Electronic component mounting structure

    公开(公告)号:US11950366B2

    公开(公告)日:2024-04-02

    申请号:US17635968

    申请日:2020-09-03

    CPC classification number: H05K1/181 H05K1/112 H05K2201/10515

    Abstract: An electronic component mounting structure is an electronic component mounting structure in which an electronic component group is mounted on a substrate, and a pattern constituting a part of a current path between the inflow port and the outflow port, the electronic component group includes a plurality of electronic components connected between the inflow port and the outflow port, each of the electronic components has a current inflow terminal electrically connected to the inflow port and a current outflow terminal electrically connected to the outflow port, and one of a first spatial distance group and a second spatial distance group has equal spatial distances within the one spatial distance group, and the first spatial distance group includes spatial distances between the inflow port and the inflow terminals, and the second spatial distance group includes spatial distances between the outflow port and the outflow terminals.

    Electronic component
    6.
    发明授权

    公开(公告)号:US11844178B2

    公开(公告)日:2023-12-12

    申请号:US17325080

    申请日:2021-05-19

    Abstract: An electronic device and a method of forming such an electronic device are disclosed. The electronic device can include an integrated device package and a component. The integrated device package includes a substrate and a package body over the substrate, and a hole formed through the package body to expose a conductive pad of the substrate. The component is mounted over the package body, and includes a component body and a lead extending from the component body through the hole. The lead includes an insulated portion and a distal exposed portion, and the insulated portion includes a conductor and an insulating layer disposed about the conductor, wherein the distal exposed portion is uncovered by the insulating layer such that the conductor is exposed at the distal portion. The electronic device can also include a conductive material that electrically connects the distal exposed portion to the conductive pad of the substrate.

    SLIDER-BASED HBA INTERNAL LOCK
    7.
    发明公开

    公开(公告)号:US20230389182A1

    公开(公告)日:2023-11-30

    申请号:US17752634

    申请日:2022-05-24

    Abstract: One aspect provides an apparatus for locking circuit boards in position between a pair of guide rails. The apparatus can include a slider attached to a sidewall of one guide rail. The slider is allowed to slide along the guide rail within a predetermined range and one or more plunger-and-spring assemblies. A respective plunger-and-spring assembly comprises a plunger and a spring surrounding the plunger, and the plunger is inserted into a through-hole on the sidewall of the guide rail such that a first end of the plunger can be aligned with a notch on a corresponding circuit board and a second end of the plunger is in contact with the slider. Sliding of the slider causes the spring to compress and decompress and the first end of the plunger to move in and out of the notch on the circuit board, thereby facilitating locking and unlocking of the circuit board.

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