01N21/7703 ,  B82Y20/00 ,  G02B6/1225 ,  G02B2006/12138

Abstract: A sensing device able to do concurrent real time detection of different kinds of chemical, biomolecule agents, or biological cells and their respective concentrations using optical principles. The sensing system can be produced at a low cost (below $1.00) and in a small size (˜1 cm3). The novel sensing system may be of great value to many industries, for example, medical, forensics, and military. The fundamental principles of this novel invention may be implemented in many variations and combinations of techniques.

Abstract translation: 一种能够使用光学原理同时实时检测不同种类的化学，生物分子试剂或生物细胞及其各自浓度的感测装置。 感测系统可以以低成本（低于1.00美元）和小尺寸（〜1厘米3以上）生产。 新型传感系统可能对许多行业具有重要意义，例如医疗，法医，军事等。 这种新颖发明的基本原理可以以许多变化和技术的组合来实现。

公开(公告)号：US07271461B2

公开(公告)日：2007-09-18

申请号：US10906615

申请日：2005-02-26

Applicant: Achyut Kumar Dutta

Inventor： Achyut Kumar Dutta

IPC: H01L31/0232 ,  H01L29/18 ,  H01L33/00 ,  H01L27/15

CPC classification number: G02B6/12002 ,  G02B6/122 ,  G02B6/32 ,  G02B6/4214 ,  G02B6/4224 ,  G02B6/4257 ,  G02B6/4268 ,  G02B6/4279 ,  G02B6/428 ,  G02B6/43 ,  G02B2006/12147 ,  H01L24/17 ,  H01L24/48 ,  H01L24/49 ,  H01L25/167 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16238 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/183 ,  H05K1/0274 ,  H05K1/141 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/10121 ,  H05K2201/10515 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099

Abstract: An optoelectronics chip-to-chip interconnects system is provided, including packaged chips to be connected on printed-circuit-board (PCB), multiple-packaged chip, optical-electrical(O-E) conversion means, waveguide-board, and PCB. Single to multiple chips interconnects can be possible using this technique. The packaged-chip includes semiconductor-die and its package based on the ball-grid array or chip-scale-package. The O-E board includes the optoelectronics components and multiple electrical contacts. The waveguide board includes electrical conductors transferring signal from O-E board to PCB and the flex optical waveguide easily stackable onto the PCB, to guide optical signal from one chip-to-other chip. The chip-to-chip interconnects system is pin-free and compatible with the PCB. The main advantages are that standard packaged-chip and conventional PCB technology can be used for low speed electrical signal connection. Also, the part of the heat from the packaged chip can be transmitted to PCB through conductors, so that complex cooling system can be avoided.

Abstract translation: 提供了一种光电子芯片到芯片互连系统，包括要连接在印刷电路板（PCB）上的封装芯片，多封装芯片，光电（O-E）转换装置，波导板和PCB。 使用这种技术可以实现单芯片至多芯片互连。 封装芯片包括半导体芯片及其基于球栅阵列或芯片级封装的封装。 O-E板包括光电子元件和多个电触点。 波导板包括将信号从O-E板传递到PCB的电导体，并且柔性光波导容易地堆叠到PCB上，以引导来自一个芯片到另一个芯片的光信号。 芯片到芯片互连系统是无引脚的，与PCB兼容。 主要优点是标准的封装芯片和常规PCB技术可用于低速电信号连接。 此外，来自封装芯片的部分热量可以通过导体传输到PCB，从而可以避免复杂的冷却系统。

公开(公告)号：US10751259B1

公开(公告)日：2020-08-25

申请号：US16154702

申请日：2018-10-08

Applicant: Achyut Kumar Dutta ,  Sudeep Hiroshi Dutta

Inventor： Achyut Kumar Dutta ,  Sudeep Hiroshi Dutta

IPC: A61J7/04 ,  G16H20/10 ,  B65D51/24 ,  A61J1/03

Abstract: This invention relates to smart bottle system that informs the user through a display, the time and date that the contents are to be taken. More specifically, the smart bottle system provides an information to the user/patient, the time to take medication and inform the caregiver, physician, pharmacy personnel, or patient/users of missed doses, the profile, and/or the health condition of the patient/user. The bottle system may track the doses remaining in the bottle, and inform the caregiver or patient/user, or pharmacy personnel the time to get a refill of the medication. The system can able to compute the profile and/or health condition of the users, based on the medication intake, and/or missed, or users image, and can communicate with the persons located remotely by sending/receiving information.

