公开(公告)号：US20210280755A1

公开(公告)日：2021-09-09

申请号：US16809506

申请日：2020-03-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying HO ,  Hsun-Wei CHAN ,  Shih-Chieh TANG ,  Lu-Ming LAI

IPC: H01L33/58 ,  G02B3/00

Abstract: A semiconductor device package includes a light-emitting device, a diffuser structure, a first optical sensor, and a second optical sensor. The light-emitting device has a light-emitting surface. The diffuser structure is above the light-emitting surface of the light-emitting device. The first optical sensor is disposed below the diffuser structure, and the first optical sensor is configured to detect a first reflected light reflected by the diffuser structure. The second optical sensor is disposed below the diffuser structure, and the second optical sensor is configured to detect a second reflected light reflected by the diffuser structure.

公开(公告)号：US20210183839A1

公开(公告)日：2021-06-17

申请号：US17187539

申请日：2021-02-26

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying HO ,  Ying-Chung CHEN ,  Lu-Ming LAI

IPC: H01L25/16 ,  F21V8/00 ,  G02B6/42 ,  H01L31/0232 ,  H01L27/15 ,  H01L25/00 ,  H01L27/146 ,  H01L31/12 ,  H01L31/0203 ,  H01L33/48 ,  H01S5/02253 ,  H01S5/02325 ,  H01S5/02326

Abstract: An optical module includes a carrier, a light emitter disposed on the carrier, a light detector disposed on the carrier, and a housing disposed on the carrier. The housing defines a first opening that exposes the light emitter and a second opening that exposes the light detector. The optical module further includes a first light transmission element disposed on the first opening and a second light transmission element disposed on the second opening. A first opaque layer is disposed on the first light transmission element, the first opaque layer defining a first aperture, and a second opaque layer disposed on the second light transmission element, the second opaque layer defining a second aperture.

公开(公告)号：US20190386187A1

公开(公告)日：2019-12-19

申请号：US16011555

申请日：2018-06-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Yi WU ,  Ying-Chung CHEN ,  Hsin-Ying HO

IPC: H01L33/56 ,  H01L33/62 ,  H01L31/0203 ,  H01L31/02

Abstract: An optical package device comprises a carrier, a die, a support element, and an encapsulant. The die is on the carrier. The support element is on the carrier and adjacent to the die. The encapsulant covers the die and the support element. The encapsulant has a first top surface over the die and a second top surface adjacent to the first top surface. A ratio of a distance between the first top surface and the second top surface of the encapsulant to a distance between the die and the first top surface of the encapsulant is less than 0.1.

公开(公告)号：US20190202686A1

公开(公告)日：2019-07-04

申请号：US16212609

申请日：2018-12-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng TSENG ,  Lu-Ming LAI ,  Shih-Chieh TANG ,  Hsin-Ying HO ,  Hsun-Wei CHAN

IPC: B81B7/02 ,  H01L33/60

Abstract: A semiconductor device package is provided, which includes a carrier, a first reflective element, a second reflective element, a first optical component, a second optical component and a microelectromechanical system (MEMS) device. The carrier has a first surface. The first reflective element is disposed on the first surface of the carrier. The second reflective element disposed on the first surface of the carrier. The first optical component is disposed on the first reflective element. The second optical component is disposed on the second reflective element. The MEMS device is disposed on the first surface of the carrier to provide light beams to the first reflective element and the second reflective element. The light beams provided to the first reflective element are reflected to the first optical component and the light beams provided to the second reflective element are reflected to the second optical component.

公开(公告)号：US20190181311A1

公开(公告)日：2019-06-13

申请号：US16198511

申请日：2018-11-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying HO ,  Hsun-Wei CHAN

IPC: H01L33/58 ,  H01L33/52 ,  H01L33/60

Abstract: A semiconductor device package is provided, which includes a carrier, an emitter and a first transparent encapsulant. The carrier has a first surface. The emitter is disposed on the first surface. The first transparent encapsulant encapsulates the emitter. The first transparent encapsulant includes a body and a lens portion. The body has a first planar surface. The lens portion is disposed on the body and has a first planar surface. The first planar surface of the lens portion is substantially coplanar with the first planar surface of the body.

公开(公告)号：US20190115505A1

公开(公告)日：2019-04-18

申请号：US16132206

申请日：2018-09-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang Chin TSAI ,  Chun-Han CHEN ,  Hsin-Ying HO

IPC: H01L33/48 ,  H01S5/022 ,  H01S5/40 ,  H01L33/62 ,  H01L33/56

Abstract: A semiconductor package includes a first substrate having a first surface, a second substrate on the first surface of the first substrate, the second substrate having a first surface and a second surface adjacent to the first surface, and the first surface of the second substrate being disposed on the first surface of the first substrate, and a light source on the second surface of the second substrate. A method for manufacturing the semiconductor device package is also provided.

公开(公告)号：US20180190629A1

公开(公告)日：2018-07-05

申请号：US15396079

申请日：2016-12-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chung-Wei HSU ,  Hsin-Ying HO ,  Hsun-Wei CHAN

IPC: H01L25/16 ,  H01L31/14 ,  H01L31/0216 ,  H01L33/62 ,  H01L31/02

Abstract: An electronic device comprises a carrier, an emitter, a detector, a separation wall and a light shielding layer. The emitter is disposed on a first portion of the top surface of the carrier. The detector is disposed on a second portion of the top surface of the carrier. The separation wall is disposed on the top surface of the carrier between the emitter and the detector. The light shielding layer disposed adjacent to the top surface of the carrier and extends from the separation wall to the second portion of the carrier.