公开(公告)号：US20240038677A1

公开(公告)日：2024-02-01

申请号：US17877795

申请日：2022-07-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ying-Chung CHEN ,  Lu-Ming LAI

IPC: H01L23/552 ,  H01L25/16 ,  H01L23/498

CPC classification number: H01L23/552 ,  H01L25/167 ,  H01L23/49861 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/16

Abstract: A semiconductor device package and a method of manufacturing a semiconductor device package are provided. The semiconductor device package includes a carrier, a protective element, and a sensor device. The protective element encapsulates the carrier. The sensor device is embedded in the carrier and the protective element. The sensor device includes a sensing portion and a protective portion adjacent to the sensing portion, and the protective portion of the sensor device has a first surface exposed from the protective element and the carrier.

公开(公告)号：US20210257988A1

公开(公告)日：2021-08-19

申请号：US16794112

申请日：2020-02-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng TSENG ,  Lu-Ming LAI ,  Ching-Han HUANG ,  Kuo-Hua LAI ,  Hui-Chung LIU

IPC: H03H9/24 ,  H03H3/007 ,  H03H9/05 ,  H03H9/08 ,  H03H9/10

Abstract: The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.

公开(公告)号：US20210147219A1

公开(公告)日：2021-05-20

申请号：US16685902

申请日：2019-11-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Wei LIU ,  Huei-Siang WONG ,  Lu-Ming LAI

IPC: B81B7/00 ,  B81C1/00

Abstract: A semiconductor package structure includes an electronic device having a first surface and an exposed region adjacent to the first surface; a dam disposed on the first surface and surrounding the exposed region of the electronic device; and a filter structure disposed on the dam.

公开(公告)号：US20210134857A1

公开(公告)日：2021-05-06

申请号：US16670836

申请日：2019-10-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shih-Chieh TANG ,  Lu-Ming LAI ,  Chia Yun HSU

IPC: H01L27/146

Abstract: An optical package includes a substrate, an image sensor, a microlens, an optical filter layer, a constraining layer, and a buffer layer. The image sensor is disposed on the substrate. The microlens having a first Young's modulus is disposed on the image sensor. The optical filter layer having a second Young's modulus disposed on the microlens. The constraining layer is disposed between the optical filter layer and the microlens. The buffer layer having a third Young's modulus disposed on the constraining layer. The third Young's modulus is greater than the first Young's modulus and smaller than the second Young's modulus.

公开(公告)号：US20200020827A1

公开(公告)日：2020-01-16

申请号：US16505331

申请日：2019-07-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying HO ,  Ying-Chung CHEN ,  Lu-Ming LAI

IPC: H01L33/08 ,  H01L33/10 ,  H01L33/26

Abstract: An optical device includes a substrate, an electronic component, a lid and a barrier. The electronic component is disposed on the substrate. The electronic component has an active surface faces away from the substrate. The lid is disposed on the substrate. The lid has a wall structure extending toward the active surface of electronic component and is spaced apart from the active surface of the electronic component. The barrier is disposed on the active surface of the electronic component and is spaced apart from the wall structure of the lid.

公开(公告)号：US20180017741A1

公开(公告)日：2018-01-18

申请号：US15643458

申请日：2017-07-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying HO ,  Ying-Chung CHEN ,  Lu-Ming LAI

IPC: G02B6/42 ,  H01L33/48 ,  H01L25/16 ,  H01L31/0203 ,  B29C43/36 ,  H01S5/022 ,  B29C33/00 ,  B29C35/08

CPC classification number: H01L25/167 ,  G02B6/0018 ,  G02B6/002 ,  G02B6/0025 ,  G02B6/0028 ,  G02B6/0031 ,  G02B6/0036 ,  G02B6/0045 ,  G02B6/0051 ,  G02B6/0055 ,  G02B6/0065 ,  G02B6/0073 ,  G02B6/0076 ,  G02B6/0091 ,  G02B6/0096 ,  G02B6/4206 ,  G02B6/4212 ,  G02B6/4257 ,  H01L23/142 ,  H01L23/145 ,  H01L23/15 ,  H01L25/165 ,  H01L25/50 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/15 ,  H01L31/02327 ,  H01L33/58 ,  H01L2924/12042 ,  H01L2924/16151 ,  H01L2924/16196 ,  H01L2924/16251 ,  H01L2933/0058 ,  H01S5/02248 ,  H01S5/02252 ,  H01S5/02288 ,  H05K1/03

Abstract: An optical module includes a carrier, a light emitter disposed on the carrier, a light detector disposed on the carrier, and a housing disposed on the carrier. The housing defines a first opening that exposes the light emitter and a second opening that exposes the light detector. The optical module further includes a first light transmission element disposed on the first opening and a second light transmission element disposed on the second opening. A first opaque layer is disposed on the first light transmission element, the first opaque layer defining a first aperture, and a second opaque layer disposed on the second light transmission element, the second opaque layer defining a second aperture.

公开(公告)号：US20170141257A1

公开(公告)日：2017-05-18

申请号：US14941069

申请日：2015-11-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Hsuan TSAI ,  Lu-Ming LAI

IPC: H01L31/173 ,  H01L33/58 ,  H01L33/48 ,  H01L31/18

CPC classification number: H01L31/173 ,  H01L25/167

Abstract: An optical device includes a substrate, a light emitter, a light detector, a conductive structure, and an opaque material. The light emitter, the light detector and the conductive structure are disposed on a surface of the substrate and are electrically connected to traces on the surface of the substrate. The light emitter includes an emitting area facing the substrate. The light detector includes a receiving area facing the substrate. The light emitter emits light within a range of wavelengths, and the substrate passes the light emitted by the light emitter. The opaque material is disposed on the substrate, and absorbs or attenuates the light within the range of wavelengths.

公开(公告)号：US20170138566A1

公开(公告)日：2017-05-18

申请号：US14939331

申请日：2015-11-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying HO ,  Hsun-Wei CHAN ,  Lu-Ming LAI ,  Shih-Chieh TANG

IPC: F21V7/04 ,  F21V7/22 ,  F21V23/00

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L33/46 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: In an aspect, an optical device includes a substrate, a light source mounted on a top surface of the substrate, and a lid attached to the top surface of the substrate, the lid defining a reflective cup positioned over the light source. In another aspect, an optical device includes a substrate, a light source disposed on the substrate, and a lid disposed on the substrate. The lid defines a reflective cup for concentrating and passing light from the light source. The optical device further includes a film formed on an inner sidewall of the reflective cup for reflecting the light from the light source. The film includes a primer layer, a reflecting layer and a protective layer.

公开(公告)号：US20250048760A1

公开(公告)日：2025-02-06

申请号：US18230579

申请日：2023-08-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying HO ,  Lu-Ming LAI ,  Shih-Chieh TANG

IPC: H01L27/146

Abstract: An electronic device includes an encapsulant, an optical emitter, and an optical sensor. The optical sensor is encapsulated by the encapsulant. The optical emitter is supported by the encapsulant.

公开(公告)号：US20220115425A1

公开(公告)日：2022-04-14

申请号：US17066412

申请日：2020-10-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Ling HUANG ,  Lu-Ming LAI ,  Ying-Chung CHEN

IPC: H01L27/146

Abstract: An optical package structure and a method for manufacturing an optical package structure are provided. The optical package structure includes a sensor, an optical component and a fixing element. The optical component directly contacts the sensor. An interfacial area is defined by a contacting region of the optical component and the sensor. The fixing element is disposed outside of the interfacial area for bonding the optical component and the sensor.