公开(公告)号：US10290755B1

公开(公告)日：2019-05-14

申请号：US14315316

申请日：2014-06-25

Applicant: Achyut Kumar Dutta

Inventor： Achyut Kumar Dutta

IPC: H01L31/0352 ,  H01L31/068 ,  H01L51/44 ,  H01L31/18 ,  H01L31/072 ,  H01L31/07 ,  H01L31/0236 ,  H01G9/20 ,  H01L51/42 ,  H01L31/0735 ,  H01L31/073 ,  H01L31/0304 ,  H01L31/0296

Abstract: Novel structures of photovoltaic cells are provided. The cells are based on nanometer or micrometer-scaled wires, tubes, and/or rods, which are made of electronic materials covering semiconductors, insulators, and may be metallic in structure. These photovoltaic cells have large power generation capability per unit physical area over the conventional cells. These cells will have enormous applications such as in space, commercial, residential and industrial applications.

公开(公告)号：US09835797B1

公开(公告)日：2017-12-05

申请号：US15376560

申请日：2016-12-12

Applicant: Achyut Kumar Dutta

Inventor： Achyut Kumar Dutta

IPC: H01L25/16 ,  G02B6/12 ,  G02B6/42 ,  G02B6/32 ,  H05K1/14 ,  H05K1/02 ,  H01S5/183 ,  H01S5/022 ,  H01L23/00

CPC classification number: G02B6/12002 ,  G02B6/122 ,  G02B6/32 ,  G02B6/4214 ,  G02B6/4224 ,  G02B6/4257 ,  G02B6/4268 ,  G02B6/4279 ,  G02B6/428 ,  G02B6/43 ,  G02B2006/12147 ,  H01L24/17 ,  H01L24/48 ,  H01L24/49 ,  H01L25/167 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16238 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/183 ,  H05K1/0274 ,  H05K1/141 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/10121 ,  H05K2201/10515 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099

Abstract: An optoelectronics chip-to-chip interconnects system is provided, including at least one packaged chip to be connected on the printed-circuit-board with at least one other packaged chip, optical-electrical (O-E) conversion mean, waveguide-board, and (PCB). Single to multiple chips interconnects can be interconnected provided using the technique disclosed in this invention. The packaged chip includes semiconductor die and its package based on the ball-grid array or chip-scale-package. The O-E board includes the optoelectronics components and multiple electrical contacts on both sides of the O-E substrate. The waveguide board includes the electrical conductor transferring the signal from O-E board to PCB and the flex optical waveguide easily stackable onto the PCB to guide optical signal from one chip-to-other chip. Alternatively, the electrode can be directly connected to the PCB instead of including in the waveguide board. The chip-to-chip interconnections system is pin-free and compatible with the PCB. The main advantages of this invention are to use the packaged chip for interconnection and the conventional PCB technology can be used for low speed electrical signal connection. Also, the part of the heat from the packaged chip can be transmitted to the PCB through the conductors, so that complex cooling system can be avoided.

公开(公告)号：US09257406B2

公开(公告)日：2016-02-09

申请号：US14269117

申请日：2014-05-03

Applicant: Achyut Kumar Dutta

Inventor： Achyut Kumar Dutta

IPC: H05K1/11 ,  H01L23/00 ,  H01L23/473 ,  H01L23/522 ,  H01L23/532 ,  H01L21/768 ,  H01L21/3105 ,  H01L21/321

CPC classification number: H01L24/20 ,  H01L21/31055 ,  H01L21/3212 ,  H01L21/76802 ,  H01L21/7682 ,  H01L21/76877 ,  H01L23/473 ,  H01L23/5222 ,  H01L23/5226 ,  H01L23/53295 ,  H01L24/19 ,  H01L2924/0002 ,  H01L2924/1304 ,  H01L2924/14 ,  Y02P80/30 ,  H01L2924/00

Abstract: An electronics interconnection system is provided with reduced capacitance between a signal line and the surrounding dielectric material. By using a non-homogenous dielectric, the effective dielectric loss of the material is reduced. This reduction results in less power loss from the signal line to the dielectric material, which reduces the number of buffers needed on the signal line. This increases the speed of the signal, and reduces the power consumed by the interconnection system. The fabrication techniques provided are advantageous because they can be fabricated using today's standard IC fabrication techniques.

