公开(公告)号：US20230063331A1

公开(公告)日：2023-03-02

申请号：US17676668

申请日：2022-02-21

Applicant: Apple Inc.

Inventor： Ilya Granovsky ,  Doron Rajwan ,  Tal Kuzi ,  Nir Leshem ,  Lior Zimet

IPC: G06F1/324 ,  G06F1/3206

Abstract: Various techniques and circuit implementations for power reduction management in integrated circuits are disclosed. Certain techniques include the implementation of rate control circuits to control a clock rate for circuits associated with a communication fabric in an integrated circuit. The clock rate may be reduced based trigger signals received from power delivery trigger circuits coupled to the integrated circuit and voltage regulators providing power to the integrated circuit. Additional techniques may include the use of rate limiter circuits in a memory pipeline.

公开(公告)号：US20230031415A1

公开(公告)日：2023-02-02

申请号：US17387376

申请日：2021-07-28

Applicant: Apple Inc.

Inventor： Doron Rajwan ,  Tal Kuzi ,  Keith Cox ,  Yizhang Yang

IPC: G06F1/20 ,  G06F1/08 ,  G06F11/30

Abstract: A temperature control apparatus is disclosed. An integrated circuit (IC) includes a plurality of temperature sensors, a first thermal control loop, and a second thermal control loop. The first thermal control loop is configured to control temperature of the IC by reducing a frequency of a clock signal provided to the IC in response to a temperature at one of the plurality of temperature sensors reaching a first temperature threshold. The second thermal control loop is configured to control temperature of the IC by dithering the clock signal provided to the IC in response to a temperature at one of the plurality of temperature sensors reaching a second temperature threshold that is greater than the first temperature threshold.