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    Electronic Device Having a Composite Structure
    27.
    发明申请
    Electronic Device Having a Composite Structure 审中-公开

    公开(公告)号：US20200007670A1

    公开(公告)日：2020-01-02

    申请号：US16569525

    申请日：2019-09-12

    Applicant: Apple Inc.

    Inventor： Abhijeet Misra ,  Steven J. Osborne ,  Ian A. Spraggs ,  Marwan Rammah ,  William A. Counts

    IPC: H04M1/18

    Abstract: Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.

    Electronic Device Having a Composite Structure
    28.
    发明申请
    Electronic Device Having a Composite Structure 审中-公开

    公开(公告)号：US20180084653A1

    公开(公告)日：2018-03-22

    申请号：US15606920

    申请日：2017-05-26

    Applicant: Apple Inc.

    Inventor： Abhijeet Misra ,  Steven J. Osborne ,  Ian A. Spraggs ,  Marwan Rammah ,  William A. Counts

    IPC: H05K5/00 ,  H05K5/04

    CPC classification number: H04M1/185 ,  G06F1/1626 ,  G06F1/163 ,  G06F1/1656 ,  H04M1/0249 ,  H04M1/026 ,  H04M1/0283

    Abstract: Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.

    PROCESS TO MITIGATE GRAIN TEXTURE DIFFERENTIAL GROWTH RATES IN MIRROR-FINISH ANODIZED ALUMINUM
    30.
    发明申请
    PROCESS TO MITIGATE GRAIN TEXTURE DIFFERENTIAL GROWTH RATES IN MIRROR-FINISH ANODIZED ALUMINUM 审中-公开
    减少米色阳极氧化铝颗粒纹理差异生长速度的方法

    公开(公告)号：US20160289858A1

    公开(公告)日：2016-10-06

    申请号：US14678868

    申请日：2015-04-03

    Applicant: Apple Inc.

    Inventor： James A. Curran ,  William A. Counts ,  Sean R. Novak

    IPC: C25D11/10 ,  C25D11/08 ,  C25D11/16

    CPC classification number: C25D11/10 ,  C25D11/08 ,  C25D11/16 ,  C25D11/18 ,  H05K5/02

    Abstract: Anodizing processes for providing durable and defect-free anodic oxide films, well suited for anodizing highly reflective surfaces, are described. In some embodiments, the anodizing electrolyte has a sulfuric acid concentration substantially less than conventional type II anodizing. In some embodiments, the electrolyte includes a mixture of sulfuric acid and one or more organic acids. In further embodiments, sulfuric acid is a relatively minor additive to an organic acid, primarily serving to minimize discoloration. The processes enables porous, optically clear, and colorless anodic films to be grown in a manner similar to conventional Type II sulfuric acid anodizing, but at lower current densities and/or higher temperatures, without compromising film surface hardness. The thickness uniformity of the resulting anodic oxide films can be within 5% between grains of {111}, {110} and {100} surface orientations. Furthermore, the anodic oxide films have minimal incorporated sulfates, thereby avoiding certain cosmetic and structural defects.

    Abstract translation: 描述了用于提供耐用且无缺陷的阳极氧化膜的阳极氧化工艺，非常适用于阳极氧化高反射表面。 在一些实施方案中，阳极氧化电解质的硫酸浓度基本上低于常规II型阳极氧化。 在一些实施方案中，电解质包括硫酸和一种或多种有机酸的混合物。 在另外的实施方案中，硫酸是有机酸的相对较小的添加剂，主要用于使变色最小化。 这些方法使多孔，光学透明和无色的阳极膜以类似于常规II型硫酸阳极氧化的方式生长，但是在较低的电流密度和/或更高的温度下生长，而不损害膜的表面硬度。 所得阳极氧化膜的厚度均匀度可以在{111}，{110}和{100}表面取向的晶粒之间的5％以内。 此外，阳极氧化膜具有最小的引入的硫酸盐，从而避免了某些化妆品和结构缺陷。

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