Abstract translation: 电子互连系统在信号线和周围的电介质材料之间具有减小的电容。 通过使用不均匀的电介质，材料的有效介电损耗降低。 这种减少导致从信号线到电介质材料的功率损耗更少，这减少了信号线上所需的缓冲器的数量。 这增加了信号的速度，并且减少了互连系统消耗的功率。 所提供的制造技术是有利的，因为它们可以使用当今的标准IC制造技术来制造。

公开(公告)号：US08823210B1

公开(公告)日：2014-09-02

申请号：US13151253

申请日：2011-06-01

Applicant: Robert Allen Olah ,  Achyut Kumar Dutta

Inventor： Robert Allen Olah ,  Achyut Kumar Dutta

IPC: H02J1/12

CPC classification number: H02J3/382 ,  G05F1/56 ,  H02J1/102 ,  H02J1/12 ,  H02J3/385 ,  H02J7/0042 ,  H02J7/0055 ,  H02J7/0068 ,  H02J7/35 ,  H02J2001/106 ,  H02M3/07 ,  Y10T307/511 ,  Y10T307/516

Abstract: An apparatus for perpetually harvesting ambient near ultraviolet to far infrared radiation to provide continual power regardless of the environment, incorporating a system for the harvesting electronics governing power management, storage control, and output regulation. The harvesting electronics address issues of efficiently matching the voltage and current characteristics of the different harvested energy levels, low power consumption, and matching the power output demand. The device seeks to harvest the largely overlooked blackbody radiation through use of a thermal harvester, providing a continuous source of power, coupled with a solar harvester to provide increased power output.

Abstract translation: 一种用于永久收集环境近紫外到远红外辐射的装置，以提供持续的功率，而不管环境如何，结合用于收集电子器件的系统来管理电力管理，存储控制和输出调节。 收获电子器件解决了有效匹配不同收获能级的电压和电流特性，低功耗以及匹配功率输出需求的问题。 该设备旨在通过使用热收割机来收获大部分被忽视的黑体辐射，提供连续的电力来源，并与太阳能收割机相结合，以提供更高的功率输出。

公开(公告)号：US08357960B1

公开(公告)日：2013-01-22

申请号：US12562127

申请日：2009-09-17

Applicant: Achyut Kumar Dutta

Inventor： Achyut Kumar Dutta

IPC: H01L33/00

CPC classification number: H01L27/14652 ,  B82Y20/00 ,  H01L27/14694 ,  H01L27/14696 ,  H01L31/035218 ,  H01L31/035227 ,  H01L31/035236 ,  H01L31/1013 ,  H01L31/105

Abstract: This invention relates to photodetector and its array in the form of a image sensor having multispectral detection capability covering the wavelengths from ultra-violet (UV) or near UV to shortwave infrared (over 1700 nm), ultra-violet (UV) or near UV to mid infrared (3500 nm), or ultra-violet (UV) or near UV to 5500 nm. More particularly, this invention is related to the multicolor detector, which can detect the light wavelengths ranges from as low as UV to the wavelengths over 1700 nm covering the most of the communication wavelength, and also from UV to as high as 5500 nm using of the single monolithic detector fabricated on the single wafer. This invention is also related to the multispectral photodetector arrays for multicolor imaging, sensing, and advanced communication. Our innovative approach utilizes surface incident type (either top- or bottom-illuminated type) photodiode structure having single absorption layer and consisting of more than micro-nano-scaled 3-dimensional (3-D) blocks which can provide broader spectral response than that of the absorption layer made from the same type of material having macro-scaled structure.

