DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE

    公开(公告)号:US20210173137A1

    公开(公告)日:2021-06-10

    申请号:US17264027

    申请日:2020-05-25

    Abstract: A display panel and a manufacturing method thereof, and a display device. The display panel includes a light guide plate, an array substrate, a liquid crystal layer between the light guide plate and the array substrate, a plurality of light-extracting gratings located on one side of a light exit surface of the light guide plate, and a transparent protection layer between a film layer where the light-extracting gratings are located and the light guide plate. The light guide plate includes a plurality of light-extracting port areas, and transparent areas besides the light-extracting port areas; each light-extracting port area is provided with one light-extracting grating; the protection layer is at least provided on the transparent areas, and the protection layer is configured to prevent the light guide plate in the transparent areas from being excessively etched to form a plurality of depressions.

    Display Back Plate and Display Device
    28.
    发明公开

    公开(公告)号:US20240347543A1

    公开(公告)日:2024-10-17

    申请号:US18027131

    申请日:2022-04-29

    CPC classification number: H01L27/124 H01L25/167 H01L27/1248

    Abstract: A display back plate and a display device are provided. The display back plate includes multiple display units on a base substrate, at least one display unit includes a pixel region for displaying image and a light transmissive region allowing light to transmit; the pixel region includes a first trace layer and a second trace layer disposed in different layers along a thickness direction of the base substrate; and the pixel region further includes a first dielectric layer and a second dielectric layer between the first trace layer and the second trace layer, a ratio of a thickness of the first trace layer to that of the second trace layer is greater than 5; a sum of a thickness of the first dielectric layer and a thickness of the second dielectric layer is greater than 3 μm, and the thickness of the first dielectric layer is less than 2 μm.

    ULTRASONIC TRANSDUCER, FABRICATION METHOD THEREOF AND ELECTRONIC DEVICE

    公开(公告)号:US20240267680A1

    公开(公告)日:2024-08-08

    申请号:US18021544

    申请日:2022-05-27

    CPC classification number: H04R7/10 H04R31/003

    Abstract: Provides are an ultrasonic transducer, a fabrication method thereof and an electronic device. The ultrasonic transducer includes: an array substrate having a groove, a bottom electrode and an insulation layer, wherein an orthographic projection of the groove on the array substrate is within an orthographic projection of the bottom electrode on the array substrate, and the insulation layer covers the bottom electrode; and an opposite substrate, the opposite substrate and the array substrate are oppositely arranged and are attached to each other, the opposite substrate and the array substrate form a cavity in the groove, the opposite substrate has a top electrode and a vibrating diaphragm layer which are arranged in stack, and an orthographic projection of the top electrode on the array substrate is within the orthographic projection of the bottom electrode on the array substrate.

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