Abstract:
A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.
Abstract:
Methods of forming anodic oxide coatings on high strength aluminum alloys are described. Methods involve preventing or reducing the formation of interface-weakening species, such as zinc-sulfur compounds, at an interface between an anodic oxide coating and underlying aluminum alloy substrate during anodizing. In some embodiments, a micro-alloying element is added in very small amounts to an aluminum alloy substrate to prevent enrichment of zinc at the anodic oxide and substrate interface, thereby reducing or preventing formation of the zinc-sulfur interface-weakening species. In some embodiments, a sulfur-scavenging species is added to an aluminum alloy substrate to prevent sulfur from a sulfuric acid anodizing bath from binding with zinc and forming the zinc-sulfur interface-weakening species at the anodic oxide and substrate interface. In some embodiments, a micro-alloying element and a sulfur-scavenging species are added to an aluminum alloy substrate. Resultant anodic oxide coatings have minimal or no discoloration.
Abstract:
7000 series aluminum alloys containing copper are provided. The aluminum alloys have high yield strength, and in some aspects allow press quenchability and/or have extrusion speeds more rapid than conventional 7000 series Al alloys.