Abstract translation: 本发明涉及以具有多光谱检测能力的图像传感器形式的光电检测器及其阵列，其覆盖从紫外（UV）或近紫外到近红外（超过1700nm），紫外（UV）或近紫外 到中红外（3500nm）或紫外线（UV）或接近UV至5500nm。 更具体地说，本发明涉及多色检测器，该检测器可以检测从UV到透明波长超过1700nm的波长范围，覆盖通信波长的大部分，以及从UV到高达5500nm的光波长范围，使用 在单个晶片上制造的单个单片检测器。 本发明还涉及用于多色成像，感测和高级通信的多光谱光电探测器阵列。 我们的创新方法利用具有单一吸收层的表面入射型（顶部或底部照明型）光电二极管结构，并由超过微纳米级3维（3-D）块组成，可提供比该光谱响应更宽的光谱响应 由具有宏观结构的相同类型的材料制成的吸收层。

公开(公告)号：US07851811B2

公开(公告)日：2010-12-14

申请号：US11830863

申请日：2007-07-31

Applicant: Achyut Kumar Dutta

Inventor： Achyut Kumar Dutta

IPC: H01L27/15 ,  H01L29/22

CPC classification number: G02B6/12002 ,  G02B6/122 ,  G02B6/32 ,  G02B6/4214 ,  G02B6/4224 ,  G02B6/4257 ,  G02B6/4268 ,  G02B6/4279 ,  G02B6/428 ,  G02B6/43 ,  G02B2006/12147 ,  H01L24/17 ,  H01L24/48 ,  H01L24/49 ,  H01L25/167 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16238 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/183 ,  H05K1/0274 ,  H05K1/141 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/10121 ,  H05K2201/10515 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099

Abstract: An optoelectronics chip-to-chip interconnects system is provided, including at least one packaged chip to be connected on the printed-circuit-board with at least one other packaged chip, optical-electrical (O-E) conversion mean, waveguide-board, and (PCB). Single to multiple chips interconnects can be interconnected provided using the technique disclosed in this invention. The packaged chip includes semiconductor die and its package based on the ball-grid array or chip-scale-package. The O-E board includes the optoelectronics components and multiple electrical contacts on both sides of the O-E substrate. The waveguide board includes the electrical conductor transferring the signal from O-E board to PCB and the flex optical waveguide easily stackable onto the PCB to guide optical signal from one chip-to-other chip. Alternatively, the electrode can be directly connected to the PCB instead of including in the waveguide board. The chip-to-chip interconnections system is pin-free and compatible with the PCB. The main advantages of this invention are to use the packaged chip for interconnection and the conventional PCB technology can be used for low speed electrical signal connection. Also, the part of the heat from the packaged chip can be transmitted to the PCB through the conductors, so that complex cooling system can be avoided.

公开(公告)号：US07755445B2

公开(公告)日：2010-07-13

申请号：US11161353

申请日：2005-07-30

Applicant: Achyut Kumar Dutta ,  Robert Olah

Inventor： Achyut Kumar Dutta ,  Robert Olah

IPC: H01P3/08

CPC classification number: H01P3/087 ,  H01L2223/6627 ,  H01L2924/19032 ,  H01P3/084 ,  H01P11/003 ,  H05K1/024 ,  H05K1/0306 ,  H05K1/0313 ,  H05K3/386 ,  H05K3/4611 ,  H05K3/4614 ,  H05K3/4697

Abstract: High speed printed circuit boards (PCBs) are disclosed comprising a dielectrics systems with the back-side trenches, prepregs, signal lines and ground-plans, wherein the signal line and ground-plan are located on the dielectrics. Using of the open trenches in the substrate help to reduce the microwave loss and dielectric constant and thus increasing the signal carrying speed of the interconnects. Thus, according to the present invention, it is possible to provide a simple high speed PCB using the conventional material and conventional PCB manufacturing which facilitates the design of circuits with controlled bandwidth based on the trench opening in the dielectrics, and affords excellent reliability. According to this present invention, high speed PCB with the interconnect system contains whole portion or portion of interconnects for high speed chips interconnects and that have have the dielectric system with opened trench or slot to reduce the microwave loss.

Abstract translation: 公开了高速印刷电路板（PCB），其包括具有背面沟槽，预浸料，信号线和地面平面图的电介质系统，其中信号线和平面图位于电介质上。 使用衬底中的开放沟槽有助于减少微波损耗和介电常数，从而增加互连的信号承载速度。 因此，根据本发明，可以使用传统的材料和传统的PCB制造提供简单的高速PCB，这有助于基于电介质中的沟槽开口的具有受控带宽的电路的设计，并提供优异的可靠性。 根据本发明，具有互连系统的高速PCB包含用于高速芯片互连的全部或互连部分，并且具有开放的沟槽或槽的电介质系统以减少微波损耗。